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    PEI Genesis MS3100F10SL-4P

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    DigiKey MS3100F10SL-4P Bag 1,035
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    PEI Genesis CA3100F10SL-4SF80

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    PEI Genesis CA3100F10SL-4PB

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    CA3100F10SL-4PB Bag 214
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    PEI Genesis CA3100F10SL-4SB

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    CA3100F10SL-4SB Bag 214
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    PEI Genesis CA3100F10SL-3SBF80F85

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    DigiKey CA3100F10SL-3SBF80F85 Bag 259
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    0F10S Datasheets Context Search

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    s46 hall

    Abstract: AL233 hall s41 AL205 s05 hall AL207 XCB56007 s41 hall IDT74FCT821A MCM6206
    Text: Design Considerations Heat Dissipation Power, Ground, and Noise Design Considerations Heat Dissipation The average chip junction temperature, TJ, in °C, can be obtained from: TJ = TA + PD x ΘJA Where: NOTE: Table 8 (page 17) contains the package thermal


    Original     		XCB56007FJ50 80-pin DSP56004ROM DSP56004FJ50 DSP56004 XCB56007FJ66 DSP56004/007 s46 hall AL233 hall s41 AL205 s05 hall AL207 XCB56007 s41 hall IDT74FCT821A MCM6206 PDF

    htx 3

    Abstract: No abstract text available
    Text: Design Considerations Chip Enhancements The DSP56004 has undergone revisions to incorporate enhanced features and perfor­ mance. To determine the feature set of a specific piece of silicon, check the chip's mask set against the feature list in Table 34 on the following page. Some sections of this document


    OCR Scan     		DSP56004 DSP56007 DSP56L007 DSP56004/007 htx 3 PDF