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    30A09 Search Results

    30A09 Result Highlights (2)

    Part ECAD Model Manufacturer Description Download Buy
    MSP430A095IPN Texas Instruments 16-Bit Ultra-Low-Power MCU, 48KB Flash, 2KB RAM, 12-Bit ADC, Dual DAC, DMA, 3 OPAMP, 128 Seg LCD 80-LQFP -40 to 85 Visit Texas Instruments Buy
    MSP430A093IPMR Texas Instruments 16-bit Ultra-Low-Power Microcontroller for Energy Meters, 16KB Flash, 512B RAM 64-LQFP -40 to 85 Visit Texas Instruments
    SF Impression Pixel

    30A09 Price and Stock

    Kyocera AVX Components UCHD30A09-TE24L2

    DIODE SCHOTTKY 90V 30A TO263LP
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    DigiKey UCHD30A09-TE24L2 Reel 2,000 2,000
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    UCHD30A09-TE24L2 Digi-Reel 2,000 1
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    UCHD30A09-TE24L2 Cut Tape 2,000 1
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    Newark UCHD30A09-TE24L2 Cut Tape 1,998 1
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    TTI UCHD30A09-TE24L2 Reel 2,000 2,000
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    Panasonic Electronic Components ARS30A09

    RELAY RF SPDT 500MA 9V
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    DigiKey ARS30A09 Tube 40
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    Panasonic Electronic Components ARS30A09Z

    RELAY RF SPDT 500MA 9V
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    Panasonic Electronic Components ARS30A09X

    RELAY RF SPDT 500MA 9V
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    SL Power Electronics TE30A0903B01

    AC/DC WALL MOUNT ADAPTER 9V 27W
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    30A09 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    FCH30A09

    Abstract: No abstract text available
    Text: SBD T y p e : FCH30 FCH30A 30A09 OUTLINE DRAWING FEATURES *TO-220AB Case *Fully Molded *Dual Diodes – Cathode Common *Low Forward Voltage Drop *High Surge Capability *Tj=150 °C operation Maximum Ratings Rating Approx Net Weight: 1.75g Symbol Repetitive Peak Reverse Voltage


    Original     		FCH30A09 FCH30 O-220AB Electri180° FCH30A09 PDF

    Untitled

    Abstract: No abstract text available
    Text: 256Kx8/128Kx16, 20 - 45ns, STACK/PGA 30A097-32 E 2 Megabit High Speed CMOS SRAM DPS128X16Cn3/DPS128X16Bn3 DESCRIPTION: The DPS128X16Cn3/DPS128X16Bn3 High Speed SRAM ‘’STACK’’ modules are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC .


    Original     		256Kx8/128Kx16, 30A097-32 DPS128X16Cn3/DPS128X16Bn3 50-pin DPS128X16Cn3/DPS128X16Bn3 PDF

    GCH30A09

    Abstract: No abstract text available
    Text: SBD T y p e : GCH30 CH30A 30A09 OUTLINE DRAWING FEATURES *Similar to TO-220AB Case *Dual Diodes – Cathode Common *Low Forward Voltage Drop *High Surge Capability *Tj=150 °C operation Maximum Ratings Rating Approx Net Weight: 1.9g Symbol Repetitive Peak Reverse Voltage


    Original     		GCH30A09 O-220AB GCH30A09 PDF

    FCH30A09

    Abstract: No abstract text available
    Text: SBD T y p e : FCH30 FCH30A 30A09 OUTLINE DRAWING FEATURES *TO-220AB Case *Fully Molded *Dual Diodes – Cathode Common *Low Forward Voltage Drop *High Surge Capability *Tj=150 °C operation Maximum Ratings Rating Approx Net Weight: 1.75g Symbol Repetitive Peak Reverse Voltage


    Original     		FCH30 FCH30A09 O-220AB FCH30A09 PDF

    Untitled

    Abstract: No abstract text available
    Text: 256Kx8/128Kx16, 20 - 45ns, STACK/PGA 30A097-32 E 2 Megabit High Speed CMOS SRAM DPS128X16Cn3/DPS128X16Bn3 DESCRIPTION: The DPS128X16Cn3/DPS128X16Bn3 High Speed SRAM ‘’STACK’’ modules are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC .


    Original     		256Kx8/128Kx16, 30A097-32 DPS128X16Cn3/DPS128X16Bn3 DPS128X16Cn3/DPS128X16Bn3 50-pin PDF

    Untitled

    Abstract: No abstract text available
    Text: SBD T y p e : FCH30 FCH30A 30A09 OUTLINE DRAWING FEATURES *TO-220AB Case *Fully Molded *Dual Diodes – Cathode Common *Low Forward Voltage Drop *High Surge Capability *Tj=150 °C operation Maximum Ratings Rating Approx Net Weight: 1.75g Symbol Repetitive Peak Reverse Voltage


    Original     		FCH30 FCH30A 30A09 O-220AB FCH30A09 PDF

    Untitled

    Abstract: No abstract text available
    Text: SBD T y p e : GCH30 CH30A 30A09 OUTLINE DRAWING FEATURES *Similar to TO-220AB Case *Dual Diodes – Cathode Common *Low Forward Voltage Drop *High Surge Capability *Tj=150 °C operation Maximum Ratings Rating Approx Net Weight: 1.9g Symbol Repetitive Peak Reverse Voltage


    Original     		GCH30 CH30A 30A09 O-220AB GCH30A09 PDF

    GCH30A09

    Abstract: No abstract text available
    Text: SBD T y p e : GCH30 CH30A 30A09 OUTLINE DRAWING FEATURES *Similar to TO-220AB Case *Dual Diodes – Cathode Common *Low Forward Voltage Drop *High Surge Capability *Tj=150 °C operation Maximum Ratings Rating Approx Net Weight: 1.9g Symbol Repetitive Peak Reverse Voltage


    Original     		GCH30A09 O-220AB GCH30A09 PDF

    30021

    Abstract: L48C L41C IC L44C DATASHEET L30C l31c L43C ORSO42G5 ORSO82G5 ORT42G5
    Text: ORCA ORSO42G5 and ORSO82G5 0.6 - 2.7 Gbps SONET Backplane Interface FPSCs August 2005 Data Sheet Introduction Lattice has extended its family of high-speed serial backplane devices with the ORSO42G5 and ORSO82G5 devices. Built on the Series 4 reconfigurable embedded System-on-a-Chip SoC architecture, the ORSO42G5 and


    Original     		ORSO42G5 ORSO82G5 ORSO82G5 ORSO42G5-1BMN484I ORSO82G5-2FN680I 30021 L48C L41C IC L44C DATASHEET L30C l31c L43C ORT42G5 PDF

    Untitled

    Abstract: No abstract text available
    Text: 1 Megabit High Speed CMOS SRAM DPS128M8CnY/BnY, DPS128X8CA3/BA3 DESCRIPTION: The DPS128M8CnY/BnY, DPS128X8CA3/BA3 High Speed SRAM devices are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC .


    Original     		DPS128M8CnY/BnY, DPS128X8CA3/BA3 DPS128X8CA3/BA3 50-pin DPS128V. 30A097-31 PDF

    Untitled

    Abstract: No abstract text available
    Text: 8 Megabit High Speed CMOS SRAM DPS512X16Cn3/DPS512X16Bn3 DESCRIPTION: The DPS512X16Cn3/DPS512X16Bn3 High Speed SRAM ‘’STACK’’ modules are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC .


    Original     		DPS512X16Cn3/DPS512X16Bn3 DPS512X16Cn3/DPS512X16Bn3 50-pin 30A097-38 PDF

    Untitled

    Abstract: No abstract text available
    Text: 4 Megabit High Speed CMOS SRAM DPS256X16Cn3/DPS256X16Bn3 DESCRIPTION: The DPS256X16Cn3/DPS256X16Bn3 High Speed SRAM ‘’STACK’’ modules are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC .


    Original     		DPS256X16Cn3/DPS256X16Bn3 DPS256X16Cn3/DPS256X16Bn3 50-pin 30A097-34 PDF

    AL437

    Abstract: L97c L235C L103T L41C L140C L94C l165c L239C L43C
    Text: ORCA ORSPI4 Dual SPI4 Interface and High-Speed SERDES FPSC November 2003 Preliminary Data Sheet Lattice Semiconductor has developed a next-generation FPSC targeted at high-speed data transmission. Built on the Series 4 reconfigurable embedded System-on-a-Chip SoC architecture, the ORSPI4 FPSC contains two


    Original     		8b/10b OIF-SPI4-02 ORSPI4-1FE1036IES ORSPI4-F1156IES ORSPI4-2FE1036CES ORSPI4-1FE1036CES ORSPI4-2F1156CES ORSPI4-1F1156CES AL437 L97c L235C L103T L41C L140C L94C l165c L239C L43C PDF

    Untitled

    Abstract: No abstract text available
    Text: 1 Megabit CMOS SRAM DPS128M8n3/DPS128X8A3 DESCRIPTION: The DPS128M8nY & DPS128X8A3 SRAM devices are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded, ‘’J’’ leaded or gullwing leaded packages, or mounted on a 50-pin PGA


    Original     		DPS128M8n3/DPS128X8A3 DPS128M8nY DPS128X8A3 50-pin 30A097-01 DPS128M8n3/DPS128X8A3 PDF

    50-PIN

    Abstract: DPS256X
    Text: DENSE-PAC MICROSYSTEMS 4 Megabit CM OS SRAM DPS256X16n3 DESCRIPTION: The DPS256X16n3SRAM "S T A C K " modules are a revolutionarynew memory subsystem using Dense-Pac Microsystems'ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded, " j " leaded


    OCR Scan     		DPS256X16n3 DPS256X16n3SRAM 50-pin DPS256X16n3 256Kx16 512Kx8 125-C 100ns 120ns 150ns DPS256X PDF

    256kx8 sram 5v

    Abstract: 50-PIN
    Text: DENSE-PAC 2 Megabit High Speed CM OS SRAM MICROSYSTEMS DPS128X16Cn3/DPSl 28X16Bn3 D E S C R IP T IO N : The DPS128X16Cn3/DPS128X16Bn3 High Speed SRAM "S T A C K " modules area revolutionary new memory subsystem using Dense-Pac Microsystems' ceram ic Stackable Leadless Chip Carriers SLCC .


    OCR Scan     		DPS128X16Cn3/DPSl 28X16Bn3 DPS128X16Cn3/DPS128X16Bn3 50-pin -40-C 125-C 30A097-32 256kx8 sram 5v PDF

    lem HA

    Abstract: 50-PIN dps128m8bny
    Text: DENSE-PAC 1 Megabit High Speed CMOS SRAM M I C R O S Y S T E M S DPS128M8CnY/BnY, DPS128X8CA3/BA3 DESCRIPTION: The DPS 128M8CnY/BnY, DPS128X8CA3/BA3 H igh Speed SRAM devices are a revolutionary new m em ory subsystem using Dense-Pac Microsystems' ceram ic Stackable Leadless C hip Carriers SLCC .


    OCR Scan     		DPS128M8CnY/BnY, DPS128X8CA3/BA3 128M8CnY/BnY, 28X8CA3/BA3 50-pin California92841-1428 OA097-31 lem HA dps128m8bny PDF

    50-PIN

    Abstract: DPS512X16A3
    Text: DENSE-PAC MICROSYSTEMS 8 Megabits CM OS SRAM DPS512Xl6n3 D ESCRIPTIO N ; The DPS512X16n3 SRAM "STACK" modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded, "J" leaded


    OCR Scan     		DPS512Xl6n3 DPS512X16n3 50-pin 512Kx16 -40-C 125-C 100ns 120ns DPS512X16A3 PDF

    Untitled

    Abstract: No abstract text available
    Text: 8 Megabit High Speed CMOS SRAM DPS1MS8EJ4/EL4/RJ4/RL4 Dense-Pac Microsystems, Ina 0 DESCRIPTION: The DPS1M S8EJ4/EL4/RJ4/RL4 surface mount SRAM m odules are a revolutionary memory subsystems using Dense-Pac Microsystems' new 2nd Generation Stacking Technology. The module


    OCR Scan     		128Kx8 512Kx8 400-mil 500mV 3QA09002 PDF

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC MICROSYSTEMS 3 Megabit High Speed CMOS SRAM DPS128X24Bn3 DESCRIPTION: The DPST28X24Bn3 High Speed SRAM "STACK" modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded, "J" leaded or gullwing leaded


    OCR Scan     		DPS128X24Bn3 DPST28X24Bn3 50-pin DPS128X24Bn3 3QAD97-33 PDF

    DPS512S8

    Abstract: No abstract text available
    Text: DENSE-PAC 4 Megabit High Speed CMOS SRAM DPS512S8 EJ4/E L4/RJ4/RL4 M I C R O S Y S T E M S DESCRIPTION: The DPS512S8EJ4/EL4/RJ4/RL4 surface mount SRAM modules are a revolutionary memory subsystems using Dense-Pac Microsystems' new 2nd Generation Stacking Technology. The module combines four


    OCR Scan     		DPS512S8 DPS512S8EJ4/EL4/RJ4/RL4 128Kx8 512Kx8 400-mil 32-PIN 36-PIN 3QA090-0D DPS512S8EJ4/EL4/RJ4/RL4 32-PIN PDF

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC 8 Megabit High Speed CMOS SRAM MICROSYSTEMS DPS512X 16Cn3/DPS512X 16Bn3 DESCRIPTION: The DPS512X16Cn3/DPS512X16Bn3 High Speed SRAM “ STACK" modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC .


    OCR Scan     		DPS512X 16Cn3/DPS512X 16Bn3 DPS512X16Cn3/DPS512X16Bn3 50-pin -t-85 3QA097-38 PDF

    128depth

    Abstract: No abstract text available
    Text: D E N S E -P A C 2 Megabit CMOS SRAM M I C R O S Y S T E M S D PS128X16n3 DESCRIPTION: The DPS128X16n3 SRAM "STACK" modules area revolutionary new memory subsystem using Dense-Pac Microsystems'ceramic Stackable Leadless Chip Carriers SLCQ. Available in straight leaded, "J" leaded


    OCR Scan     		PS128X16n3 DPS128X16n3 50-pin 100ns 120ns 150ns 128depth PDF

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC MICROSYSTEMS 2 Megabit High Speed C M O S SRAM DPS256S8EJ4/EL4/RJ4/RL4 DESCRIPTION: The DPS256S8EJ4/EL4/RJ4/RL4 surface mount SR A M modules are a revolutionary memory subsystems using Dense-Pac Microsystems' new 2nd Generation Stacking Technology. The module combines two


    OCR Scan     		DPS256S8EJ4/EL4/RJ4/RL4 DPS256S8EJ4/EL4/RJ4/RL4 128Kx8 400-mil 30A090-04 PDF