Untitled
Abstract: No abstract text available
Text: Ratioplast - Electronics Homepage: www.ratioplast.de / E-Mail: [email protected] Tel.:+49 0 5741 / 23661-0 / Fax: +49 (0) 5741 / 23661-20 2.5mm TERMINAL / HOUSING Part No.:2501-T-L PART NO. 2501H-02W-L 2501H-03W-L 2501H-04W-L 2501H-05W-L 2501H-06W-L 2501H-07W-L
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2501-T-L
2501H-02W-L
2501H-03W-L
2501H-04W-L
2501H-05W-L
2501H-06W-L
2501H-07W-L
2501H-08W-L
2501H-09W-L
2501H-10W-L
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K8P2815UQB
Abstract: No abstract text available
Text: K8P2815UQB FLASH MEMORY 128Mb B-die Page NOR Specification INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,
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K8P2815UQB
128Mb
20000h-027FFFh
018000h-01FFFFh
010000h-017FFFh
008000h-00FFFFh
007000h-007FFFh
006000h-006FFFh
005000h-005FFFh
004000h-004FFFh
K8P2815UQB
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samsung ba92
Abstract: BA137 k8p3215
Text: K8P6415UQB FLASH MEMORY 64Mb B-die Page NOR Specification INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,
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K8P6415UQB
64-Ball
60Solder
samsung ba92
BA137
k8p3215
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PDF
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K8P3215UQB
Abstract: K8P2815 K8p3215 K8P3215U k8p2815u K8P32 48FBGA samsung nor flash Samsung MCP K8P6415
Text: K8P3215UQB FLASH MEMORY 32Mb B-die Page NOR Specification INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,
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K8P3215UQB
10MAX
48FBGA
48-PIN
1220F
047MAX
K8P3215UQB
K8P2815
K8p3215
K8P3215U
k8p2815u
K8P32
samsung nor flash
Samsung MCP
K8P6415
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PDF
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K8P6415UQB
Abstract: K8P2815 BA141 K8P6415U K8p3215 K8P6415 K8P32 k8p2815u K8P3215U K8P64
Text: K8P6415UQB FLASH MEMORY 64Mb B-die Page NOR Specification INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,
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Original
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K8P6415UQB
047MAX
64-Ball
60Solder
K8P6415UQB
K8P2815
BA141
K8P6415U
K8p3215
K8P6415
K8P32
k8p2815u
K8P3215U
K8P64
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Untitled
Abstract: No abstract text available
Text: Ratioplast-Electronics Ratioplast-Electronics H.Wiedemann GmbH Jockweg 66, D-32312 Lübbecke Tel:+49 0 5741 23661-0 Fax:+49 (0) 5741 23661-20 2.5mm Terminal / Housing Part No.:2501-T-L Wire Range AWG#22-#28 Insulation O.D. 1.70mm(max) Material Finish Brass
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D-32312
2501-T-L
1000M
UL94V-0
2501H-02W-L
2501H-03W-L
2501H-04W-L
2501H-05W-L
2501H-06W-L
2501H-07W-L
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BA142
Abstract: No abstract text available
Text: Target Information FLASH MEMORY K8Q2815UQB 128Mb B-die Page NOR Specification Dual Die Package 56TSOP (64Mb x 2) INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,
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K8Q2815UQB
128Mb
56TSOP)
similar90000h-097FFFh
088000h-08FFFFh
080000h-087FFFh
078000h-07FFFFh
070000h-077FFFh
068000h-06FFFFh
060000h-067FFFh
BA142
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K8P6415
Abstract: K8P32 K8P3215u K8P6415UQB K8P64
Text: Target Information FLASH MEMORY K8P6415UQB 64Mb B-die Page NOR Specification INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,
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Original
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K8P6415UQB
10MAX
48FBGA
48-PIN
1220F
047MAX
K8P6415
K8P32
K8P3215u
K8P6415UQB
K8P64
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PDF
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K8P1615UQB
Abstract: K8P2815 K8P1615U K8P6415U K8P3215U 555H k8p2815u samsung nor flash Samsung MCP 256-w
Text: K8P1615UQB FLASH MEMORY 16Mb B-die Page NOR Specification INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,
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K8P1615UQB
10MAX
48FBGA
48-PIN
1220F
047MAX
K8P1615UQB
K8P2815
K8P1615U
K8P6415U
K8P3215U
555H
k8p2815u
samsung nor flash
Samsung MCP
256-w
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PDF
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Philips FA 145
Abstract: TCS230
Text: User’s Manual 16 R8C/36T-A Group User’s Manual: Hardware RENESAS MCU R8C Family / R8C/3xT-A Series All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by
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R8C/36T-A
R01UH0240EJ0100
Philips FA 145
TCS230
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PDF
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BLOCK DIAGRAM OF TOUCH sensor
Abstract: r5f2136cs 002FE R5F21368snfp R5F21368s R01US0007EJ 0025DH 00285H TCS230
Text: User’s Manual 16 R8C/36T-A Group User’s Manual: Hardware RENESAS MCU R8C Family / R8C/3xT-A Series Preliminary All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by
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R8C/36T-A
R01UH0240EJ0010
BLOCK DIAGRAM OF TOUCH sensor
r5f2136cs
002FE
R5F21368snfp
R5F21368s
R01US0007EJ
0025DH
00285H
TCS230
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Fc32
Abstract: 0025DH 00285H TCS230 0016F
Text: User’s Manual 16 R8C/38T-A Group User’s Manual: Hardware RENESAS MCU R8C Family / R8C/3xT-A Series All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by
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R8C/38T-A
R01UH0241EJ0100
Fc32
0025DH
00285H
TCS230
0016F
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PDF
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K8P3215U
Abstract: K8P2815uqc
Text: Rev. 1.0, May. 2010 K8P2815UQC 128Mb C-die NOR FLASH 60FBGA & 84FBGA, Page Mode 2.7V ~ 3.6V datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed
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K8P2815UQC
128Mb
60FBGA
84FBGA,
80x11=
56-PIN
50TYP
K8P3215U
K8P2815uqc
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PDF
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MAX9060
Abstract: No abstract text available
Text: K8P3315UQB FLASH MEMORY 32Mb B-die Page NOR Specification INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,
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Original
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K8P3315UQB
10MAX
48FBGA
48-PIN
1220F
047MAX
MAX9060
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PDF
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CiA402
Abstract: 6862h 6041H DS402 canopen 6848h CIA DSP 402 7041h 6846H DSP-402 707A
Text: TMCM-341/342/343 and TMCM-351 TMCM-341 TMCM-342 TMCM-343 TMCM-351 CANopen Firmware Manual Version: 1.00 2010-MAR-31 Trinamic Motion Control GmbH & Co KG Sternstraße 67 D - 20 357 Hamburg, Germany http://www.trinamic.com TMCM-341/342/343/351 CANopen Firmware Manual V1.00 / 2010-MAR-31
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TMCM-341/342/343
TMCM-351
TMCM-341
TMCM-342
TMCM-343
2010-MAR-31
TMCM-341/342/343/351
2010-MAR-31)
BB-302]
CiA402
6862h
6041H
DS402 canopen
6848h
CIA DSP 402
7041h
6846H
DSP-402
707A
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motherboard repair Chip level
Abstract: identification locator component mobile
Text: Wired for Management Baseline Wired for Management Baseline Version 2.0 Release Specification to help reduce Total Cost of Ownership for business computers. December 18, 1998 Intel Corporation Version 2.0 Release December 18, 1998 Copyright 1998, Intel Corporation. All rights reserved.
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PDF
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BLOCK DIAGRAM OF TOUCH sensor
Abstract: TCS230
Text: User’s Manual 16 R8C/38T-A Group User’s Manual: Hardware RENESAS MCU R8C Family / R8C/3xT-A Series Preliminary All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by
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Original
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R8C/38T-A
R01UH0241EJ0010
BLOCK DIAGRAM OF TOUCH sensor
TCS230
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PDF
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2482h b3
Abstract: 3204H PL 2305H PMC-2021098 1A27H 171bh 1D18 336FH 1733H 3583H
Text: 14 PM TUPP 2488 ASSP Data Sheet Register Description Released ob sd ay ,2 8O ct TUPP 2488 er ,2 00 4 12 :5 9: PM5364 rtm in er In co n Th ur SONET/SDH Tributary Unit Payload Processor For 2488.32 Mbit/s Interfaces Released Issue No. 6: August 2004 Do wn
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Original
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PMC-2020188,
PM5364
0115H,
011DH:
2482h b3
3204H
PL 2305H
PMC-2021098
1A27H
171bh
1D18
336FH
1733H
3583H
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PDF
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K8P2915UQB
Abstract: BA1104 BA20B ba232b 555H BA1-43-BA1-46 samsung nor flash Samsung MCP ba2112 ba1111
Text: K8P2915UQB FLASH MEMORY 128Mb B-die Page NOR Specification INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,
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K8P2915UQB
128Mb
BA1-13
030000h-037FFFh
BA1-12
028000h-02FFFFh
BA1-11
020000h-027FFFh
BA1-10
018000h-01FFFFh
K8P2915UQB
BA1104
BA20B
ba232b
555H
BA1-43-BA1-46
samsung nor flash
Samsung MCP
ba2112
ba1111
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PDF
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8051 ps2 keyboard asm program
Abstract: NEC720100 an1815 DK3200 ps2 convert a usb USB CONNECTION CIRCUIT AN1843 uPSD32 7508H 19E0H
Text: AN1886 APPLICATION NOTE Low Speed USB Design Using µPSD This application note describes the design of a low-speed USB function for the uPSD32xxA MCU series see Table 2. , and how to use the µPSD USB simple demonstration program. It gives answers to frequently asked questions, and to design issues (such as those to do with the newer USB 2.0 host controllers, see Table 1.) and gives designers the basic elements to design applications using the low-speed USB
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AN1886
uPSD32xxA
8051 ps2 keyboard asm program
NEC720100
an1815
DK3200
ps2 convert a usb
USB CONNECTION CIRCUIT
AN1843
uPSD32
7508H
19E0H
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PDF
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Untitled
Abstract: No abstract text available
Text: User’s Manual 16 R8C/54E Group, R8C/54F Group, R8C/54G Group, R8C/54H Group User’s Manual: Hardware RENESAS MCU R8C Family / R8C/5x Series All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by
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R8C/54E
R8C/54F
R8C/54G
R8C/54H
R01UH0189EJ0200
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PDF
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K8P2815UQB
Abstract: K8P2815 BA231-BA234 K8P6415 K8P3215u
Text: K8P2815UQB FLASH MEMORY 128Mb B-die Page NOR Specification INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,
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Original
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K8P2815UQB
128Mb
27FFFh
018000h-01FFFFh
010000h-017FFFh
008000h-00FFFFh
007000h-007FFFh
006000h-006FFFh
005000h-005FFFh
004000h-004FFFh
K8P2815UQB
K8P2815
BA231-BA234
K8P6415
K8P3215u
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PDF
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identification locator component mobile
Abstract: wfm20 app abstract
Text: Wired for Management Baseline :LUHG IRU 0DQDJHPHQW %DVHOLQH Version 2.0 Specification to help reduce Total Cost of Ownership for business computers. December 28, 1998 Intel Corporation Version 2.0 December 28, 1998 Copyright 1998, Intel Corporation. All rights reserved.
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RCA SK CROSS-REFERENCE
Abstract: CD4003 2N2505 TF408 1N4465 250PA120 2N3017 pt 3570 trw rf pa189 Semicon volume 1
Text: 1969 o < 00 x ic e uo <r\ *—4 rO O CM u J 'r < o o o CO r aJ. rfrr.~> y -< z X— < P“ -J Sem iconductor Annual At .0008" Dia. . . . there is no second source phire orifice insert. Tempress also created and supplied the tungsten carbide ultrasonic bonding tool and pioneered
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OCR Scan
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PDF
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