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    SMV2019

    Abstract: SMV2019-000 SMV2020 SMV2020-000 SMV2021 SMV2021-000 SMV2022-000 SMV2023-000 SMV2019-203
    Text: DATA SHEET SMV2019-SMV2023: Silicon Hyperabrupt Junction Varactors, Packaged and Bondable Planar Chips Applications • VCOs Features • High Q for low-loss resonators • Low leakage current • High tuning ratio for wideband VCOs • SPICE model parameters


    Original     		SMV2019-SMV2023: 200138E SMV2019 SMV2019-000 SMV2020 SMV2020-000 SMV2021 SMV2021-000 SMV2022-000 SMV2023-000 SMV2019-203 PDF

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    Abstract: No abstract text available
    Text: DATA SHEET SMV2019-SMV2023: Silicon Hyperabrupt Junction Varactors, Packaged and Bondable Planar Chips Applications • VCOs Features • High Q for low-loss resonators • Low leakage current • High tuning ratio for wideband VCOs • SPICE model parameters


    Original     		SMV2019-SMV2023: 200138E PDF