"INTEL" "24-PIN" CERAMIC DIP Search Results

"INTEL" "24-PIN" CERAMIC DIP Result Highlights (5)

Part	Manufacturer	Description
DE6B3KJ151KA4BE01J	Murata Manufacturing Co Ltd	Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive
DE6B3KJ471KB4BE01J	Murata Manufacturing Co Ltd	Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive
DE6E3KJ152MN4A	Murata Manufacturing Co Ltd	Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive
DE6B3KJ101KA4BE01J	Murata Manufacturing Co Ltd	Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive
DE6B3KJ331KB4BE01J	Murata Manufacturing Co Ltd	Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive

"INTEL" "24-PIN" CERAMIC DIP Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
intel 8255A Abstract: ic base for 40 pin DIP ic ic 8255A 8255A ic details 8255a interface PA6 equivalent 15g471k 82C55A cerdip 28- brazed ceramic IA8255-PDW40C Text: Page 1 of 4 IA8255 Advanced Information Sheet Programmable Peripheral Interface Adapter FEATURES • • • • • • Form, Fit, and Function Compatible with the Intel 8255A and Harris 82C55A Packaging options available: 40 Pin Plastic DIP or 44 Pin Plastic Leaded	Original	IA8255 82C55A IA8255 intel 8255A ic base for 40 pin DIP ic ic 8255A 8255A ic details 8255a interface PA6 equivalent 15g471k 82C55A cerdip 28- brazed ceramic IA8255-PDW40C	PDF
Intel 8237A Abstract: CSN-11 40 pin plcc ic base ic base for 40 pin DIP ic 82C37A A8237 IA8237 IA8237-PDW40C IA8237-PDW40I IA8237-PLC44C Text: Page 1 of 4 IA8237 Programmable DMA Controller Advanced Information Sheet FEATURES • • • • • Form, Fit, and Function Compatible with the Intel 8237A and Harris 82C37A Packaging options available: 40 Pin Plastic Dip or 44 Pin Plastic Leaded	Original	IA8237 82C37A IA8237 Intel 8237A CSN-11 40 pin plcc ic base ic base for 40 pin DIP ic 82C37A A8237 IA8237-PDW40C IA8237-PDW40I IA8237-PLC44C	PDF
8251A Abstract: intel 8251a PSL 26 IA8251 IA8251-PDW28C IA8251-PDW28I IA8251-PLC28C IA8251-PLC28I 20 pin plcc ic base 64 CERAMIC LEADLESS CHIP CARRIER LCC Text: Page 1 of 4 IA8251 Advanced Information Sheet Programmable Communication Interface FEATURES • • • • • • • Form, Fit, and Function Compatible with the Intel 8251A Packaging options available: 28 Pin Plastic Dip or 28 Pin Plastic Leaded Chip Carrier	Original	IA8251 IA8251 8251A intel 8251a PSL 26 IA8251-PDW28C IA8251-PDW28I IA8251-PLC28C IA8251-PLC28I 20 pin plcc ic base 64 CERAMIC LEADLESS CHIP CARRIER LCC	PDF
Intel 1702 eprom Abstract: 231369 INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE Side Brazed Ceramic Dual-In-Line Packages PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC PIN GRID ARRAY CPGA lead frame 325 Intel 2164 Side Brazed Ceramic Dual-In-Line Packages 28 Text: 2 2 Package/Module/PC Card Outlines and Dimensions 1/20/97 6:33 PM CH02LINK.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 2 PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS Intel Product Identification Codes 231369-1 2-1 1/20/97 6:33 PM CH02LINK.DOC	Original	CH02LINK Intel 1702 eprom 231369 INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE Side Brazed Ceramic Dual-In-Line Packages PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC PIN GRID ARRAY CPGA lead frame 325 Intel 2164 Side Brazed Ceramic Dual-In-Line Packages 28	PDF
intel packaging Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays Text: 2 1 Introduction 1/20/97 6:22 PM CH01WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 1 INTRODUCTION 1.1. OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power.Today’s products can feature more than	Original	CH01WIP intel packaging CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays	PDF
intel PLCC packaging draw Abstract: No abstract text available Text: Page 1 of 12 IA82510 ASYNCHRONOUS SERIAL CONTROLLER Data Sheet FEATURES • Form, Fit, and Function Compatible with the Intel 82510 • Packaging options available: 28 Pin Plastic or Ceramic DIP, 28 Pin Plastic Leaded Chip Carrier, 28 Pin Ceramic Leadless Chip Carrier	Original	IA82510 intel PLCC packaging draw	PDF
CERAMIC CHIP CARRIER LCC 68 socket Abstract: INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE LCCs 68 socket ic 7912 64 ceramic quad flatpack CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PCB footprint cqfp 132 Single Edge Contact (S.E.C.) Cartridge: 7912 pin configuration Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than seven million transistors and device count is expected to increase to 100 million by the year 2000. With a	Original		PDF
TSOP 56 socket Abstract: 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER ic packages QFP 64 Cavity dip QFP 64 Cavity package INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE 80SM 50 mil pitch ceramic package 240817 Text: CHAPTER 1 INTRODUCTION OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex electronics designers are challenged to fully harness their computing power Today’s products can feature more than three million transistors and device count is expected to increase to one hundred million by the	Original	68-Pin iMC00XFLKA iNC110XX TSOP 56 socket 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER ic packages QFP 64 Cavity dip QFP 64 Cavity package INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE 80SM 50 mil pitch ceramic package 240817	PDF
P82510 Abstract: n82510 8250 uart intel intel 8250 UART P8251 8250 ic pin intel 82510 tp82510 IA82510 IA82510-PDW28I-01 Text: IA82510 ASYNCHRONOUS SERIAL CONTROLLER Data Sheet As of Production Ver. 01 FEATURES • Form, Fit, and Function Compatible with the Intel 82510 • Packaging options available: 28 Pin Plastic or Ceramic DIP, 28 Pin Plastic Leaded Chip Carrier, 28 Pin Ceramic Leadless Chip Carrier	Original	IA82510 IA82510 ENG211001219-01 P82510 n82510 8250 uart intel intel 8250 UART P8251 8250 ic pin intel 82510 tp82510 IA82510-PDW28I-01	PDF
P82510 Abstract: n82510 8250 uart intel 8250 intel uart intel 8250 UART 8250a uart intel TN82510 82510 uart 8250A uart 82510 loopback Text: IA82510 ASYNCHRONOUS SERIAL CONTROLLER Data Sheet As of Production Ver. 01 FEATURES • Form, Fit, and Function Compatible with the Intel 82510 • Packaging options available: 28 Pin Plastic or Ceramic DIP, 28 Pin Plastic Leaded Chip Carrier, 28 Pin Ceramic Leadless Chip Carrier	Original	IA82510 IA82510 ENG211001219-01 P82510 n82510 8250 uart intel 8250 intel uart intel 8250 UART 8250a uart intel TN82510 82510 uart 8250A uart 82510 loopback	PDF
Side Brazed Ceramic Dual-In-Line Packages Abstract: intel packaging databook Side Brazed Ceramic Dual-In-Line Packages 28 outline of the heat slug for JEDEC 64 CERAMIC LEADLESS CHIP CARRIER LCC 68 pin plcc socket view bottom BGA and QFP Package BGA package tray 64 tray tsop 1220 gate count Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than nineteen million transistors, and device count is expected to increase to 100 million by the year	Original		PDF
2m 72-pin Flash simms Abstract: 30 pin 9-bit simm memory 30 pin simm memory Flash SIMM 72 292152 design ideas MAX706 28F016XD AB-58 simm 72 pin flash Text: E AB-58 APPLICATION BRIEF 28F016XD-Based SIMM Designs BRIAN DIPERT SENIOR TECHNICAL MARKETING ENGINEER SUJAN KAMRAN TECHNICAL MARKETING ENGINEER October 1995 Order Number: 292152-002 Intel Corporation makes no warranty for the use of its products and assumes no responsibility for any errors which may appear	Original	AB-58 28F016XD-Based MAX706 2m 72-pin Flash simms 30 pin 9-bit simm memory 30 pin simm memory Flash SIMM 72 292152 design ideas 28F016XD AB-58 simm 72 pin flash	PDF
D431000 Abstract: INTEL 87C196 USER MANUAL D75304GF AIC6360Q d431000agw aic-6360 INTEL PLCC 68 dimensions AIC-6360Q d431000ag NEC uPD71054 Text: IC Test Clips Test Clip Selection Made Easy To select the Pomona IC Test Clip specifically designed for your chip, find the table for your chip type and follow the selection procedure outlined in this section. SSOP/QSOP JEDEC QFP Pomona IC Test Clips are uniquely designed to provide	Original	SN74F32D, EPM5032, TMC1171 TMPN3120, HM628128, D431000AGW D431000 INTEL 87C196 USER MANUAL D75304GF AIC6360Q aic-6360 INTEL PLCC 68 dimensions AIC-6360Q d431000ag NEC uPD71054	PDF
Xeon MTBF Abstract: VR110 Text: VR110 Series www.murata-ps.com Solutions for Intel VRM 11.0 SELECTION GUIDE - STANDARD LOAD LINE Input Voltage Model Range V VR110B150CS-1C VR110B150CL-1C VR110B150CU-1C 11.04 – 12.60 VR110B150CU-3C ➀ VR110B080CU-1C VR110B080CA-1C DESCRIPTION The VR110 Series is designed to meet the fast load transients	Original	VR110B150CS-1C VR110B150CL-1C VR110B150CU-1C VR110B150CU-3C VR110B080CU-1C VR110B080CA-1C VR110 Xeon MTBF	PDF

Untitled Abstract: No abstract text available Text: VR110 Series www.murata-ps.com Solutions for Intel VRM 11.0 SELECTION GUIDE - STANDARD LOAD LINE Input Voltage Model M odel Range V VVR110B150CS-1C R110B150CS S-1C VR110B150CL-1C VR110B150CLL-1C VR110B150CU-1C VR110B150CU U-1C 11.04 – 12.60 VR110B150CU-3C	Original	VR110 VR110B150CS-1C VR110B150CL-1C VR110B150CU-1C VR110B150CU-3C VR110B080CU-1C	PDF
M25P08 Abstract: MD2800-D08 pmc flash pm49fl004t-33jc MD2810-D08 m25p04 SDTB-128 MD2811-D32-V3 M25P08-V-MN-6-T Sandisk TSOP EPROM databook am27c256 120 Text: SST Base Memory Cross Reference Table Silicon Storage Technology, Inc. Density Voltage Organized as x8/ x16 SST AMD ST Microelectronics Atmel Intel Winbond Flash 512K 5V 8 SST39SF512; SST29EE512 AM28F512 M29F512 AT49F512, AT29C512 - W29EE512 1M 5V 8 SST39SF010; SST29EE010	Original	SST39SF512; SST29EE512 AM28F512 M29F512 AT49F512, AT29C512 W29EE512 SST39SF010; SST29EE010 AM29F010, M25P08 MD2800-D08 pmc flash pm49fl004t-33jc MD2810-D08 m25p04 SDTB-128 MD2811-D32-V3 M25P08-V-MN-6-T Sandisk TSOP EPROM databook am27c256 120	PDF
intel vrm Abstract: tdc 0555 murata GRM MTBF Text: VR110 Series www.murata-ps.com Solutions for Intel VRM 11.0 SELECTION GUIDE - STANDARD LOAD LINE Input Voltage Model Range V VR110B150CS-1C VR110B150CL-1C VR110B150CU-1C 11.04 – 12.60 VR110B150CU-3C ➀ VR110B080CU-1C VR110B080CA-1C DESCRIPTION The VR110 Series is designed to meet the fast load transients	Original	VR110B150CS-1C VR110B150CL-1C VR110B150CU-1C VR110B150CU-3C VR110B080CU-1C VR110B080CA-1C VR110 manag151 intel vrm tdc 0555 murata GRM MTBF	PDF
d431000agw Abstract: D75304GF AIC6360Q Actel a1280 intel 80386dx HG62G027 AIC-6360Q CL-SH260 L1A9349 5252 F 1002 Text: P o m o n a Electronics IC Test Clips Logic Scope Probe JEDEC PQFP Test Clips PomonaÕs JEDEC QFP test clips are designed to fit on surfacemounted plastic and ceramic JEDEC chips. Choose from four clip types specifically designed to give you optimum functionality and ease of use for testing, troubleshooting and	Original	ABT16244, ACT16245 FCT16223, FCT162511 d431000agw D75304GF AIC6360Q Actel a1280 intel 80386dx HG62G027 AIC-6360Q CL-SH260 L1A9349 5252 F 1002	PDF
MAX8797G Abstract: MAX17401 MAX8796/MAX17401 Text: CONFIDENTIAL INFORMATION—RESTRICTED TO INTEL IMVP-6 LICENSEES 19-2452; Rev 1; 8/08 KIT ATION EVALU E L B A IL AVA 1-Phase Quick-PWM Intel IMVP-6/GMCH Controller D6 D5 STDBY D4 D3 24 PGND TOP VIEW VDD The MAX8796/MAX17401 implement both the Intel IMVP-6 CPU core specifications, as well as the Intel	Original	MAX8796/MAX17401 MAX8797 32pin MAX8797 28-pin MAX17401 MAX8796/MAX8797/MAX17401 MAX8797G MAX17401	PDF
Untitled Abstract: No abstract text available Text: MT8888C/MT8888C-1 M IT E L Integrated DTMFTransceiver with Intel Micro Interface Features • • • • • • ISSUE 2 Information 20 Pin Plastic DIP 20 Pin Ceramic DIP 20 Pin SOIC 24 Pin SSOP -40°C to +85°C The receiver section is based upon the industry	OCR Scan	MT8888C/MT8888C-1 MT8870 MT8888CE/CE-1 MT8888CC/CC-1 MT8888CS/CS-1	PDF
intel 27C010 Abstract: 27C010-120V10 27C010-200V10 27C010 27C010-150V10 LD27C010 P27C010-150V10 27C0T0 Text: intei 27C010 1M 128K x 8 CHMOS EPROM • JEDEC Approved EPROM Pinouts — 32-Pin DIP, 32-Pln PLCC — Simple Upgrade from Lower Densities ■ Complete Upgradfe Capability to Higher Densities ■ Fast Programming — Qufck-Pulse Programming Algorithm — Programming Time as Fast as 15	OCR Scan	27C010 32-Pin 27C010 576-bit, intel 27C010 27C010-120V10 27C010-200V10 27C010-150V10 LD27C010 P27C010-150V10 27C0T0	PDF
intel i3 block diagram Abstract: 27C220-200V10 intel PLD 27C220-150V10 Text: INTEL CORP MEMORY/PL] / 44E D H 4fl2bl7b 0 Ü 7 1 7 0 0 b BITL5 27C220 2M (128K x 16) CHMOS EPROM Fast Programming — Quick-Pulse ProgrammlngTM Algorithm — Programming Times As Fast As 15 Seconds JEDEC Approved EPROM Pinouts - 4 0 - P in DIP — 44-Pin PLCC	OCR Scan	27C220 44-Pin 152-bit 27C210 27C220 intel i3 block diagram 27C220-200V10 intel PLD 27C220-150V10	PDF
intel 27210 Abstract: 27210 intel Text: INTEL CORP MEMORY/LOGIC 20E D • 4fl5tl7b DObhlQD Q ■ in i I I^ E y f if f lO M V i n l t - v k - id -2 5 i o 27C210 T^e-iS-Z 9 1M (64K x 16) WORD-WIDE HIGH-SPEED CM OS EPROM ■ JEDEC Approved EPROM Pinouts — 40-Pln DIP -4 4 -P ln PLCC ■ Complete Upgrade to Higher Densities	OCR Scan	27C210 40-Pln 576-bit T-46-13-25 27C210, intel 27210 27210 intel	PDF
intel 8289 Abstract: 8289a 8289 bus controller SJ-33 8289 bus arbiter multibus 8289 sj33 "INTEL" "24-PIN" CERAMIC DIP arbiter chips Text: P L X TECHNOLOGY CORP 32E D • bflSSlMI DQ00102 1 B P L X T*52-?3-55’ Multibus 1 & II_ Both Multibus I and Multibus II are supported by PLX ICs. PLX offers a solu tion which emulates the Intel 8289 but with lower power consumption 250mW and a maximum processor clock rate of 16MHz. Multibus II Inter	OCR Scan	250mW) 16MHz. 32-bit 289A/B 289A/8289B intel 8289 8289a 8289 bus controller SJ-33 8289 bus arbiter multibus 8289 sj33 "INTEL" "24-PIN" CERAMIC DIP arbiter chips	PDF

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"INTEL" "24-PIN" CERAMIC DIP Search Results

"INTEL" "24-PIN" CERAMIC DIP Result Highlights (5)

"INTEL" "24-PIN" CERAMIC DIP Datasheets Context Search

intel 8255A

Intel 8237A

8251A

Intel 1702 eprom

intel packaging

intel PLCC packaging draw

CERAMIC CHIP CARRIER LCC 68 socket

TSOP 56 socket

P82510

P82510

Side Brazed Ceramic Dual-In-Line Packages

2m 72-pin Flash simms

D431000

Xeon MTBF

Untitled

M25P08

intel vrm

d431000agw

MAX8797G

Untitled

intel 27C010

intel i3 block diagram

intel 27210

intel 8289