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    200A00 Search Results

    200A00 Result Highlights (1)

    Part ECAD Model Manufacturer Description Download Buy
    10141012-200A000LF Amphenol Communications Solutions PwrMAX® Power Connector, Right Angle, Plug, 2P No Guide pin Visit Amphenol Communications Solutions
    SF Impression Pixel

    200A00 Price and Stock

    TE Connectivity ASA874N0085200A000

    CONN PLG HSG FMALE 17POS INLINE
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    DigiKey ASA874N0085200A000 Box 171 1
    • 1 $26.6
    • 10 $20.513
    • 100 $16.94933
    • 1000 $13.72812
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    Interstate Connecting Components ASA874N0085200A000
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    Honeywell Sensing and Control CSHV1200A-001

    CSHV1200A-001 CURRENT SENSOR
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    DigiKey CSHV1200A-001 Box 99 1
    • 1 $47.31
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    • 100 $44.7876
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    Mouser Electronics CSHV1200A-001 95
    • 1 $46.26
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    Newark CSHV1200A-001 Bulk 25 1
    • 1 $46.84
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    TTI CSHV1200A-001 Bulk 100 5
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    • 100 $32.74
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    Master Electronics CSHV1200A-001
    • 1 $25.34
    • 10 $22.62
    • 100 $18.12
    • 1000 $16.45
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    Maxim Integrated Products SC2200A-00A00

    IC AMP CDMA 698MHZ-2.7GHZ 80QFN
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    DigiKey SC2200A-00A00 Tray 94 1
    • 1 $107.08
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    Newark SC2200A-00A00 Bulk 61 1
    • 1 $94.24
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    Rochester Electronics SC2200A-00A00 397 1
    • 1 $118.97
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    • 100 $111.83
    • 1000 $101.12
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    TE Connectivity ASA876N0085200A000

    CONN PLG HSG FMALE 17POS INLINE
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey ASA876N0085200A000 Box 52 1
    • 1 $26.6
    • 10 $20.513
    • 100 $16.94933
    • 1000 $13.72812
    • 10000 $13.72812
    		Buy Now
    Interstate Connecting Components ASA876N0085200A000
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    TE Connectivity ASA876N0086200A000

    CONN PLG HSG FMALE 17POS INLINE
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey ASA876N0086200A000 Box 26 1
    • 1 $26.6
    • 10 $20.513
    • 100 $16.94933
    • 1000 $13.72812
    • 10000 $13.72812
    		Buy Now
    Interstate Connecting Components ASA876N0086200A000
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    200A00 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    sac 187

    Abstract: MIL-HDBK-217Plus
    Text: BCM48B x 040 y 200A00 PRELIMINARY DATASHEET BCM Bus Converter S US C C FEATURES US DESCRIPTION The V•I Chip™ bus converter is a high efficiency >94% Sine Amplitude Converter™ (SAC™) operating from a 38 to 55 Vdc primary bus to deliver an isolated, unregulated 3.2 to 4.6


    Original     		PDF BCM48B 200A00 sac 187 MIL-HDBK-217Plus

    PRM48AH480

    Abstract: PRM48AH480T200A00
    Text: PRM48AH480 X 200A00 PRM Regulator FEATURES •        48V input 36V to 75V , non-isolated ZVS buck‐boost regulator 20V to 55V adjustable output range 200W output power in .57in2 footprint 96.7% typical efficiency, at full load


    Original     		PDF PRM48AH480 200A00 57in2 MILHDBK217Plus PRM48AH480T200A00

    Shipping Trays

    Abstract: A104 A108 A113 W72M64VK-XBX
    Text: W72M64VK-XBX Application Note W72M64VK-XBX PACKAGE CONSTRUCTION + QUALIFICATION ORGANIZATION TEST 2M x 64 4 banks per Flash Burn-In – 100%-48 hours at 125°C Final Electrical Test – 100% at maximum and minimum ambient temperatures Temperature Ranges Available:


    Original     		PDF W72M64VK-XBX W72M64VK-XBX Sn63/Pb37 762mm EIA/JESD22 C/85RH Shipping Trays A104 A108 A113

    SN46

    Abstract: PB46 JESD22 A104 A108 A113 WED3C750A8M-200BX
    Text: White Electronic Designs WED3C750A8M-200-BX WED3C7558M-300-BX POWER PC™ MULTI-CHIP PACKAGE CONSTRUCTION HIGH RELIABILITY FLIP CHIP ATTACH TEST • C4 Assembly on PowerPCÔ Processors & SSRAM die ■ Burn-In - 100%, 48 hours at 125°C ■ Final Electrical Test - 100% at maximum and


    Original     		PDF WED3C750A8M-200-BX WED3C7558M-300-BX Sn46/Pb46/Bi8 835mm EIA/JESD22 200A0004-4 200A0004-5 SN46 PB46 JESD22 A104 A108 A113 WED3C750A8M-200BX

    W3E64M16S-XSBX

    Abstract: A104 A108 A113
    Text: W3E64M16S-XSBX Application Note W3E64M16S-XSBX PACKAGE CONSTRUCTION + QUALIFICATION ENCAPSULANT TEST The encapsulant is not injection molded to control wire sweep effects TG = 150°C Moisture sensitivity is to JEDEC level 3 Burn-In – 100%-48 hours at 125°C


    Original     		PDF W3E64M16S-XSBX W3E64M16S-XSBX Sn63/Pb37 EIA/JESD22 200A00004-42) AN0022 A104 A108 A113

    JESD22

    Abstract: W3H32M72E-XSBX A104 A108 A113
    Text: W3H32M72E-XSBX Application Note W3H32M72E-XSBX PACKAGE CONSTRUCTION + QUALIFICATION ENCAPSULANT TEST The encapsulant is not injection molded to control wire sweep effects TG = 150°C Moisture sensitivity is to JEDEC level 3 Burn-In – 100%-48 hours at 125°C


    Original     		PDF W3H32M72E-XSBX W3H32M72E-XSBX Sn63/Pb37 EIA/JESD22 200A00004-45) AN0044 JESD22 A104 A108 A113

    JESD22

    Abstract: SN63 PB37 A104 A108 A113 W332M64V-XSBX
    Text: W332M64V-XSBX Application Note W332M64V-XSBX PACKAGE CONSTRUCTION + QUALIFICATION ENCAPSULANT TEST Thickness around die = 0.015 to 0.020 typical The encapsulant is not injection molded to control wire sweep effects Burn-In – 100%-48 hours at 125°C Final Electrical Test – 100% at maximum and


    Original     		PDF W332M64V-XSBX W332M64V-XSBX Sn63/Pb37 EIA/JESD22 200A00004-X) AN0045 W223M64V-XSBX JESD22 SN63 PB37 A104 A108 A113

    JESD22

    Abstract: A104 A108 A113 W3H32M64E-XSBX
    Text: W3H32M64E-XSBX Application Note W3H32M64E-XSBX PACKAGE CONSTRUCTION + QUALIFICATION ENCAPSULANT TEST The encapsulant is not injection molded to control wire sweep effects TG = 150°C Moisture sensitivity is to JEDEC level 3 Burn-In – 100%-48 hours at 125°C


    Original     		PDF W3H32M64E-XSBX W3H32M64E-XSBX Sn63/Pb37 EIA/JESD22 200A00004-46) AN0019 JESD22 A104 A108 A113

    JESD22

    Abstract: Sn46 PB46 7410E A104 A108 A113 WED3C7410E16M-400BX
    Text: WED3C7410E16M-400BX POWER PC 7410E MULTI-CHIP PACKAGE CONSTRUCTION HIGH RELIABILITY FLIP CHIP ATTACH TEST • C4 Assembly on PowerPC™ Processors & SSRAM die ■ Burn-In - 100%, 48 hours at 125°C ■ JEDEC Level 2 underfill ■ Die Thickness ■ Final Electrical Test - 100% at maximum and


    Original     		PDF WED3C7410E16M-400BX 7410E Sn46/Pb46/Bi8 835mm EIA/JESD22 200A0004-18 JESD22 Sn46 PB46 A104 A108 A113 WED3C7410E16M-400BX

    STi5516

    Abstract: STI5519 sti5518 jtag sti5518 ST20 Embedded Toolset Reference Manual pin out sti5517 JTAG STi5516 STI5518 toolset ST20 Embedded Toolset sti5505
    Text: ST20 Embedded Toolset R2.0 Reference Manual PRELIMINARY DATA ADCS 7250966F ST20 Embedded Toolset R2.0 Reference Manual Issued by the MCDT Documentation Group on behalf of STMicroelectronics Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences


    Original     		PDF 7250966F STMicroelec59 7250966F STi5516 STI5519 sti5518 jtag sti5518 ST20 Embedded Toolset Reference Manual pin out sti5517 JTAG STi5516 STI5518 toolset ST20 Embedded Toolset sti5505