642006EGM1G09TD
Abstract: DIMM 1998
Text: 2M x 64 Bit 3.3V UNBUFFERED EDO DIMM Extended Data Out EDO DRAM DIMM 642006EGM1G09TD 168 Pin 2Mx64 EDO DIMM Unbuffered, 1k Refresh, 3.3V with SPD Pin Assignment Pin# General Description The module is a 2Mx64 bit, 9 chip, 3.3V, 168 Pin DIMM module consisting of (8) 1Mx16 (TSOP) DRAM
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642006EGM1G09TD
2Mx64
DS390-1
DIMM 1998
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Untitled
Abstract: No abstract text available
Text: WEDPF2M64-XBX3 HI-RELIABILITY PRODUCT 2Mx64 3.3V Simultaneous Operation Multi-Chip Package FEATURES • Access Times of 100, 120, 150ns ■ Unlock Bypass Program command • Reduces overall programming time when issuing multiple program command sequences ■ Packaging
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WEDPF2M64-XBX3
2Mx64
150ns
16KByte,
32KByte,
64kBytes
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Untitled
Abstract: No abstract text available
Text: DRAM MODULE KMM366F224CJ1 KMM366F224CJ1 EDO Mode without buffer 2M x 64 DRAM DIMM using 1Mx16, Dual Bank, 3.3V GENERAL DESCRIPTION FEATURES The Samsung KMM366F224CJ1 is a 2Mx64bits Dynamic RAM high density memory module. The Samsung KMM366F224CJ1 consists of eight CMOS 1Mx16bits DRAMs in SOJ 400mil
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KMM366F224CJ1
1Mx16,
2Mx64bits
1Mx16bits
400mil
168-pin
KMM366F224CJ1
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hym7v64200
Abstract: No abstract text available
Text: HYM7V64200B F-Series Unbuffered 2Mx64 bit SDRAM MODULE based on 2Mx8 SDRAM, LVTTL, 4K-Refresh DESCRIPTION The HYM7V64200B is high speed 3.3Volt synchronous dynamic RAM module consisting of eight 2Mx8 bit Synchronous DRAMs in TSOPII and 8-pin TSSOP 2K bit EEPROM on a 168-pin glass-epoxy circuit
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HYM7V64200B
2Mx64
168-pin
168Pin
hym7v64200
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W72M64V-XBX
Abstract: No abstract text available
Text: W72M64V-XBX 2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package *Preliminary FEATURES ! Access Times of 100, 120, 150ns ! Unlock Bypass Program command ! Packaging • Reduces overall programming time when issuing multiple program command sequences
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W72M64V-XBX
2Mx64
150ns
13x22mm
100ns
120ns
W72M64V-XBX
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ga15 engine wiring diagram
Abstract: IBM11M4730C4M IBM13T2649JC10T
Text: Discontinued 12/98 - last order; 9/99 last ship IBM11M4730C4M x 72 E12/10, 5.0V, Au. IBM13T2649JC 2M x 64 SDRAM SO DIMM Features • 144 Pin (emerging) JEDEC Standard, 8 Byte Small Outline Dual-In-line Memory Module • 2Mx64 Synchronous DRAM SO DIMM • Performance:
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IBM11M4730C4M
E12/10,
IBM13T2649JC
2Mx64
ga15 engine wiring diagram
IBM13T2649JC10T
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bsc 60h
Abstract: No abstract text available
Text: White Electronic Designs W72M64V-XBX 2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package *Advanced FEATURES • Access Times of 100, 120, 150ns ■ Unlock Bypass Program command ■ Packaging 159 PBGA, 13x22mm - 1.27mm pitch Reduces overall programming time when issuing
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W72M64V-XBX
2Mx64
150ns
13x22mm
2x2Mx32
100ns
120ns
150ns
bsc 60h
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km48c2104bk
Abstract: KM48C2104 KMM364E213BK
Text: DRAM MODULE KMM364E213BK/BS KMM364E213BK/BS Fast Page with EDO Mode 2M x 64 DRAM DIMM using 2Mx8, 2K Refresh, 5V GENERAL DESCRIPTION FEATURES The Samsung KMM364E213B is a 2Mx64bits Dynamic RAM high density memory module. The Samsung KMM364E213B consists of eight CMOS 2Mx8bits DRAMs in SOJ/TSOP-II
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KMM364E213BK/BS
KMM364E213BK/BS
KMM364E213B
2Mx64bits
KMM364E213B
300mil
16bits
48pin
168-pin
km48c2104bk
KM48C2104
KMM364E213BK
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HY5117804B
Abstract: HY5117804 HYM564214AHG HYM564214ATHG
Text: HYM564214A H-Series Buffered 2Mx64 bit CMOS DRAM MODULE based on 2Mx8 DRAM, EDO, 2K-Refresh GENERAL DESCRIPTION The HYM564214A H-Series is a 2Mx64-bit Extended Data Out mode CMOS DRAM module consisting of eight HY5117804B in 28 pin SOJ or TSOPII and two 16-bit BiCMOS line driver in TSSOP on a 168 pin
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HYM564214A
2Mx64
2Mx64-bit
HY5117804B
16-bit
HYM564214AHG
168-Pin
HY5117804
HYM564214ATHG
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Untitled
Abstract: No abstract text available
Text: IBM13T2649JC 2M x 64 S D R A M SO DIMM Features • 144 Pin emerging JEDEC Standard, 8 Byte Small Outline Dual-In-Iine Memory Module • 2Mx64 Synchronous DRAM SO DIMM • Performance: 10 CAS Latency J Units j 3 jfcK I Clock Frequency j 100 j MHz ! jtcK
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IBM13T2649JC
2Mx64
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Untitled
Abstract: No abstract text available
Text: IBM13T2649NC 2M x 64 SDRAM SO DIMM Features • 144 Pin emerging JEDEC Standard, 8 Byte Small Outline Dual-In-Iine Memory Module • 2Mx64 Synchronous DRAM SO DIMM • Performance: 10 CAS Latency § Units 3 jfcK I Clock Frequency I 100 j MHz jtcK j Clock Cycle
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IBM13T2649NC
2Mx64
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Untitled
Abstract: No abstract text available
Text: IBM11M2645H 2M x 64 DRAM MODULE Features System Performance Benefits: • 168 Pin JEDEC Standard, 8 Byte Dual In-line Memory Module • 2Mx64 Extended Data Out Page Mode DIMM • Performance: -60 -70 -Buffered inputs except RAS, Data -Reduced noise (32 Vss/Vcc pins)
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IBM11M2645H
2Mx64
104ns
124ns
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Untitled
Abstract: No abstract text available
Text: IB M 1 3 T 1 6 4 9 N C Preliminary 1M x 64 1 Bank SDRAM SO DIMM Features • 144 Pin emerging JEDEC Standard, 8 Byte Small Outline Dual-In-line Memory Module • 2Mx64 Synchronous DRAM SO DIMM • Performance: I 10 CAS Latency 3 ! 12 j Units ! 3 jfcK I Clock Frequency
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2Mx64
IBM13T1649NC
75H5936
GA14-4477-00
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Untitled
Abstract: No abstract text available
Text: I = = = = ¥ = = = ’ = IB M 1 1 N 2 6 4 5 H IB M 1 1 N 2 7 3 5 H 2M x 64/72 DRAM MODULE Features • 168 Pin JEDEC Standard, Unbuffered 8 Byte Dual In-line Memory Module • 2Mx64, 2Mx72 Extended Data Out Page Mode DIMMs applications • System Performance Benefits:
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2Mx64,
2Mx72
104ns
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Untitled
Abstract: No abstract text available
Text: IBM11 M2640H IBM11 M2640HB 2M x 64 DRAM MODULE Features • Optimized for byte-write non-parity applications • 168 Pin JEDEC Standard, 8 Byte Dual In-line Memory Module • System Performance Benefits: • 2Mx64 Fast Page Mode DIMM • Performance: ; tRAC
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IBM11
M2640H
M2640HB
2Mx64
SA14-4612-04
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Untitled
Abstract: No abstract text available
Text: KMM364Ë224AJ DRAM MODULE KMM364E224AJ Fast Page with EDO Mode 2Mx64 DRAM DIMM based on 1M x 1 6 ,1 K Refresh, 5V GENERAL DESCRIPTION FEATURES The Samsung KMM364F224AJ is a 2M bit X 64 Dynamic RAM high density memory module. The Samsung KMM364E224AJ consists of eight CMOS
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KMM364Ã
224AJ
KMM364E224AJ
2Mx64
KMM364F224AJ
1Mx16bit
44-pin
400mil
48pin
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Untitled
Abstract: No abstract text available
Text: DRAM MODULE KMM364E213BK/BS KMM364E213BK/BS Fast Page with EDO Mode 2Mx64 DRAM DIMM based on 2Mx8, 2K Refresh, 5V G ENERAL DESCRIPTION FEATURES The Samsung KMM364E213B is a 2M bit x 64 Dynamic RAM high density memory module. The • Part Identification Samsung KMM364E213B consists of eight CMOS
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KMM364E213BK/BS
KMM364E213BK/BS
2Mx64
KMM364E213B
KMM364E213BS
cycles/32ms
1000mil)
KMM364E213BK
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kmm366s203b
Abstract: KMM366S203BTN-G0 KMM366S203BTN-G2 ram kmm366s203btn-g2
Text: KMM366S203BTN NEW JEDEC SDRAM MODULE KMM366S203BTN SDRAM DIMM 2Mx64 SDRAM DIMM based on 2Mx8, 4K Refresh, 3.3V Synchronous DRAMs with SPD GENERAL DESCRIPTION FEATURE The Samsung KMM366S203BTN is a 2M bit x 64 Synchronous Dynamic RAM high density memory module. The Samsung
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KMM366S203BTN
KMM366S203BTN
2Mx64
400mil
168-pin
kmm366s203b
KMM366S203BTN-G0
KMM366S203BTN-G2 ram
kmm366s203btn-g2
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KMM466S203BT-F0
Abstract: KMM466S203BT-F2
Text: KMM466S203BT NEW JEDEC SDRAM MODULE KMM466S203BT S D R A M SODIMM 2Mx64 SDRAM SODIMM based on 2Mx8, 4K Refresh, 3.3V Synchronous DRAMs with SPD GENERAL DESCRIPTION FEATURE The Samsung KMM466S203BT is a 2M bitx 64 Synchronous Dynamic RAM high density memory module. The Samsung
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KMM466S203BT
KMM466S203BT
2Mx64
400mii
144-pin
7Th4142
KMM466S203BT-F0
KMM466S203BT-F2
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CQ58
Abstract: No abstract text available
Text: - » Y U H D f l l —• HYM7V64200B Z-SERIES SO DIMM 2MX64 bit SDRAM MODULE based on 2Mx8 SDRAM, LVTTL, 4K-Refresh DESCRIPTION The HYM7V64200B is high speed 3.3Volt synchronous dynamic RAM module consisting of eight 2Mx8 bit Synchronous DRAMs in 44-pin SOJ or TSOPli and 8-pin TSSO P 2K bit EEPROM on a 144-pin glassepoxy circuit board. Two 0.22|iF and 0.0022|_iF decoupling capacitors are mounted for each SDRAM.
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HYM7V64200B
2MX64
44-pin
144-pin
CQ58
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ltzg
Abstract: No abstract text available
Text: “ H Y U N D A I • HYM7V65200C Z-SERIES SO-DIMM 2Mx64 bit SDRAM MODULE based on 2Ux8 SDRAM, LVTTL, 4K-Re1resh DESCRIPTION The HYM7V64200C is high speed 3.3Voit CMOS Synchronous DRAM module consisting of eight 2Mx8 bit Synchronous DRAMs in 44-pin TSOPII and one 8-pin TSSOP 2K bit EEPROM on a 168-pin glass-epoxy
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HYM7V65200C
2Mx64
HYM7V64200C
44-pin
168-pin
ltzg
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Untitled
Abstract: No abstract text available
Text: IBM13N2649JC IBM13N2739JC Preliminary 2M X 64/72 1 Bank Unbuffered SDRAM Module Features • 168 Pin emerging JEDEC Standard, Unbuffered 8 Byte Dual In-line Memory Module • 2Mx64/72 Synchronous DRAM DIMM • Performance: CAS Latency jfcK I Clock Frequency
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IBM13N2649JC
IBM13N2739JC
2Mx64/72
75H1990
SA14-4713-01
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PDF
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Untitled
Abstract: No abstract text available
Text: IBM13T2649JC 2M x 64 1 Bank S D R A M SO DIMM Features • 144 Pin emerging JEDEC Standard, 8 Byte Small Outline Dual-In-line Memory Module • 2Mx64 Synchronous DRAM SO DIMM • Performance: CAS Latency • • • • • • jfcK I Clock Frequency jtcK
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IBM13T2649JC
2Mx64
75H5376
A14-4476-01
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PDF
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Untitled
Abstract: No abstract text available
Text: KMM466F203BS-L KMM466F213BS-L DRAM MODULE KMM466F203BS-L & KMM466F213BS-L EDO Mode without buffer 2Mx64 based on 2Mx8, 2K & 4K Refresh, 3.3V, Low Power/Self-Refresh G ENER AL DESCRIPTION FEATURES The Samsung KMM466F20 1 3BS-L is a 2M bit x 64 Dynamic RAM high density memory module. The
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KMM466F203BS-L
KMM466F213BS-L
KMM466F213BS-L
2Mx64
KMM466F20
cycles/128ms,
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