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    100 PIN "PGA" ALTERA DIMENSION Search Results

    100 PIN "PGA" ALTERA DIMENSION Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CS-DSDMDB09MF-010 Amphenol Cables on Demand Amphenol CS-DSDMDB09MF-010 9-Pin (DB9) Deluxe D-Sub Cable - Copper Shielded - Male / Female 10ft Datasheet
    CS-DSDMDB15MF-002.5 Amphenol Cables on Demand Amphenol CS-DSDMDB15MF-002.5 15-Pin (DB15) Deluxe D-Sub Cable - Copper Shielded - Male / Female 2.5ft Datasheet
    CS-DSDMDB15MM-025 Amphenol Cables on Demand Amphenol CS-DSDMDB15MM-025 15-Pin (DB15) Deluxe D-Sub Cable - Copper Shielded - Male / Male 25ft Datasheet
    CS-DSDMDB25MM-010 Amphenol Cables on Demand Amphenol CS-DSDMDB25MM-010 25-Pin (DB25) Deluxe D-Sub Cable - Copper Shielded - Male / Male 10ft Datasheet
    CS-DSDMDB37MM-002.5 Amphenol Cables on Demand Amphenol CS-DSDMDB37MM-002.5 37-Pin (DB37) Deluxe D-Sub Cable - Copper Shielded - Male / Male 2.5ft Datasheet

    100 PIN "PGA" ALTERA DIMENSION Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    BC 1098

    Abstract: EPM7384 ALTERA 68 PLCC t187
    Text: Altera Device Package Information June 1998, ver. 7.01 Introduction Data Sheet This data sheet provides the following package information for all Altera¨ devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.


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    PDF 232-pin 240-pin 100-pin 256-pin 484-pin 672-pin BC 1098 EPM7384 ALTERA 68 PLCC t187

    transistors BC 458

    Abstract: 240 pin rqfp drawing ep600i BC 458 256-pin BGA drawing EPM7032-44 transistor BC 458 tqfp 44 thermal resistance datasheet epm7064s cross reference BGA PACKAGE thermal resistance
    Text: Altera Device Package Information August 1999, ver. 8 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.


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    100 PIN "PGA" ALTERA DIMENSION

    Abstract: No abstract text available
    Text: Altera Device Package Information June 1996, ver. 6 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in ascending pin count order.


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    altera ep610

    Abstract: EPM5130 240 PIN QFP ALTERA DIMENSION epm7064s cross reference 192PGA EPF10K100 EPF10K20 EPF10K30 EPF10K40 EPF10K50
    Text: Altera Device Package Information June 1996, ver. 6 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in ascending pin count order.


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    EP20K100E

    Abstract: EP20K160E EP20K200 EP20K200E EP20K300E EP20K60E EP20K100 0245 TQFP-208 208RQFP 280-PGA
    Text: Altera Device Package Information August 2000, ver. 8.03 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.


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    PDF 49-pin 169-pin EP20K100E EP20K160E EP20K200 EP20K200E EP20K300E EP20K60E EP20K100 0245 TQFP-208 208RQFP 280-PGA

    ep600i

    Abstract: JEDEC MS-034-AAJ-1 BGA Package 172 EP1800 MS-034 AAF-1 192PGA pdip 24 altera AP672 EP610 epm9560 die
    Text: Altera Device Package Information May 2001, ver. 9.1 Introduction Data Sheet This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.


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    208 pin rqfp drawing

    Abstract: 240 pin rqfp drawing BGA 144 MS-034 AAL-1 bga package weight 192 BGA PACKAGE thermal resistance
    Text: Altera Device Package Information April 2002, ver. 10.2 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.


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    bd248

    Abstract: UBGA169 EP1800 324 bga thermal HC1S6 EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
    Text: Altera Device Package Information May 2005, vers.13.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 14)


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    ep600i

    Abstract: processor cross reference MS-034 1152 BGA Cross Reference epm7064 cross reference EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
    Text: Altera Device Package Information October 2005, vers.14.2 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 16)


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    LCS-68

    Abstract: 821575-1 LCS-84 1-382320-7 821574-1
    Text: Selecting Sockets for Altera Devices January 1998, ver. 2 Introduction Application Note 80 Altera offers a number of surface-mount packages. Surface-mount assembly places unique demands on the development and manufacturing process by requiring different CAD symbols for printed circuit board


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    240 pin rqfp drawing

    Abstract: BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance
    Text: Altera Device Package Information February 2003, vers. 11.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 9)


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    PDF 7000B, 7000AE, 240 pin rqfp drawing BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance

    TQFP 100 PACKAGE footprint

    Abstract: 225-pin BGA transistor BF 998 BGA and QFP Package PQFP ALTERA 160 PLCC pin configuration 84 pin plcc ic base 2030 ic 5 pins 256-pin BGA AW 55 IC
    Text: Packaging Solutions Advanced Packaging Solutions for High-Density PLDs June 1998 • package options • pin compatibility Advanced • design flexibility Packaging Solutions FineLine BGA • vertical migration • space efficiency • cost-effectiveness


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    PDF 100-Pin 256-Pin 484-Pin 672-Pin 20-Pin 32-Pin 7000S, M-GB-ALTERAPKG-01 TQFP 100 PACKAGE footprint 225-pin BGA transistor BF 998 BGA and QFP Package PQFP ALTERA 160 PLCC pin configuration 84 pin plcc ic base 2030 ic 5 pins 256-pin BGA AW 55 IC

    240 PIN QFP ALTERA DIMENSION

    Abstract: 403-pin 304-pin dimensions bga EPM9560 pinout 4572 IC 8PIN altera flex10k 256 PIN QFP ALTERA DIMENSION
    Text: Packaging Solutions Advanced Packaging Solutions for High-Density PLDs June 1998 • package options • pin compatibility Advanced • design flexibility Packaging Solutions Table of Contents Advanced Packaging Solutions . . . . . . . . . . . . . . . . . . . . . .2


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    PDF 100-Pin 256-Pin 484-Pin 672-Pin 225-Pin 7000S, M-GB-ALTERAPKG-01 240 PIN QFP ALTERA DIMENSION 403-pin 304-pin dimensions bga EPM9560 pinout 4572 IC 8PIN altera flex10k 256 PIN QFP ALTERA DIMENSION

    EPM5128GM

    Abstract: EPM5128GC EPM5128JC EPM5032DC EPM5128GC-1 epm5130qc EPM5130QC-2 EPM5032DC-20 EPM5032DC-15 EPM5130LC
    Text: MAX 5000 Programmable Logic Device Family May 1999, ver. 5 Features. Data Sheet • ■ ■ ■ ■ ■ ■ ■ ■ Advanced Multiple Array MatriX MAX® 5000 architecture combining speed and ease-of-use of PAL devices with the density of programmable gate arrays


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    PDF 28-pin 100-pin 15-ns EPM5032PC-17 EPM5032SC-15 EPM5032SC-17 EPM5032SC-20 EPM5032SC-25 EPM5032SC-15, EPM5128GM EPM5128GC EPM5128JC EPM5032DC EPM5128GC-1 epm5130qc EPM5130QC-2 EPM5032DC-20 EPM5032DC-15 EPM5130LC

    EPM5130

    Abstract: max 5000
    Text: MAX 5000 Programmable Logic Device Family May 1999, ver. 5 Features. Data Sheet • ■ ■ ■ ■ ■ ■ ■ ■ Advanced Multiple Array MatriX MAX® 5000 architecture combining speed and ease-of-use of PAL devices with the density of programmable gate arrays


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    PDF 28-pin 100-pin 15-ns 84-Pin EPM5192 EPM5130 max 5000

    PQFP 176

    Abstract: 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760
    Text: Altera Device Package Information May 2007 version 14.7 Document Revision History Data Sheet Table 1 shows the revision history for this document. Table 1. Document Revision History 1 Date and Document Version May 2007 v14.7 Changes Made ● ● ● ●


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    PDF 144-Pin 100-Pin 256-Pin 780-Pin 256-Pin 68-Pin PQFP 176 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760

    EPM5130

    Abstract: EPM5192 EPM5064 EPM5032 EPM5032-15 EPM5064-1 EPM5128 ALTERA MAX 5000 EPM5064-2 ALTERA MAX 5000 programming
    Text: MAX 5000 Programmable Logic Device Family June 1996, ver. 3 Features. Data Sheet • ■ ■ ■ ■ ■ ■ ■ ■ Advanced Multiple Array MatriX MAX 5000 architecture combining speed and ease-of-use of PAL devices with the density of programmable gate arrays


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    PDF 28-pin 100-pin 15-ns EPM5192 84-Pin EPM5130 EPM5192 EPM5064 EPM5032 EPM5032-15 EPM5064-1 EPM5128 ALTERA MAX 5000 EPM5064-2 ALTERA MAX 5000 programming

    4572 IC 8PIN

    Abstract: epx780 TQFP 144 PACKAGE DIMENSION ALTERA EP610
    Text: Altera Device Package Information J u n e 1995, ver. 6 Introduction Data Sheet This data sh eet p rovid es the fo llo w in g package inform ation for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package w eig h ts Package outlines


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    PDF 503-Pin 4572 IC 8PIN epx780 TQFP 144 PACKAGE DIMENSION ALTERA EP610

    EPM5130

    Abstract: EPM5064 MC3334 44 pin plcc socket program EPM5032 EPMS128 EPM5064-1
    Text: MAX 5000 Programmable Logic Device Family Jan ua ry 1998. ver. 4 F e a tu r e s . Data S heet • ■ ■ ■ ■ ■ ■ ■ Advanced M ultiple A rray MatriX MAX® 5000 architecture combining speed and ease-of-use of PAL devices w ith the density of


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    PDF 28-pin 100-pin 15-ns EPM5192 84-Pin EPM5130 EPM5064 MC3334 44 pin plcc socket program EPM5032 EPMS128 EPM5064-1

    epm5064

    Abstract: EPM5130 EPM5128 APPLICATION NOTE CERAMIC CHIP CARRIER LCC 68 socket EPM5130 adapter
    Text: MAX 5000 Programmable Logic Device Family May 1999, ver. 5 F e a tu r e s. Data Sheet * • ■ ■ ■ ■ ■ ■ ■ Advanced Multiple Array Matrix MAX 5000 architecture combining speed and ease-of-use of PAL devices with the density of programmable gate arrays


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    PDF 28-pin 100-pin 15-ns 84-Pin EPM5192 epm5064 EPM5130 EPM5128 APPLICATION NOTE CERAMIC CHIP CARRIER LCC 68 socket EPM5130 adapter

    EPM5130

    Abstract: No abstract text available
    Text: MAX 5000 Programmable Logic Device Family January 1998. ver. 4 Features. Data Sheet • ■ ■ ■ ■ ■ ■ ■ Advanced Multiple Array M atrix MAX® 5000 architecture combining speed and ease-of-use of PAL devices with the density of programmable gate arrays


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    PDF 28-pin 100-pin 15-ns EPM5130

    epm5130

    Abstract: EPM5064 PQFP 176 J-Lead tnand 4536C EPM5032 max ALTERA MAX 5000 programming epm5032 max5000 EPM5128 APPLICATION NOTE
    Text: MAX 5000 Programmable Logic Device Family Data Sheet Features. • ■ ■ ■ ■ ■ ■ ■ Advanced Multiple Array MatriX MAX® 5000 architecture combining speed and ease-of-use of PAL devices with the density of programmable gate arrays Complete family of high-performance, erasable CMOS EPROM


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    PDF 28-pin 100-pin 15-ns EPM5192 84-Pin 84-Pin epm5130 EPM5064 PQFP 176 J-Lead tnand 4536C EPM5032 max ALTERA MAX 5000 programming epm5032 max5000 EPM5128 APPLICATION NOTE

    EPM5130

    Abstract: J-Lead, EPM5128 APPLICATION NOTE ALTERA MAX 5000 MAX5000 macrocell Altera EPM5128 EPM5064-1
    Text: MAX 5000 M M M & Programmable Logic Device Family , J a n u a r y 1 9 9 8 . v e r. 4 F e a tu re s . D a ta S h e e t m • ■ ■ Table 1. MAX5000 Device Features EPM5032 EPM5064 EPM5128 EPM5130 EPM5192 Usable gates 600 1,250 2,500 2,500 3,750 Macrocells


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    PDF 5000architecture 28-pin 100-pin 15-ns 84-Pin EPM5192 EPM5130 J-Lead, EPM5128 APPLICATION NOTE ALTERA MAX 5000 MAX5000 macrocell Altera EPM5128 EPM5064-1

    Untitled

    Abstract: No abstract text available
    Text: MAX 5000 Programmable Logic Device Family June 1996, ver. 3 F e a tu re s. Data Sheet * • ■ ■ ■ ■ ■ ■ ■ Advanced Multiple Array Matrix MAX 5000 architecture combining speed and ease-of-use of PAL devices with the density of programmable gate arrays


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    PDF 28-pin 100-pin 15-ns 84-Pin 000500b