14AD
Abstract: 28P2V SOP28 package SOP28-P-375-1 MS-013-AE
Text: 28P2V-A Plastic 28pin 375mil SOP EIAJ Package Code SOP28-P-375-1.27 JEDEC Code MS-013AE Weight g 0.67 Lead Material Cu Alloy e 15 E Recommended Mount Pad 1 Symbol F 14 A D A2 A1 b y L e L1 HE e1 I2 28 b2 A A1 A2 b c D E e HE L L1 y c Detail F b2 e1 I2 Dimension in Millimeters
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28P2V-A
28pin
375mil
OP28-P-375-1
MS-013AE
14AD
28P2V
SOP28 package
SOP28-P-375-1
MS-013-AE
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432W6
Abstract: 48P4B hssop 44P3W-R 28P0 5P5T tsop 2-54 42P9R 70P3S-M 479F7G
Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES LIST OF PACKAGE CODES CLASSIFIED ACCORDING TO PIN NUMBER 1. LIST OF PACKAGE CODES CLASSIFIED ACCORIDING TO PIN NUMBER Pin Count Structure Type Lead Pitch mm 5 P P P P P P C C P P P C P P P P P P P P C P P P P P P P
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240K6X-A
240P6Y-A
240P6Z-A
255F7F
256F7B
256F7X-A/B
256P6J-E
256P6K-E
272F7X-A/B
281S8-C
432W6
48P4B
hssop
44P3W-R
28P0
5P5T
tsop 2-54
42P9R
70P3S-M
479F7G
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sharp lsi pc 2002
Abstract: AXS628319C P28GM-50-450A1-2 FRAME32
Text: AXS6 SOP SOCKETS AXS6 µSOCKET SERIES IC SOCKETS FOR SMALL OUTLINE PACKAGE 3. Space saving The socket occupies an area only 1.25 times the size of the IC. High density mounting is possible even if the socket is used. 4. Automated mounting compatible The socket has an open flat construction
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TSOP 48 thermal resistance
Abstract: TSOP 66 Package thermal resistance QFP PACKAGE thermal resistance TSOP 66 thermal resistance thermal resistance standards C8866 TSOP 54 thermal resistance 80p6n TSOP 66 Package 28P2V
Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE THERMAL RESISTANCE 5.4 IC PACKAGE THERMAL RESISTANCE Table 2 shows the thermal resistance of representative IC packages. The symbol θja refers to thermal resistance from the chip to the air. Thermal resistance may differ depending on the size of chips in the package. Refer to appendices to our product delivery standards.
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300mil
64P4B
16P2P
20P2N
375mil
28P2V
300mil
26P3D
400mil
TSOP 48 thermal resistance
TSOP 66 Package thermal resistance
QFP PACKAGE thermal resistance
TSOP 66 thermal resistance
thermal resistance standards
C8866
TSOP 54 thermal resistance
80p6n
TSOP 66 Package
28P2V
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48P4B
Abstract: P/N146071 hssop 432W6 70P3S-M 10C2-C 136P6S-C 20P5A
Text: 3. DETAILED DIAGRAM OF PACKAGE OUTLINES LIST OF PACKAGE CODES CLASSIFIED ACCORIDING TO PACKAGE TYPE Pin Count Structure 5 8 8 10 12 9 12 12 14 16 20 24 8 14 16 18 18 20 20 22 22 24 24 24 24 28 28 28 30 32 32 32 40 42 20 28 30 32 36 40 42 48 52 64 P P P P P
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240K6X-A
30S1B
42S1B-A
52S1B-B
64S1B-E
124S8
135S8-F
145S8
149S8
177S8
48P4B
P/N146071
hssop
432W6
70P3S-M
10C2-C
136P6S-C
20P5A
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AXS628319
Abstract: ATMEL soldering iron
Text: AXS6.fm 169 ページ ２００３年１２月２２日 月曜日 午後１２時１１分 AXS6 SOP IC SOCKETS AXS6 µSOCKET SERIES IC SOCKETS FOR SMALL OUTLINE PACKAGE 3. Space saving The socket occupies an area only 1.25 times the size of the IC. High density
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10C2
Abstract: 144PFB-A 48P4B 16P2S-A 240mil hssop Package tray dimension 12P9 16P2Z-A 18P4G
Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE SPECIFICATIONS 3.1 INDIVIDUAL PACKS Each type of package is used to carry individually packed products as listed below: PACKAGE AND INDIVIDUAL PACK LIST Package Type SIP HSIP ZIP DIP SDIP Package Name Standard Dimension
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12P9B
14P5A
16P5A
20P5A
24P5A
18P4G
20P4G
22P4H
24P4D
24P4Y
10C2
144PFB-A
48P4B
16P2S-A
240mil
hssop
Package tray dimension
12P9
16P2Z-A
18P4G
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324pc
Abstract: L198 L-088 930PC 12P9B 300mil trays 4028PC L199 SP080 pt881
Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE SPECIFICATIONS 3.2 PACKAGE AND CARTON SERIAL NUMBER AND STANDARD CAPACITY TUBES STANDARD PACKAGING 240mil Individual Pack Qty/Individual Tube No. Pack ( ) 45 SP050PC 340mil SP070PC Package Type Package Name Standard Dimension
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240mil
SP050PC
340mil
SP070PC
440mil
12P9B
14P5A
16P5A
20P5A
24P5A
324pc
L198
L-088
930PC
12P9B
300mil trays
4028PC
L199
SP080
pt881
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tgn 600
Abstract: No abstract text available
Text: RN 1C PAK N uaent Specifications for SOP Sockets MATERIALS Body & Frame: Glass reinforced PPS UL 94V-0 Contact: Plating: TT = 2.03 pm (80 flinch) Tin/Lead overall. Phosphor Bronze 1.27 pm (50 pinch) Nickel underplate. SOCKETS ELECTRICAL Current Rating: 0.5 Ampere per contact
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980m/S2
OP-40DXX-SMT-TT
OP-44EXX-SMT-TT
tgn 600
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Untitled
Abstract: No abstract text available
Text: SOP — XX C XX — SMT — TT Plating Position:. 28, 32 C = .450" Row Spacing Blank = Tube Pack TP = Tape and Reel body only ‘ Frames are packaged in vinyl bags T00S371 DD0D3tj7 PC Doara oattern 2 B 37T WWW 1. 271Q. 05 32 B A 2 1.85 24. B 16.51 19. 0 5
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T00S371
1650-300B,
FP-20DA,
FP-20-D
375mil)
P20GM-50-375B-3,
P20GT-50-375B-2
FPT-20P-M02
751D-03
P24GM-50-300B-2
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94v-0 m02
Abstract: ATMEL 32P
Text: SOCKETS SOP — 32 D XX — SMT — TT n Position:. 32 D = .525" Row Spacing Plating Blank = Tube Pack TP = Tape and Reel body only ‘ Frames are packaged in vinyl bags ^005371 00003bfl D HGb PC board pattern j j P S ' ± 0.3 General Tolerance ALL DIMENSIONS
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00003bfl
OP-32DXX-SMT-XX
Rati0GM-50-300B,
FP-20DA,
FP-20-D
375mil)
P20GM-50-375B-3,
P20GT-50-375B-2
FPT-20P-M02
751D-03
94v-0 m02
ATMEL 32P
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Robinson Nugent IC SOCKET
Abstract: No abstract text available
Text: SOCKETS SOP — XX B XX — SMT — TT Plating Position:. 20, 28 . Blank = Tube Pack TP = Tape and Reel body only ‘ Frames are packaged in vinyl bags ‘nEOOOO TiESOOb B = .375" Row Spacing EEh s' PC board 1 = Body 2 = Frame 3 = SO Package IC oattern 1. 2 7 ± Q. Q5
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Plat50-300B,
FP-20DA,
FP-20-D
375mil)
P20GM-50-375B-3,
P20GT-50-375B-2
FPT-20P-M02
751D-03
P24GM-50-300B-2
Robinson Nugent IC SOCKET
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M66503AFP
Abstract: 6503A M66503ASP/FP
Text: MITSUBISHI DIGITAL ASSP M66503ASP/FP 16-BIT CONSTANT CURRENT LED DRIVER with SHIFT REGISTER AND LATCH DESCRIPTION PIN CONFIGURATION (TOP VIEW) T h e M 6 6 5 0 3 A is a c o n s ta n t c u rre n t LED d riv e r IC, w h o se o u tp u t c u rre n t is v aria ble. T h e IC 's fu n c tio n s in clu d e 16-bit
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M66503ASP/FP
16-BIT
M66503AFP
6503A
M66503ASP/FP
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M66503ASP/FP
Abstract: No abstract text available
Text: MITSUBISHI DIGITAL ASSP M66503ASP/FP 16-BIT CONSTANT CURRENT LED DRIVER with SHIFT REGISTER AND LATCH DESCRIPTION The M66503A is a constant current LED driver IC, whose output current is variable. The IC’s functions include 16-bit serial input/parallel output shift register with output latch.
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M66503ASP/FP
16-BIT
M66503A
16-bit
M66503ASP/FP
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Robinson Nugent s2
Abstract: No abstract text available
Text: FINE PITCH SOCKETS E & D _ Specifications for SOP Sockets MATERIALS Body & Frame: Glass reinforced PPS UL 94V-0 Contact: Copper Alloy Plating: TT = 2.03 pm (80 pinch) Tin/Lead overall. 1.27 pm (50 pinch) Nickel underplate. ELECTRICAL Current Rating: 0.5 Ampere per contact
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1000MQ
980m/S2
300mil)
S13M30S
OP-44EXX-SMT-TT
Robinson Nugent s2
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ATMEL 32P
Abstract: toshiba 94V-0
Text: SOP— 40 D XX — SMT — TT .Plating Position:. 40 Blank = Tube Pack TP = Tape and Reel body only ‘ Frames are packaged in vinyl bags D = .525" Row Spacing. m E h T falEOOOO TiEBDDb a FF na 3 65 1 = Body 2 = Frame 3 = SO Package IC R e c o m m e n d e d PC b o a r d
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OP-40DXX-SMT-TT
Socke0GM-50-300B,
FP-20DA,
FP-20-D
375mll)
P20GM-50-375B-3,
P20GT-50-375B-2
FPT-20P-M02
751D-03
P24GM-50-300B-2
ATMEL 32P
toshiba 94V-0
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M66805P
Abstract: M66806FP
Text: HIGH-SPEED LINE INTERFACE 1C SEM CONDUCTOR New s FUNCTION OF 2 CONVENTIONAL INTERFACE ICS HOUSED IN A SINGLE PACKAGE D E S C R I P T I function of 2 traditional line interfaces housed in a single package. The M66805P has 4 built-in circuits connecting RS-422A line drivers/re
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M66805P
RS-422A
M66806FP
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M66S
Abstract: n type laser diode M66311P 16P2N-A 16P2N 32P2W n type laser diode driver
Text: IA P P LIC A T IO N SPECIFIC IC Function Type No. Package M irai fiate ftamj M66235FP 16P2N-A M66236FP 16P2N-A Synchronous clock generator Includes PLL frequency synthesizer Features U sage/Field • Wide frequency range 25~52MHz • Efficient synchronous accurity ± 3ns
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M66235FP
16P2N-A
52MHz
25MHz
50MHz
100kHz
M66236FP
M66238FP
32P2W-A
M66S
n type laser diode
M66311P
16P2N-A
16P2N
32P2W
n type laser diode driver
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P20GT-50-375B-2
Abstract: No abstract text available
Text: SMT — TT SOP — XX A XX Plating Position:_ 8, 14, 20, 24 A = .300" Row Spacing .Blank = Tube Pack TP = Tape and Reel body only *Frames are packaged in vinyl bags •Ì00S371 G0003fc>5 O CD lO t ST7 t 1 = Body 2 = Frame 3 = SO Package IC
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00S371
G0003fc
S13M00S
Pla50-300B,
FP-20DA,
FP-20-D
375mil)
P20GM-50-375B-3,
P20GT-50-375B-2
FPT-20P-M02
P20GT-50-375B-2
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