"leadframe material" DIP
Abstract: "leadframe material" DIP 20 K 1357 C1995 leadframe materials an-469 national
Text: National Semiconductor Application Note 469 R James Walker October 1986 ABSTRACT New space efficient packages for integrated circuits have been developed These include the Plastic Chip Carrier P C C and Small Outline (S O ) packages Design considerations and reliability tests for the S O package were compared to the standard plastic Dual-in-Line Package (DIP)
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SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY
Abstract: MS011800 bond wire gold copper bond wire cte table epoxy substrate soft solder wire dispensing NATIONAL SEMICONDUCTOR ink MARKING AU4A cte table ic bga PCB monitor spc
Text: Semiconductor Packaging Assembly Technology Introduction This chapter describes the fundamentals of the processes used by National Semiconductor to assemble IC devices in electronic packages. Electronic packaging provides the interconnection from the IC to the printed circuit board PCB .
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SOT-23-JESD51-3
Abstract: AN-1187 LM2750
Text: Application Brief Thermal Performance of National’s LLP Package, Highlighting the LM2750 Regulated Voltage Converter Application Brief 111 National’s Leadless Leadframe Package LLP provides excellent power dissipation capability in a very small package footprint. The LLP is a chip
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LM2750
cN-1187.
com/pf/LM/LM2750
com/an/AN/AN-1187
LLP-JESD51-7;
OT-23-JESD51-3
SOT-23-JESD51-3
AN-1187
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TO metal package aluminum kovar
Abstract: Side Brazed Ceramic Dual-In-Line Packages ceramic pin grid array package lead finish gold CERAMIC FLATPACK socket CERAMIC LEADLESS CHIP CARRIER LCC 52 socket metal can equivalent national
Text: Hermetic Packages National Semiconductor offers a wide variety of ceramic and metal can packages for through-hole and surface mount applications. These ceramic and metal can packages are offered as solutions for high reliability and often high performance applications, and are extensively used in military/
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LBGA196
Abstract: AN-1205 CM12 Signal Path Designer
Text: National Semiconductor Application Note 1205 August 2001 Introduction conductors. Both DC and AC Inductance can be provided for packages. To determine which inductance is appropriate for your application, please see the section ’Frequency limitations of R-L-C parameters’.
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AN-1205
Abstract: CM12 Signal Path Designer
Text: National Semiconductor Application Note 1205 August 2001 INTRODUCTION This note is a snapshot of electrical performance of National’s IC packages. It is provided to help designers get an idea about electrical parasitics associated with the package, and help them compare the electrical performance of different
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AN-1205
AN-1205
CM12
Signal Path Designer
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DAP 07
Abstract: JESD22-B111 DAP 08 transistor smd sensor 80L dap 07 smd dap sot 23-5 SPA52A AN-1187 LQB08A MO-220
Text: National Semiconductor Application Note 1187 August 27, 2010 Table of Contents Introduction . 2 Package Overview . 2
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AN-1187
DAP 07
JESD22-B111
DAP 08
transistor smd sensor 80L
dap 07 smd
dap sot 23-5
SPA52A
AN-1187
LQB08A
MO-220
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AN-1201
Abstract: SQ 1201
Text: Introduction National Semiconductor Application Note 1201 Chester Simpson June 2001 PCB Bottom Copper Pattern The new leadless leadframe package LLP provides significantly increased power dissipation capability in a tiny surface-mount package. The key feature of the LLP is that it
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SQ 1201
Abstract: AN-1201 thermal pcb guidelines
Text: National Semiconductor Application Note 1201 Chester Simpson June 2001 Introduction The new leadless leadframe package LLP provides significantly increased power dissipation capability in a tiny surface-mount package. The key feature of the LLP is that it
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JESD-26
Abstract: RAI-5-039 mineral spirits bulk modulus Silicone mold release agent JESD-22 KITAGAWA MINERAL SPIRITS
Text: Package Reliability All products and packages offered by National Semiconductor Corporation meet the minimum reliability qualification requirements outlined in Table 1 and Table 2 for hermetic and plastic packages, respectively. These minimum requirements are applied to new packages as well as to existing
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JESD22-B111
Abstract: LLP48 JESD22B111 AA36 multicore solder paste SN50A AA100 AA-36 super mole heraeus
Text: Reliability of Chip Scale Packages under Mechanical Shock Loading T. T. Mattila1, P. Marjamäki1, L. Nguyen2, and J. K. Kivilahti1 1 Laboratory of Electronics Production Technology Helsinki University of Technology P.O. Box 3000, 02150 Espoo, Finland 2 National Semiconductor Corporation
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JESD22-B111
100-bumps
36-bumps
48-leads
gov/div898/handbook/,
gov/div853/lead
20free/part1
LLP48
JESD22B111
AA36
multicore solder paste
SN50A
AA100
AA-36
super mole
heraeus
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LMP2011
Abstract: LMP2011MA LMP2011MAX LMP2011MF LMP2011MFX LMP2012MA LMP2012MM LMP2012MMX straingauge
Text: LMP2011 Single/LMP2012 Dual High Precision, Rail-to-Rail Output Operational Amplifier General Description Features The LMP201x series are the first members of National's new LMPTM precision amplifier family. The LMP201X series offers unprecedented accuracy and stability in space-saving miniature packaging while also being offered at an affordable price.
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LMP2011
Single/LMP2012
LMP201x
LMP2011MA
LMP2011MAX
LMP2011MF
LMP2011MFX
LMP2012MA
LMP2012MM
LMP2012MMX
straingauge
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MCP market
Abstract: "The design of the leadframe" national
Text: Multi-Chip Packages “Multi-Chip Packages” or MCP is a terminology used within National Semiconductor Corp. Outsiders refer to the same type of packaging as “Few-Chip Packages” or FCP proposed by MCC or low-end Multi-Chip Modules (MCM). MCP refers to a packaging configuration containing at most
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Untitled
Abstract: No abstract text available
Text: AN11076 Thermal behavior of small-signal discretes on multilayer PCBs Rev. 1 — 11 July 2011 Application note Document information Info Content Keywords Low VCEsat, BISS, thermal resistance Rth , thermal impedance (Zth), total power dissipation (Ptot) Abstract
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pcb thermal Design guide trace theta layout
Abstract: pcb thermal Design guide trace theta pcb thermal Design guide trace theta layout via LM2652 AN1520
Text: National Semiconductor Application Note 1520 September 2006 Table of Contents 1.0 Abstract . 2 2.0 Introduction . 2
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CSP-9-111S2)
AN-1520
pcb thermal Design guide trace theta layout
pcb thermal Design guide trace theta
pcb thermal Design guide trace theta layout via
LM2652
AN1520
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2013290-9
Abstract: No abstract text available
Text: LMP2014MT LMP2014MT Quad High Precision, Rail-to-Rail Output Operational Amplifier Literature Number: SNOSAK6A LMP2014MT Quad High Precision, Rail-to-Rail Output Operational Amplifier General Description Features TM The LMP2014MT is a member of National’s new LMP
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LMP2014MT
2013290-9
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Untitled
Abstract: No abstract text available
Text: High Precision, Rail-to-Rail Output Operational Amplifier General Description Features The LMP201x series are the first members of National's new LMPTM precision amplifier family. The LMP201X series offers unprecedented accuracy and stability in space-saving miniature packaging while also being offered at an affordable price.
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LMP2011
Single/LMP2012
LMP201x
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AN-690
Abstract: C1995 AN-690 national
Text: UNDERSTANDING THE FUNDAMENTALS OF NOISE Today’s electronic system designers are becoming increasingly more familiar with the issues involved in migrating to high-speed logic One key issue is total system noise Noise in an electronic system can be described according
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20-3A
AN-690
C1995
AN-690 national
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AN-690
Abstract: No abstract text available
Text: capacitively-coupled and mutually-induced energy from the active signal trace. Its amplitude and duration are determined by the active signal’s edge rate and the length of adjacent parallel traces. The faster the edge or the closer the adjacent traces, the higher the crosstalk amplitude. The
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PGA68
Abstract: clcc44 SO53 material declaration semiconductor package FDIP28 schottky diode sb 5400 CLCC68 CLCC52 smd transistor marking 7622 DIP40 weight
Text: CHEMICAL CONTENT OF SEMICONDUCTOR PACKAGING SEPTEMBER 1998 Corp. Environment Strategies Corp. Package Development USE IN LIFE SUPPORT DEVICES OR SYSTEMS MUST BE EXPRESSLY AUTHORIZED STMicroelectronics PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE
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GS-150T
102x51x19
GS-100T
GS-R1005
PGA68
clcc44
SO53
material declaration semiconductor package
FDIP28
schottky diode sb 5400
CLCC68
CLCC52
smd transistor marking 7622
DIP40 weight
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AN-1254
Abstract: DDR200 DDR266 DDR333 LP2995
Text: National Semiconductor Application Note 1254 Chance Dunlap September 2002 With the advent of DDR-SDRAM as the industry standard for memory in desktop computers, laptops and videocards, power management has become a focal point for system designers. Active termination of bus interconnects has required the use of another regulator, increasing cost and
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LP2995
AN-1254
AN-1254
DDR200
DDR266
DDR333
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AN-1187
Abstract: AN-1389 AN-1398 DS40MB200 "differential via" an-1398 national
Text: National Semiconductor Application Note 1398 TK Chin October 2005 1.0 Introduction choice for high speed communication designs. The high speed differential IO’s are assigned to the center portion of the package such that each differential pair is sandwiched by
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10-mil
LLP-48
CSP-9-111S2)
CSP-9-111S2.
AN-1398
AN-1187
AN-1389
AN-1398
DS40MB200
"differential via"
an-1398 national
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NATIONAL SEMICONDUCTOR MARKING TYPE
Abstract: SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY national semiconductor packaging QFP PACKAGE thermal resistance Thermal Considerations for Surface Mount Packages national semiconductor databook
Text: Introduction Thank you for selecting National Semiconductor products. National Semiconductor’s products find wide use in applications ranging from the latest personal computers to lightweight portable consumer products. As next generation electronic systems require higher levels of performance, device
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DM3000
Abstract: NDM3000 SOIC-16 spindle motor control q406
Text: Nationa l f i Semiconductor May 1996 " N D M 3000 3 Phase Brush less M otor Driver G en eral D escription Features The NDM3000 three phase brushless m otor driver consists o f three N-Channel and P-Channel MOSFETs in a half bridge configuration. These devices are produced using National's proprietary,
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NDM3000
NDM3000
b50113G
DM3000
SOIC-16
spindle motor control
q406
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