0.13 bsim3v3
Abstract: 2SK3820
Text: 2SK3820 SPICE PARAMETER Nch MOS FET model : BSIM3V3.2 Parameter Value LEVEL 8 VERSION 3.2 VTH0 2.40 NLX 4.70E-07 DVT2 -0.01 UB 3.50E-21 AGS -1.00 RDSW 4.23E+04 WINT NFACTOR 0.80 CDSCD PCLM 0.30 DROUT 0.96 PVAG 0.01 MOBMOD 1 CAPMOD 3 CGDO 6.00E-12 CGDL 2.20E-10
|
Original
|
PDF
|
2SK3820
70E-07
50E-21
00E-12
20E-10
0E-09
00E-07
3290184E-6
3290184E-12
07E-05
0.13 bsim3v3
2SK3820
|
bsim3
Abstract: MCH6320 0.13 bsim3v3
Text: MCH6320 SPICE PARAMETER Pch MOS FET model : BSIM3V3.2 Parameter Value LEVEL 8 VERSION 3.2 VTH0 -0.8 NLX 3.2E-07 DVT2 -0.01 UB 1.0E-21 AGS 0.04 RDSW 1.9E+03 WINT NFACTOR 0.7 CDSCD PCLM 2.8 DROUT 0.96 PVAG 0.01 MOBMOD 1 CAPMOD 3 CGDO 5.0E-11 CGDL 6.0E-10 CLC
|
Original
|
PDF
|
MCH6320
2E-07
0E-21
0E-11
0E-10
0E-09
0E-08
578202E-6
578202E-12
0E-03
bsim3
MCH6320
0.13 bsim3v3
|
2SK370* spice
Abstract: 0.13 bsim3v3 2SK3704 6169 bsim3 26E03
Text: 2SK3704 SPICE PARAMETER Nch MOS FET model : BSIM3V3.2 Parameter Value LEVEL 8 VERSION 3.2 VTH0 2.4 NLX 4.7E-07 DVT2 -0.01 UB 1.0E-21 AGS 0.58 RDSW 1.67E+04 WINT NFACTOR 0.53 CDSCD PCLM 0.3 DROUT 0.96 PVAG 0.01 MOBMOD 1 CAPMOD 3 CGDO 2.0E-11 CGDL 3.0E-10 CLC
|
Original
|
PDF
|
2SK3704
7E-07
0E-21
0E-11
0E-10
0E-09
0E-07
6169770E-6
6169770E-12
3E-05
2SK370* spice
0.13 bsim3v3
2SK3704
6169
bsim3
26E03
|
0.13 bsim3v3
Abstract: MCH3377
Text: MCH3377 SPICE PARAMETER Pch MOS FET model : BSIM3V3.2 Parameter Value LEVEL 8 3.2 VERSION VTH0 -0.80 NLX 3.20E-07 DVT2 -0.01 UB 1.13E-21 AGS 0.28 2.25E+03 RDSW WINT 0.56 NFACTOR CDSCD PCLM 1.60 DROUT 0.96 PVAG 0.01 MOBMOD 1 CAPMOD 3 CGDO 3.00E-11 CGDL 4.00E-10
|
Original
|
PDF
|
MCH3377
20E-07
13E-21
00E-11
00E-10
0E-09
00E-08
578202E-6
578202E-12
12E-03
0.13 bsim3v3
MCH3377
|
VEC2303
Abstract: 13E02 18E-09
Text: VEC2303 SPICE PARAMETER Pch MOS FET model : BSIM3V3.2 Parameter Value LEVEL 8 VERSION 3.2 VTH0 -0.628 NLX 3.2E-07 DVT2 -0.01 UB 1.0E-21 AGS -0.32 RDSW 2.73E+03 WINT NFACTOR 0.56 CDSCD PCLM 1.76 DROUT 0.62 PVAG 0.01 MOBMOD 1 CAPMOD 3 CGDO 4.2E-11 CGDL 6.1E-10
|
Original
|
PDF
|
VEC2303
2E-07
0E-21
2E-11
1E-10
0E-07
796596E-6
796596E-12
3E-02
VEC2303
13E02
18E-09
|
bsim3
Abstract: 0.13 bsim3v3 MCH6321 22E04
Text: MCH6321 SPICE PARAMETER Pch MOS FET model : BSIM3V3.2 Parameter Value LEVEL 8 VERSION 3.2 VTH0 -0.8 NLX 3.2E-07 DVT2 -0.01 UB 1.13E-21 AGS 0.28 RDSW 2.25E+03 WINT NFACTOR 0.56 CDSCD PCLM 1.6 DROUT 0.96 PVAG 0.01 MOBMOD 1 CAPMOD 3 CGDO 3.0E-11 CGDL 4.0E-10
|
Original
|
PDF
|
MCH6321
2E-07
13E-21
0E-11
0E-10
0E-09
0E-08
578202E-6
578202E-12
12E-03
bsim3
0.13 bsim3v3
MCH6321
22E04
|
0.13 bsim3v3
Abstract: VEC2607
Text: VEC2607_Pch SPICE PARAMETER Pch MOS FET model : BSIM3V3.2 Parameter Value LEVEL 8 VERSION 3.2 VTH0 -0.628 NLX 3.2E-07 DVT2 -0.01 UB 1.0E-21 AGS -0.32 RDSW 2.73E+03 WINT NFACTOR 0.56 CDSCD PCLM 1.76 DROUT 0.62 PVAG 0.01 MOBMOD 1 CAPMOD 3 CGDO 4.2E-11 CGDL 6.1E-10
|
Original
|
PDF
|
VEC2607
2E-07
0E-21
2E-11
1E-10
0E-07
796596E-6
796596E-12
3E-02
0.13 bsim3v3
|
rpp1k1
Abstract: No abstract text available
Text: 0.18 m Process Family: XT018 0.18 Micron HV SOI CMOS Technology DESCRIPTION The XT018 series is X-FAB’s 0.18 micron Modular High-voltage SOI CMOS Technology. Based on SOI wafers and the industrial standard single poly with up to six metal layers 0.18-micron drawn gate
|
Original
|
PDF
|
XT018
XT018
18-micron
rpp1k1
|
0.6 um cmos process
Abstract: CMOS Process Family hv 082 1P2M pmos depletion nmos 0.13 um CMOS nmos pmos array trench mos HV diode
Text: 0.6 µm CMOS Process Family MIXED-SIGNAL FOUNDRY EXPERTS XT06 SOI CMOS with extended HV Technology Modular 0.6 µm Trench Isolated SOI CMOS process for analog/mixed-signal and high-voltage applications. Module Overview CORE CORE The process offers reduced parasitics which results in
|
Original
|
PDF
|
|
XP018
Abstract: No abstract text available
Text: 0.18 m Process Family: XP018 0.18 Micron CMOS Analog Mixed-Signal Process Technology DESCRIPTION The XP018 series is X-FAB’s 0.18 micron Modular Mixed Signal CMOS High Performance Analog Mixed-Signal Technology. Based upon the industrial standard single
|
Original
|
PDF
|
XP018
XP018
18-micron
|
CMOS Process Family
Abstract: XH018 bsim3 bsim3 0.18 micron parameters analog devices transistor tutorials TRANSISTORS BJT list IMD2 transistor XP018 process flow diagram "X-Fab" Core cell library
Text: 0.18 µm CMOS Process Family XP018 MIXED-SIGNAL FOUNDRY EXPERTS 0.18 Micron CMOS Power Management Process Technology Description The XP018 series is X-FAB’s 0.18 micron Modular Mixed Signal CMOS Power Management Technology. Based upon the industrial standard single
|
Original
|
PDF
|
XP018
XP018
18-micron
CMOS Process Family
XH018
bsim3
bsim3 0.18 micron parameters
analog devices transistor tutorials
TRANSISTORS BJT list
IMD2 transistor
process flow diagram
"X-Fab" Core cell library
|
0.6 um cmos process
Abstract: bsim3 Trench MOS Schottky Rectifier MICRON POWER RESISTOR Mos BSIM3 SOI pmos 60V-20 MICRON RESISTOR Mos MOS RM3 P-Channel Depletion Mosfets
Text: 0.6 µm Process XT06 MIXED-SIGNAL FOUNDRY EXPERTS 0.6 Micron Modular Trench Isolated SOI CMOS Technology Description The XT06 Series completes X-FAB's 0.6 Micron Modular Mixed Signal Technology. XT06 uses dielectric isolation on SOI wafers. This allows unrestricted 60 V high and low side operation
|
Original
|
PDF
|
|
nmos transistor 0.35 um
Abstract: npn pnp rf transistor bipolar cross reference l24c using a zener diode as a varicap NMOS depletion pspice model bsim3 model for 0.18 micron technology for hspice bsim3 model MOS RM3 QS 100 NPN Transistor analog devices transistor tutorials
Text: 0.6 µm BiCMOS Process Family XHB06 MIXED-SIGNAL FOUNDRY EXPERTS 0.6 Micron Modular HV BCD Technology Description The XHB06 is X-FAB's 0.6 Micron High-Voltage Bipolar CMOS DMOS BCD Technology, optimized for applications requiring operating voltages of 5V to 30V. Main target applications are power
|
Original
|
PDF
|
XHB06
XHB06
nmos transistor 0.35 um
npn pnp rf transistor bipolar cross reference
l24c
using a zener diode as a varicap
NMOS depletion pspice model
bsim3 model for 0.18 micron technology for hspice
bsim3 model
MOS RM3
QS 100 NPN Transistor
analog devices transistor tutorials
|
CMOS
Abstract: MICRON RESISTOR Mos MOS RM3 power BJT PNP spice model spice gate drive module mos rm3 data ESD "p-well" n-well" CMOS spice model ne3 MOS3ST varactor diode SPICE model
Text: 0.18 µm CMOS Process XC018 MIXED-SIGNAL FOUNDRY EXPERTS 0.18 Micron Modular RF enabled CMOS Logic and Analog Technology 0.18-micron drawn gate length N-well process, modules are also available for metal-insulatormetal capacitors, high resistive poly, dual gate
|
Original
|
PDF
|
XC018
18-micron
XC018
CMOS
MICRON RESISTOR Mos
MOS RM3
power BJT PNP spice model
spice gate drive module
mos rm3 data
ESD "p-well" n-well"
CMOS spice model
ne3 MOS3ST
varactor diode SPICE model
|
|
XH018
Abstract: sonos MOS RM3 model values for 0.18 micron technology cmos 0.18 um CMOS parameters analog devices transistor tutorials CMOS spice model bsim3 0.18 micron parameters EPI EEPROM bsim3 circuit model
Text: 0.18 µm CMOS Process Family XH018 MIXED-SIGNAL FOUNDRY EXPERTS 0.18 Micron Modular Mixed Signal HV CMOS Technology Description The XH018 series is X-FAB’s 0.18 micron Modular Mixed Signal HV CMOS Technology. Based upon the industrial standard single poly with up to six
|
Original
|
PDF
|
XH018
XH018
18-micron
sonos
MOS RM3
model values for 0.18 micron technology cmos
0.18 um CMOS parameters
analog devices transistor tutorials
CMOS spice model
bsim3 0.18 micron parameters
EPI EEPROM
bsim3 circuit model
|
bsim3 0.18 micron parameters
Abstract: bsim3 model for 0.18 micron technology for hspice 0.18 um CMOS parameters bsim3 model model values for 0.18 micron technology cmos XH018 CMOS Process Family model values for 0.25 micron technology cmos aadcc01_3v3 0.18-um CMOS technology length and width
Text: 0.18 µm CMOS Process Family XH018 MIXED-SIGNAL FOUNDRY EXPERTS 0.18 Micron Modular Mixed Signal HV CMOS Technology Description The XH018 series is X-FAB’s 0.18 micron Modular Mixed Signal HV CMOS Technology. Based upon the industrial standard single poly with up to six
|
Original
|
PDF
|
XH018
XH018
18-micron
bsim3 0.18 micron parameters
bsim3 model for 0.18 micron technology for hspice
0.18 um CMOS parameters
bsim3 model
model values for 0.18 micron technology cmos
CMOS Process Family
model values for 0.25 micron technology cmos
aadcc01_3v3
0.18-um CMOS technology length and width
|
spice model Tunnel diode
Abstract: dpsN TUNNEL DIODE spice model
Text: 0.6 µm Process XT06 MIXED-SIGNAL FOUNDRY EXPERTS 0.6 Micron Modular Trench Isolated SOI CMOS Technology Description The XT06 Series completes X-FAB's 0.6 Micron Modular Mixed Signal Technology. XT06 uses dielectric isolation on SOI wafers. This allows unrestricted 60 V high and low side operation
|
Original
|
PDF
|
|
CMOS
Abstract: hv 102 mos fet transistor varactor diode model in ADS bsim3 ADS varactor diode 0.18 micron 1.8V pspice model BSIM3V3 bsim3 model bsim3 model for 0.18 micron technology for hspice N-Channel jfet 100V depletion
Text: 0.6 m CMOS Process XC06 MIXED-SIGNAL FOUNDRY EXPERTS 0.6 Micron Modular Mixed Signal Technology Description Key Features The XC06 Series completes X-FAB‘s 0.6 Micron Modular Mixed Signal Technology with embedded Non Volatile Memory and High Voltage options.
|
Original
|
PDF
|
|
XH035
Abstract: mos rm3 data nmos transistor 0.35 um MOS RM3 "X-Fab" Core cell library bsim3v3 jfet wn 428 PHVC polysilicon resistor bsim3
Text: 0.35 µm CMOS Process Family XH035 MIXED-SIGNAL FOUNDRY EXPERTS 0.35 Micron Modular Analog Mixed Signal Technology with RF capability and HV Extensions Description The XH035 series is X-FAB’s 0.35-micron Modular RF capable Mixed Signal Technology. Main target
|
Original
|
PDF
|
XH035
XH035
35-micron
mos rm3 data
nmos transistor 0.35 um
MOS RM3
"X-Fab" Core cell library
bsim3v3
jfet wn 428
PHVC
polysilicon resistor
bsim3
|