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    144 CERAMIC PIN GRID ARRAY CPGA Search Results

    144 CERAMIC PIN GRID ARRAY CPGA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MG80C186-12/BZC Rochester Electronics LLC Rochester Manufactured 80C186, Microprocessor, 68 CPGA Package, Mil Temp spec. Visit Rochester Electronics LLC Buy
    MC68040RC33A Rochester Electronics LLC Rochester Manufactured 68040, RISC 32-bit Microprocessor 33MHz, 179 CPGA Package, Commercial Temp spec. Visit Rochester Electronics LLC Buy
    MG80C186-12/BZA Rochester Electronics LLC Rochester Manufactured 80C186, Microprocessor, 68 CPGA Package, Mil Temp spec. Visit Rochester Electronics LLC Buy
    TA80C186XL-20 Rochester Electronics LLC Rochester Manufactured 80C186, Microprocessor, 68 CPGA Package, Industrial Temp spec. Visit Rochester Electronics LLC Buy
    MG80C186-10/BZA Rochester Electronics LLC Rochester Manufactured 80C186, Microprocessor, 68 CPGA Package, Mil Temp spec. Visit Rochester Electronics LLC Buy

    144 CERAMIC PIN GRID ARRAY CPGA Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    CPGA144

    Abstract: SOT26 sot260
    Text: PDF: 2002 Nov 04 Philips Semiconductors Package outline SOT260-2 CPGA144: ceramic pin grid array package; 144 pins; body 40 x 40 x 2.3 mm D D1 pin 1 index mark location A2 E1 E A1 L detail X b e R e P N M L K J H G F index pin E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15


    Original     		PDF OT260-2 CPGA144: CPGA144 SOT26 sot260

    CERAMIC PIN GRID ARRAY 120 pins

    Abstract: 144 CERAMIC PIN GRID ARRAY CPGA CPGA U121A CERAMIC PIN GRID ARRAY CPGA U120C U68B Array UA65A U44A
    Text: Ceramic Pin Grid Array CPGA 44 Pin Ceramic Pin Grid Array, Cavity Up NS Package Number U44A 2000 National Semiconductor Corporation MS101111 www.national.com Ceramic Pin Grid Array (CPGA) August 1999 Ceramic Pin Grid Array (CPGA) 65 Pin Ceramic Pin Grid Array


    Original     		PDF MS101111 UA65A CERAMIC PIN GRID ARRAY 120 pins 144 CERAMIC PIN GRID ARRAY CPGA CPGA U121A CERAMIC PIN GRID ARRAY CPGA U120C U68B Array UA65A U44A

    Kostat tray

    Abstract: KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13
    Text: u Chapter 7 Trays CHAPTER 7 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers per Package Type Tray Dimensions Packages and Packing Publication Revision A 3/1/03 7-1 u Chapter 7 Trays INTRODUCTION Trays are used instead of tubes to protect higher


    Original     		PDF and5-741-9148 Kostat tray KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13

    QFN108

    Abstract: QFN-132 kl1-v1 208 pin rqfp drawing qfn132 RT3PE3000L CQ256 DIMENSIONS pqfp 100 actel package mechanical drawing Actel A40MX04 PBGA 23X23 0.8 pitch
    Text: v 11. 2 Package Mechanical Drawings Ceramic Pin Grid Array 84-Pin CPGA Top View 0.050" ± 0.010" Pin #1 ID 0.045" 0.055" 0.015" 0.018" ± 0.002" 0.100" BSC 1.100" ± 0.020" square 0.072" 0.088" L 0.120" 0.140" Side View K J H G F 1.000" BSC E D C B A 1 2 3


    Original     		PDF 84-Pin A1010B A1020B 100-Pin QFN108 QFN-132 kl1-v1 208 pin rqfp drawing qfn132 RT3PE3000L CQ256 DIMENSIONS pqfp 100 actel package mechanical drawing Actel A40MX04 PBGA 23X23 0.8 pitch

    Theta JC of FBGA

    Abstract: cpga dimensions cpga weight 84 pin plcc ic base
    Text: v3.0 Package Characteristics and Mechanical Drawings Pa c ka ge T he r m a l C ha r a ct e r i s t i c s Package Type Ceramic Pin Grid Array CPGA Ceramic Quad Flat Pack (CQFP) – cavity up – cavity up w/ heat sink Plastic Leaded Chip Carrier (PLCC) Plastic Quad Flat Pack (PQFP)


    Original     		PDF

    MO-143

    Abstract: 172-CQFP 256-CQFP DIMENSIONS PQFP 132 CPGA132 CERAMIC QUAD FLATPACK CQFP
    Text: Package Characteristics and Mechanical Drawings Package Thermal Characteristics Package Type Plastic Leaded Chip Carrier PLCC Plastic Quad Flatpack (PQFP) Pin Count θjc θja θja Still Air 300 ft/min Unit 44 16 43 31 °C/W 68 13 36 25 °C/W 84 12 32 22


    Original     		PDF PBGA329 51xxxxx-x/1 MO-143 172-CQFP 256-CQFP DIMENSIONS PQFP 132 CPGA132 CERAMIC QUAD FLATPACK CQFP

    ME 1117

    Abstract: MO-113 175-PIN CERAMIC QUAD FLATPACK CQFP CQ208 CQ256 CQ84 PQ100 ceramic pin grid array package lead finish cpga dimensions
    Text: Package Mechanical Drawings S e p t e m b e r 1997 1997 Actel Corporation 1-409 Ceramic Pin Grid Array 84-Pin CPGA .050" ± .010" Pin #1 ID .045 .055 0.18" ± .002" .100" BSC 1.100" ± .020" square .080" .110" L K J H G 1.000 BSC F E D C B A 1 2 3 4 5 6


    Original     		PDF 84-Pin 100-Pin MO-136 ME 1117 MO-113 175-PIN CERAMIC QUAD FLATPACK CQFP CQ208 CQ256 CQ84 PQ100 ceramic pin grid array package lead finish cpga dimensions

    CX3001

    Abstract: CX3000 "CHIP EXPRESS" CX3002 2308 rom CHIPX PQFP ALTERA 160 mentor graphics pads layout ambit circuit CX300
    Text: 15244 ChipExpress W/Tumble Black cyan m a g yellow www.chipexpress.com Chip Express products are protected by one or more of the following U.S. patents: . This information is subject to change without notice. CX3000, HardArray, OneMask, and


    Original     		PDF CX3000, CX3002 CX3141 CX3041 CX3001 CX3000 "CHIP EXPRESS" 2308 rom CHIPX PQFP ALTERA 160 mentor graphics pads layout ambit circuit CX300

    ms-029

    Abstract: FBGA1152
    Text: v6.0 Package Characteristics and Mechanical Drawings P a ck ag e Th e r m al C h ar ac te ri st i cs Package Type Ceramic Pin Grid Array CPGA Ceramic Quad Flat Pack (CQFP) – cavity up – cavity up w/ heat sink Plastic Leaded Chip Carrier (PLCC) Plastic Quad Flat Pack (PQFP)


    Original     		PDF

    CERAMIC CHIP CARRIER LCC 68 socket

    Abstract: INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE LCCs 68 socket ic 7912 64 ceramic quad flatpack CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PCB footprint cqfp 132 Single Edge Contact (S.E.C.) Cartridge: 7912 pin configuration
    Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than seven million transistors and device count is expected to increase to 100 million by the year 2000. With a


    Original     		PDF

    CERAMIC QUAD FLATPACK CQFP 14 pin

    Abstract: CF160 CERAMIC PIN GRID ARRAY CPGA CERAMIC QUAD FLATPACK CQFP CQ208 CF100 PF100 PF144 PL84 PQ208
    Text: pASIC DEVICE Packaging Specifications HIGHLIGHTS For plastic packages, QuickLogic offers surface-mount packaging in PLCC Plastic Leaded Chip Carrier and PQFP packages. The PQFP (Plastic Quad Flatpack) comes in two categories, TQFP (Thin Quad Flatpack) and PQFP.


    Original     		PDF CF160 PQ208 CQ208 PB256 CERAMIC QUAD FLATPACK CQFP 14 pin CF160 CERAMIC PIN GRID ARRAY CPGA CERAMIC QUAD FLATPACK CQFP CQ208 CF100 PF100 PF144 PL84 PQ208

    CQ208

    Abstract: CQFP 208 datasheet CERAMIC QUAD FLATPACK CQFP CF160 CERAMIC PIN GRID ARRAY 120 pins TQFP Package 44 lead PB256 PF100 PF144 PL84
    Text: HIGHLIGHTS For plastic packages, QuickLogic offers surface-mount packaging in PLCC Plastic Leaded Chip Carrier and PQFP packages. The PQFP (Plastic Quad Flatpack) comes in two categories, TQFP (Thin Quad Flatpack) and PQFP. The TQFP package has a nominal thickness of only


    Original     		PDF PF144 CF160 PQ208 CQ208 PB256 CQ208 CQFP 208 datasheet CERAMIC QUAD FLATPACK CQFP CF160 CERAMIC PIN GRID ARRAY 120 pins TQFP Package 44 lead PB256 PF100 PF144 PL84

    tray matrix bga

    Abstract: tray datasheet bga BGA package tray JEDEC tray standard for PLCC CERAMIC PIN GRID ARRAY CPGA AMD PLCC JEDEC tray V Box codes
    Text: u Chapter 1 Codes and Carrier Options CHAPTER 1 CODES AND CARRIER OPTIONS Revision Status Product Carrier Options Package Codes Product Date Codes Packages and Packing Publication Revision A 3/1/03 1-1 u Chapter 1 Codes and Carrier Options REVISION STATUS


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    BGA-56 DATASHEET

    Abstract: mini ball corner PQFP die size cpga dimensions BGA-64 pad atmel 0945 PQFP 132 PACKAGE DIMENSION
    Text: pkg-3.7-04/99 Packaging Introduction . 4-3 Package Options: Table . 4-3


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    CY7C386A-1AC

    Abstract: CY7C386A-0AC 7C385A CY7C385A-2AC
    Text: CY7C385A CY7C386A Very High Speed 4K 12K Gate CMOS FPGA Features D Very high speed D D D D D Ċ Loadable counter frequencies greater than 150 MHz Ċ ChipĆtoĆchip operating frequencies up to 110 MHz Ċ Input + logic cell + output delays under 6 ns Unparalleled FPGA performance for


    Original     		PDF CY7C385A CY7C386A 84pin 100pin 144pin 160pin 16bit CY7C386A-1AC CY7C386A-0AC 7C385A CY7C385A-2AC

    intel packaging

    Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays
    Text: 2 1 Introduction 1/20/97 6:22 PM CH01WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 1 INTRODUCTION 1.1. OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power.Today’s products can feature more than


    Original     		PDF CH01WIP intel packaging CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays

    m6845

    Abstract: NA51 transistor AMI 52 732 V DL651 M82530 MXI21 dl541 DF421 DF101 grid tie inverter schematics
    Text: “The new 0.6µm gate array and standard cell families from AMI provide outstanding quality and selection . . . setting performance standards in 0.6µm ASIC products . . . ” • 130 ps gate delays fanout = 2, interconnect length = 0mm ■ Double and Triple Metal Interconnect; up to 900,000 gate


    Original     		PDF Table128, m6845 NA51 transistor AMI 52 732 V DL651 M82530 MXI21 dl541 DF421 DF101 grid tie inverter schematics

    CPGA large cavity

    Abstract: No abstract text available
    Text: MECHANICAL DATA MCPG004 – OCTOBER 1994 GA-GB S-CPGA-P12 X 12 CERAMIC PIN GRID ARRAY PACKAGE A or A1 SQ 1.100 (27,94) TYP M L K J H G F E D C B A 1 2 3 DIM B or B1 4 5 6 7 8 9 10 11 12 MIN MAX Notes A 1.240 (31,50) 1.280 (32,51) Large Outline A1 1.180 (29,97)


    Original     		PDF MCPG004 S-CPGA-P12 CPGA large cavity

    231369

    Abstract: TQFP 44 PACKAGE footprint NG80386SX16 Side Brazed Ceramic Dual-In-Line Packages CERAMIC PIN GRID ARRAY CPGA lead frame 325 A80486DX-25 TQFP 144 PACKAGE DIMENSION intel order 231369 600E12 BGA and QFP Package
    Text: Package Module PC Card Outlines and Dimensions February 1996 Order Number 231369-012 PACKAGE MODULE PC CARD OUTLINES AND DIMENSIONS Intel Product Identification Codes 231369 – 1 EXAMPLES A80486DX25SX387 32-Bit Microprocessor 25 MHz 168-Lead Ceramic Pin Grid Array


    Original     		PDF A80486DX25SX387 32-Bit 168-Lead NG80386SX16SX159 16-Bit 100-Lead 231369 TQFP 44 PACKAGE footprint NG80386SX16 Side Brazed Ceramic Dual-In-Line Packages CERAMIC PIN GRID ARRAY CPGA lead frame 325 A80486DX-25 TQFP 144 PACKAGE DIMENSION intel order 231369 600E12 BGA and QFP Package

    Untitled

    Abstract: No abstract text available
    Text: MECHANICAL DATA MCPG004A – JANUARY 1997 GA-GB S-CPGA-P12 X 12 CERAMIC PIN GRID ARRAY PACKAGE A or A1 SQ 1.100 (27,94) TYP M L K J H G F E D C B A 1 2 3 DIM B or B1 4 5 6 7 8 9 10 11 12 MIN MAX Notes A 1.240 (31,50) 1.280 (32,51) Large Outline A1 1.180 (29,97)


    Original     		PDF MCPG004A S-CPGA-P12

    Untitled

    Abstract: No abstract text available
    Text: •A M I Packaging Availability AMERICAN MICROSYSTEMS, INC. August 1996 AMI offers you space-saving and cost-effective packages and package processes spanning a broad spectrum of capabilities. AMI can meet your package requirements in a variety of ways. You can choose from ten basic package


    OCR Scan     		PDF

    P/N146071

    Abstract: No abstract text available
    Text: /u o o /d /o d . 1»»*+ lu w ò u d y , iv id y Revision: Friday, June 24,1994 3f CYPRESS PRELIMINARY Very High Speed 8K 24K Gate CMOS FPGA — 16-bit counter operating at 100 MHz consumes 50 mA — Minimum Iol of 12 mA and Ioh of 8mA • Flexible logic cell architecture


    OCR Scan     		PDF 16-bit P/N146071

    Untitled

    Abstract: No abstract text available
    Text: m e iid iiitu v iu iiu ciy , ü u iiü io , i» » £ Revision: Tuesday, May 10,1994 CY7C385A CY7C386A CYPRESS Features • Very high speed — Loadable counter frequencies greater than 100 MHz — Chip-to-chip operating frequencies up to 85 MHz — Input + logic cell + output delays


    OCR Scan     		PDF CY7C385A CY7C386A 7C385A) 7C386A)

    Untitled

    Abstract: No abstract text available
    Text: CY7C385A CY7C386A i f CYPRESS Very High Speed 4K 12K Gate CMOS FPGA — Fast, fully automatic place and route — Waveform simulation with back an­ notated net delays — PC and workstation platforms Robust routing resources — Fully automatic place and route of


    OCR Scan     		PDF CY7C385A CY7C386A 84-pin 100-pin 144-pin 145-pin 160-pin 16-bit 160-Lead 7C386A