footprint plcc 208
Abstract: PLASTIC QUAD FLAT PACK 160 PINS DIMENSION LXT304A LXT305A LXT307 LXT310 LXT317 LXT318 LXT325 A 3120 8 Pins ICs
Text: Fall 1998 Communication ICs Data Book Table 1: Telecom Product/Packages Product Table 1: Telecom Product/Packages Product Package Package SXT6051 208 QFP SXT6251 208 QFP SXT6282 144-Pin LQFP LXT300Z/301Z 28-Pin DIP and 28-Pin PLCC LXT304A 28-Pin DIP and 28-Pin PLCC
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SXT6051
SXT6251
SXT6282
144-Pin
LXT300Z/301Z
28-Pin
LXT304A
footprint plcc 208
PLASTIC QUAD FLAT PACK 160 PINS DIMENSION
LXT304A
LXT305A
LXT307
LXT310
LXT317
LXT318
LXT325
A 3120 8 Pins ICs
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a06 transistor
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE 28 PIN CERAMIC FPT-28C-A06 Lead pitch 50mil Package width x package length 11.40 × 11.40mm Lead shape Gullwing Sealing method Metal seal Length of flat portion of pins 0.80mm TYP 28-pin ceramic QFP FPT-28C-A06 28-pin ceramic QFP
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FPT-28C-A06
50mil
28-pin
FPT-28C-A06)
10DIA.
a06 transistor
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Untitled
Abstract: No abstract text available
Text: SMALL OUTLINE PACKAGE 28 PIN CERAMIC FPT-28C-A07 28-pin ceramic QFP Lead pitch 50mil Package width x package length 11.40 × 11.40mm Lead shape Gullwing Sealing method Metal seal Length of flat portion of pins 0.48mm FPT-28C-A07 28-pin ceramic QFP (FPT-28C-A07)
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FPT-28C-A07
50mil
28-pin
FPT-28C-A07)
F28024SC-3-3
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Untitled
Abstract: No abstract text available
Text: PA32Q1498-28D6-21 Data Sheet 32 pin QFP socket/28 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction This adapter allows programming of 32 pin QFP devices in their 28 pin DIP footprint. The adapter is made up of 3 sub-assemblies. They assemble via
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PA32Q1498-28D6-21
socket/28
mega88
28DIP
PA32QF1498-28D6-21
32Q28D21
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FPQ-128-0
Abstract: No abstract text available
Text: PA1048C-128 Data Sheet 128 pin QFP socket/28 pin DIP 0.6" plug Supported Device/Footprints Adapter Wiring Using this adapter several 128 pin Lattice devices in QFP packages can be programmed on 28 pin DIP programmers. The following chart shows the connections from the QFP device
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PA1048C-128
socket/28
pLSI1048C
ispLSI1048C
pLSI2096
ispLSI2096
FPQ-128-0
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Untitled
Abstract: No abstract text available
Text: PA32Q1498-28D6-20 Data Sheet 32 pin QFP socket/28 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction This adapter allows programming of 32 pin QFP devices in their 28 pin DIP footprint. The adapter is made up of 3 sub-assemblies. They assemble via
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PA32Q1498-28D6-20
socket/28
AT90S2333,
AT90LS4433,
AT90S4433,
AT90LS4433
28DIP
IC51-0324-1498
PA32QF1498-28D6-20
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Untitled
Abstract: No abstract text available
Text: PA711D3-QFP Data Sheet 44 pin QFP socket/28 pin DIP 0.6” plug Supported Device/Footprints Adapter Wiring Using this adapter, the Motorola 68HC711D3 in the QFP package can be programmed on 28 pin DIP programmers. The following chart shows the connections from the QFP device
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PA711D3-QFP
socket/28
68HC711D3
27C256
711D3QFP
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Untitled
Abstract: No abstract text available
Text: PA-H8/3332- T 80 Data Sheet 80 pin QFP(TQFP) socket/28 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction These adapters allow EPROM programming of Hitachi H8/3332 & H8/3334 devices in their QFP or TQFP packages on 28 pin DIP programmers.
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PA-H8/3332-
socket/28
H8/3332
H8/3334
H8/3332,
H8/3334
27C256
FP-80A
H8332-80
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PQFP160
Abstract: No abstract text available
Text: QUAD FLAT PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 160 PIN PLASTIC FPT-160P-M15 160-pin plastic QFP FPT-160P-M15 160-pin plastic QFP (FPT-160P-M15) Lead pitch 0.65 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Plastic mold
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FPT-160P-M15
160-pin
FPT-160P-M15)
P-QFP160-28
F160037S-c-3-3
PQFP160
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Untitled
Abstract: No abstract text available
Text: PA28-32-20-Dx-QF Data Sheet 28 pin DIP 0.3” socket /32 pin QFP plug Adapter Dimensions Supported Device/Footprints The PA28-32-20-Dx-QF adapters accept 28 pin DIP devices and have a removable 32 pin QFP solder-down plug. This allows DIP devices, or emulators with DIP plugs, to be used during
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PA28-32-20-Dx-QF
AT90S2333,
AT90LS4433,
AT90S4433,
AT90LS4433
32QFP
PA28-32-20-DZ-QF
PA28-32-20DxQF
283220DQ
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QFP144
Abstract: QFP Package 144 lead QFP144-P-2828-2
Text: QUAD FLAT L-LEADED PACKAGE 144 PIN PLASTIC FPT-144P-M02 EIAJ code : ∗QFP144-P-2828-2 144-pin plastic QFP Lead pitch 0.65 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Plastic mold FPT-144P-M02 144-pin plastic QFP (FPT-144P-M02)
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FPT-144P-M02
QFP144-P-2828-2
144-pin
FPT-144P-M02)
QFP144
QFP Package 144 lead
QFP144-P-2828-2
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Untitled
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN PLASTIC FPT-208P-M04 208-pin plastic QFP Lead pitch 0.50 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Plastic mold Thermal resistance Low thermal resistance type
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FPT-208P-M04
208-pin
FPT-208P-M04)
F208020S-1C-1
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FPT-256P-M06
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC To Top / Package Lineup / Package Index FPT-256P-M06 256-pin plastic QFP Lead pitch 0.40 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Plastic mold
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FPT-256P-M06
256-pin
FPT-256P-M06)
75MAX
20REF
60NOM
10MAX
36MAX
FPT-256P-M06
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QFP PACKAGE thermal resistance
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN PLASTIC To Top / Package Lineup / Package Index FPT-208P-M04 208-pin plastic QFP Lead pitch 0.50 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Plastic mold
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FPT-208P-M04
208-pin
FPT-208P-M04)
F208020S-1C-1
QFP PACKAGE thermal resistance
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28-pin quad packages
Abstract: a06 transistor
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC To Top / Package Lineup / Package Index FPT-28C-A06 28-pin ceramic QFP Lead pitch 50 mil Package width x package length 11.40 × 11.40 mm Lead shape Gullwing Sealing method Metal seal
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FPT-28C-A06
28-pin
FPT-28C-A06)
10DIA.
F28029SC-2-2
28-pin quad packages
a06 transistor
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QFP160-P-2828-4
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 160 PIN PLASTIC To Top / Package Lineup / Package Index FPT-160P-M04 EIAJ code :∗QFP160-P-2828-4 160-pin plastic QFP Lead pitch 0.65 mm Package width x package length 28 × 28 mm Lead shape Gullwing
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FPT-160P-M04
QFP160-P-2828-4
160-pin
FPT-160P-M04)
F160005S-3C-2
QFP160-P-2828-4
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QFP208-P-2828-1
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN PLASTIC To Top / Package Lineup / Package Index FPT-208P-M01 EIAJ code :∗QFP208-P-2828-1 208-pin plastic QFP Lead pitch 0.50 mm Package width x package length 28 × 28 mm Lead shape Gullwing
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FPT-208P-M01
QFP208-P-2828-1
208-pin
FPT-208P-M01)
F208001S-3C-3
QFP208-P-2828-1
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QFP160-P-2828-5
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 160 PIN PLASTIC To Top / Package Lineup / Package Index FPT-160P-M08 EIAJ code :∗QFP160-P-2828-5 160-pin plastic QFP Lead pitch 0.65 mm Package width x package length 28 × 28 mm Lead shape Gullwing
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FPT-160P-M08
QFP160-P-2828-5
160-pin
FPT-160P-M08)
F160012S-2C-2
QFP160-P-2828-5
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Untitled
Abstract: No abstract text available
Text: SMALL OUTLINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC To Top / Package Lineup / Package Index FPT-28C-A07 28-pin ceramic QFP Lead pitch 50 mil Package width x package length 11.40 × 11.40 mm Lead shape Gullwing Sealing method Metal seal Length of flat
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FPT-28C-A07
28-pin
FPT-28C-A07)
F28024SC-3-3
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Untitled
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 104 PIN PLASTIC FPT-104P-M01 104-pin plastic QFP Lead pitch 0.80 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Plastic mold Length of flat portion of pins 0.80 mm
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FPT-104P-M01
104-pin
FPT-104P-M01)
F104001S-1C-5
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Z86C71
Abstract: Z86L02 Z86L04 Z86L70 Z86L71 Z86L75 Z86L78 Z86L79 Z86L80 Z86L88
Text: INFRARED REMOTE CONTROLLERS Product Family Z86L02 Z86L04 Z86L70 Z86L75 Z86L29 Z86L71 Z86C71 Z86L78 Z86L79 Z86L80 Z86L88 Z86L81 Z86L86 Z86L87 Z86L72 Z86C72 Z86E72 Z86L89 Z86L73 Z86E73 Z86L92 Pin Count ROM KB OTP 18 18 18 18 18 20 20 20 28 28 28 28 28 40, 44
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Z86L02
Z86L04
Z86L70
Z86L75
Z86L29
Z86L71
Z86C71
Z86L78
Z86L79
Z86L80
Z86C71
Z86L02
Z86L04
Z86L70
Z86L71
Z86L75
Z86L78
Z86L79
Z86L80
Z86L88
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Untitled
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 120 PIN CERAMIC To Top / Package Lineup / Package Index FPT-120C-C01 120-pin ceramic QFP Lead pitch 0.80 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Cerdip Length of flat
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FPT-120C-C01
120-pin
FPT-120C-C01)
F120011SC-3-2
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QFP 144 PACKAGE
Abstract: QFP144-P-2828-1
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 144 PIN PLASTIC To Top / Package Lineup / Package Index FPT-144P-M01 EIAJ code :∗QFP144-P-2828-1 144-pin plastic QFP Lead pitch 0.65 mm Package width x package length 28 × 28 mm Lead shape Gullwing
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FPT-144P-M01
QFP144-P-2828-1
144-pin
FPT-144P-M01)
F144002S-3C-2
QFP 144 PACKAGE
QFP144-P-2828-1
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sharp mask rom 44-pin
Abstract: mask programmable rom sharp mask rom 532595
Text: CMOS 256K 32K x 8 Mask Programmable ROM FEATURES • • • • • • PIN CONNECTIONS 32,768 x 8 bit organization Access time: 28-PIN DIP 28-PIN SOP TOP VIEW - \ 28 □ Vcc f 150 ns (MAX.) NCC 1• A12C 2 27 □ a 7C 3 26 □ Ai3 Operating: 110 mW (MAX.)
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OCR Scan
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28-PIN
28-pin,
600-mil
450-mil
44-pin,
44-PIN
LH53259
I-------15
sharp mask rom 44-pin
mask programmable rom
sharp mask rom
532595
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