15 BALL CSP Search Results

15 BALL CSP Result Highlights (5)

Part	Manufacturer	Description
MPC860PZQ50D4	Rochester Electronics LLC	32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
MPC860PVR80D4	Rochester Electronics LLC	32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
MPC855TCZQ50D4	Rochester Electronics LLC	32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
MPC860TCZQ50D4	Rochester Electronics LLC	32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
MPC860ENZQ50D4	Rochester Electronics LLC	32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357

15 BALL CSP Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
transistor b 1238 Abstract: PCB design for very fine pitch csp package tray datasheet bga 8x9 5 ball csp drawing BGA PACKAGE TOP MARK intel land pattern BGA 0.75 SCR Manual, General electric databook N4646 15 ball CSP bga 6x8 tray dimension Text: The Micro Ball Grid Array µBGA Package The Micro Ball Grid Array (µBGA) Package 15.1 15 Introduction The Micro Ball Grid Array package (µBGA) is considered a “chip size” package (CSP). A chip size package is generally defined as a package which does not exceed the die size by greater than	Original	PDF
28F160 Abstract: 28F160B3 BGA thermal resistance 6x8 intel 28f160 s5 SOP JEDEC tray A576 ubga package BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS TRANSPORT MEDIA AND PACKING Text: The Micro Ball Grid Array µBGA* Package 15.1 15 Introduction The Micro Ball Grid Array package (µBGA*) is considered a “chip size” package (CSP). A chip size package is generally defined as a package which does not exceed the die size by greater than	Original	PDF
MO-192-AAF-1 Abstract: aaf1 256-BALL Text: 256-Ball Chip Scale Package Ball Grid Array [CSP_BGA] BC-256-2 Dimensions shown in millimeters A1 CORNER INDEX AREA 17.20 17.00 SQ 16.80 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N P R T BALL A1 PAD CORNER 15.00 BSC SQ TOP VIEW *1.85	Original	PDF	256-Ball BC-256-2) MO-192-AAF-1 022007-B aaf1
BC-208-2 Abstract: 208-Ball Text: 208-Ball Chip Scale Package Ball Grid Array [CSP_BGA] BC-208-2 Dimensions shown in millimeters 17.10 17.00 SQ 16.90 A1 BALL CORNER A1 CORNER INDEX AREA 20 18 16 14 12 10 8 6 4 2 19 17 15 13 11 9 7 5 3 1 A B C D E F G H J K L M N P R T U V W Y 15.20 BSC SQ	Original	PDF	208-Ball BC-208-2) MO-205-AM 51807-A BC-208-2
transistor BC-148 Abstract: BC148 BC 148 L BC 148 transistor BC-148 MO-195 BC 148 BC148 L transistor bc 148 "bc 148" Text: a 148-Lead Chip Scale Package Ball Grid Array [CSP_BGA] BC-148 Dimensions shown in millimeters A1 CORNER INDEX AREA 9.10 9.00 SQ 8.90 BALL A1 PAD CORNER TOP VIEW 16 14 12 10 15 13 11 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N P R T 7.50 BSC SQ 0.50 BSC	Original	PDF	148-Lead BC-148) MO-195 transistor BC-148 BC148 BC 148 L BC 148 transistor BC-148 BC 148 BC148 L transistor bc 148 "bc 148"
LGA 1150 Abstract: No abstract text available Text: CSP TAPE & REEL Chip Scale Packages for Memory Products Tape and Reel Shipping Media INTRODUCTION Surface mounting packages can be supplied with Tape and Reel packing. The reels are standard 330mm diameter and contain between 250 and 2500 devices. The packages supplied on Tape and Reel are listed in Table 1 that shows the Tape Width and Part Pitch	Original	PDF	330mm LGA 1150
639X Abstract: LGA 1150 Text: CSP TAPE & REEL Chip Scale Packages for Memory Products Tape and Reel Shipping Media INTRODUCTION Surface mounting packages can be supplied with Tape and Reel packing. The reels are standard 330mm diameter 150mm for SBGA and contain between 250 and 2500 devices.	Original	PDF	330mm 150mm 639X LGA 1150
116-Pin Abstract: PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow Text: small! What is a CSP Chip Size Package ? A “CSP” is an integrated circuit package with dimensions equal to or slightly larger than those of the silicon chip it contains. Specifically, a package with size (L x W) equal to the size of the chip is called a Real Chip Size	Original	PDF	C13185EJ1V0PF00 116-Pin PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow
BGA 64 PACKAGE thermal resistance Abstract: FCCSP CABGA 6x6 amkor flip fcBGA PACKAGE thermal resistance bga 9x9 Shipping Trays CABGA 8X8 BGA 256 PACKAGE power dissipation BGA 256 PACKAGE thermal resistance BGA45 Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package — a flip chip solution in a CSP package format. This package construction utilizes eutectic tin/lead (63Sn/37Pb) flip chip interconnect	Original	PDF	63Sn/37Pb) BGA 64 PACKAGE thermal resistance FCCSP CABGA 6x6 amkor flip fcBGA PACKAGE thermal resistance bga 9x9 Shipping Trays CABGA 8X8 BGA 256 PACKAGE power dissipation BGA 256 PACKAGE thermal resistance BGA45
EMI filter schematic diagram Abstract: notebook schematic diagram circuit diagram of wireless camera CM1452-04CP Wireless Camera Circuit Diagram mobile camera circuit diagram emi filter cell phone display pcb CM1452 CM1452-06CP CM1452-08CP Text: PRELIMINARY CM1452 LCD & Camera EMI Filter Array with ESD Protection Features Applications 4, 6 and 8 channels of EMI filtering 15kV ESD protection IEC 61000-4-2, contact discharge 30kV ESD protection (HBM) Greater than 30dB of attenuation at 1GHz Chip Scale Package (CSP) with 0.40mm pitch and	Original	PDF	CM1452 CM1452-04CP CM1452-06CP CM1452-08CP 178mm EMI filter schematic diagram notebook schematic diagram circuit diagram of wireless camera CM1452-04CP Wireless Camera Circuit Diagram mobile camera circuit diagram emi filter cell phone display pcb CM1452 CM1452-06CP CM1452-08CP
bga 576 socket Abstract: IC280-169-127 IC280-196-126 IC280-225-185 IC280-256-211 IC280-324-186 IC280-72919 4200-005 IC280-868-108 LGA socket Text: IC280 Series Clamshell Ball Grid Array (FBGA / CSP / LGA) Specifications Part Number (Details) 1,000MΩ min. at 500V DC Insulation Resistance: Dielectric Withstanding Voltage: 700V AC for 1 minute for 1.00mm pitch 500V AC for 1 minute for 0.80mm pitch 100V AC for 1 minute for 0.75mm pitch	Original	PDF	IC280 10mA/20mV IC280 696pins IC280-69605 00x37 bga 576 socket IC280-169-127 IC280-196-126 IC280-225-185 IC280-256-211 IC280-324-186 IC280-72919 4200-005 IC280-868-108 LGA socket
cu pillar Abstract: Flip Chip Substrate HL832 ds7409 FCCSP amkor flip chiparray amkor HL832N CABGA 48 7x7 amkor cabga thermal resistance Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or	Original	PDF
sensors mttf Abstract: SAC405 UM 3841 4953 sac 405 "Hall Effect Sensor" mttf resistor activation energy sURVEY OF Hall Effect Current Measurements WLCSP Cu6Sn5 Text: Mean Time To Failure in Wafer Level-CSP Packages with SnPb and SnAgCu Solder Bumps Stephen Gee and Luu Nguyen National Semiconductor M/S 19-100 3875 Kifer Rd. Santa Clara, CA 95051 [email protected] [email protected] ABSTRACT In this test setup, embedded die surface temperature sensors are	Original	PDF	ED-16 IPACK2005-73417, sensors mttf SAC405 UM 3841 4953 sac 405 "Hall Effect Sensor" mttf resistor activation energy sURVEY OF Hall Effect Current Measurements WLCSP Cu6Sn5
csp defects Abstract: handling damage LGA socket MANUAL PCB Samsung MCP 1mm pitch BGA socket air handling unit CRACK pcb substrate HCFC141B Text: USER’S MANUAL Chip Scale Package • To make a win-win situation for CSP products supplier and customer, Samsung provides the information of CSP package’s characteristics and manuals to maintain high quality so that the problems of customer process can be minimized or prevented	Original	PDF	150um) 20mils x20mil csp defects handling damage LGA socket MANUAL PCB Samsung MCP 1mm pitch BGA socket air handling unit CRACK pcb substrate HCFC141B

128W18 Abstract: 28f128w18t Intel SCSP 28F128W18B 28F640W18T 128W-1 128W18B micron flash otp Text: 128-Mbit 1.8 Volt Intel Wireless Flash Memory W18 + 32-Mbit PSRAM Stacked-CSP Family Datasheet Product Features • ■ ■ ■ Flash Architecture — Flexible, Multiple-Partition, DualOperation: Read-While-Write / ReadWhile-Erase — 32 Partitions, 4 Mbits each	Original	PDF	128-Mbit 32-Mbit --32-Kword 128W18 RD48F3000W0YBQ0 RD48F3000W0YTQ0 128W18 32PSRAM RD38F3040W0YBQ0 RD38F3040W0YTQ0 28f128w18t Intel SCSP 28F128W18B 28F640W18T 128W-1 128W18B micron flash otp
Untitled Abstract: No abstract text available Text: Preliminary CMOS SRAM KM68V4000BZ, KM68U4000BZ Family Document Title 512Kx8 Low Voltage & Low Power SRAM Data Sheets for 48-CSP Revision History Rev. No. History Draft Data Remark Rev. 0.0 - 1′st edition - Package Dimension Finalized Feb. 4′th, 1997 Preliminary	Original	PDF	KM68V4000BZ, KM68U4000BZ 512Kx8 48-CSP 55/Typ.
TAIYO PSR 4000 Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).	Original	PDF
WLCSP flip chip Abstract: WLCSP smt 0.3mm pitch csp package wlcsp inspection WLCSP chip mount WLCSP PBO design amkor flip amkor RDL amkor polyimide system in package WLCSP underfill Text: data sheet wafer level packaging WLCSP Features • 4 - 196 ball count • 0.8 mm – 6.5 mm body size • Repassivation, Redistribution and Bumping options available • Electroplated and Ball-loaded bumping options • Eutectic and Lead-free solder • Standard JEDEC / EIAJ pitches and CSP solder ball diameters	Original	PDF
TAIYO PSR 4000 Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100 Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).	Original	PDF
CSPNL Abstract: amkor RDL wafer map format amkor amkor flip amkor Sip amkor polyimide FCCSP wafer map Text: data sheet wafer level packaging CSPnl RDL Features: Packaging CSPnl Bump on Redistribution RDL (DSBGA / WLCSP / WSCSP / WLP) Wafer Level Packaging Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP (Chip Scale Package) products. Through the	Original	PDF
amkor RDL Abstract: amkor flip FCCSP JEDEC tray standard amkor Sip Text: data sheet wafer level packaging CSPnl Features: CSPnl DSBGA / WLCSP / WSCSP / WLP Wafer Level Packaging Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP (Chip Scale Package) products. Through the	Original	PDF
CM1442-06l Abstract: MARKING 1053 Text: CM1442-06LP LCD and Camera EMI Filter Array with ESD Protection Functional Description Features • Six Channels of EMI Filtering with Integrated ESD Protection • 0.4 mm Pitch, 15−Bump, 2.360 mm x 1.053 mm Footprint Chip • • • • • Scale Package CSP	Original	PDF	CM1442-06LP CM1442-06LP CM1442-06LP/D CM1442-06l MARKING 1053
252633 Abstract: INTEL STRATAFLASH 1.8V Text: 256-Mbit 1.8 Volt Intel StrataFlash Wireless Memory L18/L30 Stacked-Chip Scale Package (x16) 48F3300L0YDQ0 (x16), 48F3300L0ZDQ0 (x16) Datasheet Product Features • ■ ■ Stacked Chip Scale Package (Stacked-CSP) Architecture — 128-Mbit L18 Flash + 128-Mbit L18 Flash	Original	PDF	256-Mbit L18/L30) 48F3300L0YDQ0 48F3300L0ZDQ0 128-Mbit 48F3300L0YDQ0 48F3300L0ZDQ0 252633 INTEL STRATAFLASH 1.8V
Untitled Abstract: No abstract text available Text: CM1442-06LP LCD and Camera EMI Filter Array with ESD Protection Functional Description The CM1442-06LP is part of a family of pi-style EMI filter arrays with ESD protection, which integrates six filters C-R-C in a Chip Scale Package (CSP) form factor with 0.40 mm pitch. The	Original	PDF	CM1442-06LP CM1442-06LP CM1442â 06LP/D

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15 BALL CSP Search Results

15 BALL CSP Result Highlights (5)

15 BALL CSP Datasheets Context Search

transistor b 1238

28F160

MO-192-AAF-1

BC-208-2

transistor BC-148

LGA 1150

639X

116-Pin

BGA 64 PACKAGE thermal resistance

EMI filter schematic diagram

bga 576 socket

cu pillar

sensors mttf

csp defects

128W18

Untitled

TAIYO PSR 4000

WLCSP flip chip

TAIYO PSR 4000

CSPNL

amkor RDL

CM1442-06l

252633

Untitled