2675 SO8 Search Results

2675 SO8 Result Highlights (2)

Part	ECAD Model	Manufacturer	Description	Download	Buy
HD6432675XXXFC		Renesas Electronics Corporation	High-end Microcontrollers for Automotive Control and Factory Automation Applications (Non Promotion)
HD6432675XXXFCI		Renesas Electronics Corporation	High-end Microcontrollers for Automotive Control and Factory Automation Applications (Non Promotion)

2675 SO8 Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
madj Abstract: LM2675ADJ Text: LM2675 www.ti.com SNVS129E – MAY 2004 – REVISED JUNE 2005 LM2675 SIMPLE SWITCHER Power Converter High Efficiency 1A Step-Down Voltage Regulator Check for Samples: LM2675 FEATURES 1 • Efficiency up to 96% • Available in SO-8, 8-pin DIP and LLP packages	Original	LM2675 SNVS129E LM2675 LM267X madj LM2675ADJ	PDF
NICHICON DATE CODE MARKING Abstract: LM2675LD-3 LM2675ADJ 2675m5.0 LM2675-5 SIMPLE SWITCHER PCB Layout Guidelines LM267XSIMPLE 2675m5 SIMPLE SWITCHER Regulators 2675M-12 Text: LM2675 SIMPLE SWITCHER Power Converter High Efficiency 1A Step-Down Voltage Regulator General Description The LM2675 series of regulators are monolithic integrated circuits built with a LMDMOS process. These regulators provide all the active functions for a step-down buck	Original	LM2675 10-Feb-99 8-Nov-00 29-Jul-02 5-Aug-2002] NICHICON DATE CODE MARKING LM2675LD-3 LM2675ADJ 2675m5.0 LM2675-5 SIMPLE SWITCHER PCB Layout Guidelines LM267XSIMPLE 2675m5 SIMPLE SWITCHER Regulators 2675M-12	PDF
IRF7328 Abstract: No abstract text available Text: IRF7328 Electrical Characteristics @ TJ = 25°C unless otherwise specified ∆V(BR)DSS/∆TJ Parameter Drain-to-Source Breakdown Voltage Breakdown Voltage Temp. Coefficient RDS(on) Static Drain-to-Source On-Resistance VGS(th) gfs Gate Threshold Voltage Forward Transconductance	Original	IRF7328 IRF7328	PDF
Untitled Abstract: No abstract text available Text: PD - 95196A IRF7328PbF HEXFET Power MOSFET lÿÿTrench Technology lÿÿUltra Low On-Resistance lÿ Dual P-Channel MOSFET lÿ Available in Tape & Reel lÿ Lead-Free VDSS -30V RDS on max ID 21mΩ@VGS = -10V -8.0A 32mΩ@VGS = -4.5V -6.8A Description New trench HEXFET® Power MOSFETs from	Original	5196A IRF7328PbF EIA-481 EIA-541.	PDF
F7101 Abstract: IRF7101 IRF7328PBF 2675 so8 Text: PD - 95196A IRF7328PbF HEXFET Power MOSFET lÿÿTrench Technology lÿÿUltra Low On-Resistance lÿ Dual P-Channel MOSFET lÿ Available in Tape & Reel lÿ Lead-Free VDSS -30V RDS on max ID 21mΩ@VGS = -10V -8.0A 32mΩ@VGS = -4.5V -6.8A Description New trench HEXFET® Power MOSFETs from	Original	5196A IRF7328PbF EIA-481 EIA-541. F7101 IRF7101 IRF7328PBF 2675 so8	PDF
IRF7101 Abstract: z 409 Text: PD - 95196 IRF7328PbF HEXFET Power MOSFET Trench Technology Ultra Low On-Resistance ● Dual P-Channel MOSFET ● Available in Tape & Reel ● Lead-Free ● VDSS ● -30V RDS on max ID 21mΩ@VGS = -10V -8.0A 32mΩ@VGS = -4.5V -6.8A Description New trench HEXFET® Power MOSFETs from	Original	IRF7328PbF EIA-481 EIA-541. IRF7101 z 409	PDF
IRF7328 Abstract: No abstract text available Text: PD -94000 IRF7328 HEXFET Power MOSFET ● ● ● ● Trench Technology Ultra Low On-Resistance Dual P-Channel MOSFET Available in Tape & Reel VDSS -30V RDS on max ID 21mΩ@VGS = -10V -8.0A 32mΩ@VGS = -4.5V -6.8A Description New trench HEXFET® Power MOSFETs from	Original	IRF7328 ie52-7105 IRF7328	PDF
MO-83-AF Abstract: PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128 Text: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336	Original	XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 MO-83-AF PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128	PDF
footprint jedec MS-026 TQFP Abstract: JEDEC MS-026 footprint qfp 64 0.5 mm pitch land pattern fine BGA thermal profile schematic impulse sealer HQ208 PQ100 land pattern QFP 208 PQ208 TQ100 Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or	Original		PDF
JEDEC Package Code MS-026-AED Abstract: EFTEC-64 schematic impulse sealer footprint jedec MS-026 TQFP PQ-208 footprint jedec MS-026 TQFP 128 QFP PACKAGE thermal resistance die down EIA standards 481 ipc-sm-786A VQ44 Text: • Packages and Thermal Characteristics  November 20, 1997 Version 2.0 10* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or	Original		PDF
PCB footprint cqfp 132 Abstract: schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318 Text: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336	Original	XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 PCB footprint cqfp 132 schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318	PDF
footprint jedec MS-026 TQFP 128 Abstract: schematic impulse sealer footprint jedec MS-026 TQFP JEDEC Package Code MS-026-AED BGA 11x11 junction to board thermal resistance QFP Package 128 lead .5mm .65mm bga land pattern MS-026-BGA Shipping Trays 16x16 XC4010E-PQ208 Text: Packages and Thermal Characteristics  June 1, 1996 Version 1.1 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336	Original	XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 footprint jedec MS-026 TQFP 128 schematic impulse sealer footprint jedec MS-026 TQFP JEDEC Package Code MS-026-AED BGA 11x11 junction to board thermal resistance QFP Package 128 lead .5mm .65mm bga land pattern MS-026-BGA Shipping Trays 16x16 XC4010E-PQ208	PDF
schematic impulse sealer Abstract: qfp 64 0.4 mm pitch land pattern Rotron pk100 power supply XC4013E-PQ240 EFTEC-64 XC4010E-PQ208 MO-151-AAN-1 PK100 land pattern for TSOP 2 86 PIN Text: Packages and Thermal Characteristics: High-Reliability Products R 0 5 PK100 v1.0 June 15, 2000 Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or 0.100").	Original	PK100 060ROM schematic impulse sealer qfp 64 0.4 mm pitch land pattern Rotron pk100 power supply XC4013E-PQ240 EFTEC-64 XC4010E-PQ208 MO-151-AAN-1 PK100 land pattern for TSOP 2 86 PIN	PDF
schematic impulse sealer Abstract: XC4010E-PQ208 JEDEC Package Code MS-026-AED XC4013E-PQ240 JEDEC MS-026 footprint MS-026-ACB footprint jedec MS-026 TQFP 128 XC4013E-BG225 PG299-XC4025E bav 21 diode Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or	Original		PDF

schematic impulse sealer Abstract: leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481 Text: Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or	Original	FG860 FG900 FG1156 schematic impulse sealer leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481	PDF
ADS7924 Abstract: TRF3761-E CDCLVC1102 INA3221 Text: Analog Signal Chain Guide Amplifiers Data Converters Interface Clocks and Timing Sensing Wireless Connectivity www.ti.com 2013 Analog Signal Chain Guide Table of Contents Overview. 3 Interface Amplifiers and Comparators	Original		PDF
XAPP186 Abstract: XC4025E-4PG299 XC3090-100PG175 XC4013E-4CB228 XAPP151 XQ4036XL-3HQ240N XC3042-100PG84 XQ4028EX4HQ240N XC3042-100PG132 5962-9752501QYC Text: R 0 0 July 1, 2000 v1.0 The Website is Always Current Important Information You Need to Know About This Data Book Whenever Xilinx updates technical data on its products, the first place that information goes is to the Xilinx website. To find the absolutely latest technical product data from Xilinx, simply go	Original		PDF
ph 4148 zener diode Abstract: philips zener diode ph 4148 pcf0700p Zener Diode ph 4148 PCA1318P ck2605 pcf0700p/051 philips Pca1318p on4673 Zener Diode 4148 Text: PHILIPS SEMICONDUCTORS PRODUCT DISCONTINUATION NOTICE NUMBER DN-40 DATED DECEMBER 31, 1998 EXHIBIT 'A' PHILIPS PHILIPS PHILIPS PART NUMBER PKG PART DESCRIPTION LAST TIME LAST TIME REPLACEMENT STATUS 12 NC NUMBER BUY DATE DLVY DATE PART CODE S COMMENTS DISCONTINUED INTEGRATED CIRCUIT PRODUCTS	Original	DN-40 74ABT126 74ABT2240 X3G-BZX84-C7V5 X3G-BZX84-C9V1 ph 4148 zener diode philips zener diode ph 4148 pcf0700p Zener Diode ph 4148 PCA1318P ck2605 pcf0700p/051 philips Pca1318p on4673 Zener Diode 4148	PDF
PIC16F72 inverter ups Abstract: UPS inverter PIC16F72 PIC16F676 inverter hex code 16F877 with sd-card and lcd project circuit diagram wireless spy camera NH82801GB xmega-a4 online ups service manual back-ups ES 500 ARM LPC2148 INTERFACING WITH RFID circuit diagram realtek rtd 1186 Text: the solutions are out there you just haven’t registered yet. RoadTest the newest products in the market! View the latest news, design support and hot new technologies for a range of applications Join the RoadTest group and be in with a chance to trial exclusive new products for free. Plus, read	Original	element-14 element14. element14, PIC16F72 inverter ups UPS inverter PIC16F72 PIC16F676 inverter hex code 16F877 with sd-card and lcd project circuit diagram wireless spy camera NH82801GB xmega-a4 online ups service manual back-ups ES 500 ARM LPC2148 INTERFACING WITH RFID circuit diagram realtek rtd 1186	PDF
philips lcd 15.4 pinout Abstract: mbus master broadcom switch D14290 lt 8219 CQ 523 Text: MSC8154 Reference Manual Quad Core Digital Signal Processor MSC8154RM Rev 0, September 2010 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516	Original	MSC8154 MSC8154RM EL516 philips lcd 15.4 pinout mbus master broadcom switch D14290 lt 8219 CQ 523	PDF
Untitled Abstract: No abstract text available Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA MRF8372 The RF Line NPN Silicon High-Frequency TVansistor . . . designed primarily for wideband large signal predriver stages in 800 MHz and UHF frequency ranges. • Specified @ 12.5 V, 870 MHz Characteristics Output Power = 750 mW	OCR Scan	MRF8372 9-j20 MRF8372	PDF
lt 032 b140 Abstract: nichicon hf series capacitor Text: Semiconductor LM2675 SIMPLE SWITCHER Power Converter High Efficiency 1A Step-Down Voltage Regulator General Description Requiring a minimum number of external components, these regulators are simple to use and include patented internal frequency compensation Patent Nos. 5,382,918 and	OCR Scan	LM2675 fre0-272-9959 lt 032 b140 nichicon hf series capacitor	PDF
FZH 191 Abstract: FZJ 101 FZH 261 fzh 111 fzh 171 FZH111 FZH 101 FZH 161 fzh 141 fzh 281 Text: Elektronik. Wir bauen die Elemente. • VflLVO Professionelle Integrierte Schaltungen, Mikroprozessoren Produktprogramm Elektronik. Wir bauen die Elemente Unser Arbeitsgebiet - besonders die M ikroelektronik - entwickelt sich im m er rascher zum M otor für eine	OCR Scan	Integrie8510. FZH 191 FZJ 101 FZH 261 fzh 111 fzh 171 FZH111 FZH 101 FZH 161 fzh 141 fzh 281	PDF
BPW22A Abstract: cm .02m z5u 1kv pin configuration of BFW10 la4347 B2X84 TDA3653 equivalent TRIAC TAG 9322 HEF40106BP equivalent fx4054 core dsq8 Text: Contents Page Page New product index Combined index and status codes viii x Mullard approved components BS9000, CECC, and D3007 lists CV list Integrated circuits Section index xliii 1 5 Standard functions LOGIC FAMILIES CMOS HE4000B family specifications CMOS HE4000B family survey	OCR Scan	BS9000, D3007 HE4000B 80RIBUTION BS9000 BPW22A cm .02m z5u 1kv pin configuration of BFW10 la4347 B2X84 TDA3653 equivalent TRIAC TAG 9322 HEF40106BP equivalent fx4054 core dsq8	PDF

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2675 SO8 Search Results

2675 SO8 Result Highlights (2)

2675 SO8 Datasheets Context Search

madj

NICHICON DATE CODE MARKING

IRF7328

Untitled

F7101

IRF7101

IRF7328

MO-83-AF

footprint jedec MS-026 TQFP

JEDEC Package Code MS-026-AED

PCB footprint cqfp 132

footprint jedec MS-026 TQFP 128

schematic impulse sealer

schematic impulse sealer

schematic impulse sealer

ADS7924

XAPP186

ph 4148 zener diode

PIC16F72 inverter ups

philips lcd 15.4 pinout

Untitled

lt 032 b140

FZH 191

BPW22A