240-pin
Abstract: LA-3522A-1
Text: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3522A-1 MQFP 32x32 3.2mm 240 pin QFP 32 × 32 Terminal Spacing Linear = 0.5 A B 180 181 121 120 detail of lead end S C D R Q 240 1 F G 61 60 H I J M P K M N S L NOTE ITEM 1. Controlling dimention millimeter.
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LA-3522A-1
P240GN-50-LMU,
240-pin
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0038 tsop
Abstract: No abstract text available
Text: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 32 pin TSOP (II) (400 mil) 32 17 1 P E F detail of lead end 16 A H J K G I N C D M B L M NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition.
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400MIL21
S32G5-50-7JD2
0038 tsop
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Untitled
Abstract: No abstract text available
Text: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 32 pin TSOP (II) (400 mil) 32 17 F P E detail of lead end 1 16 A D M M C L B G K N I H NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition.
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400MIL21
S32G5-50-7KD2
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Untitled
Abstract: No abstract text available
Text: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 32 pin TSOP (II) (400 mil) 17 32 E 5°±5° F detail of lead end 1 16 A H J K G I N C D M B L M S32G5-50-7JD1-1 NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at
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400MIL21
S32G5-50-7JD1-1
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TSOP 54 tray
Abstract: tsop 0038
Text: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 32 pin TSOP (II) (400 mil) 17 32 F E 5°±5° detail of lead end 1 16 A D M M C L B G K N I J H S32G5-50-7KD1-1 NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at
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400MIL21
S32G5-50-7KD1-1
TSOP 54 tray
tsop 0038
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SOP 812
Abstract: No abstract text available
Text: Packing Magazine Name MM525-02A LB-066 Mounting Pad JEDEC Tray 32P SOP 32 pin SOP 525 mil 32 17 +7° 1 3° –3° detail of lead end 16 A J E K F G H I N C D L B M M P32GW-50-525A NOTE Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at
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MM525-02A
LB-066
P32GW-50-525A
SOP 812
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Untitled
Abstract: No abstract text available
Text: 128K x 32 EEPROM Module PUMA 68E4001/A-12/15/20 Issue 4.3 : May 2001 Elm Road, West Chirton, NORTH SHIELDS, Tyne & Wear NE29 8SE, England Tel. +44 0 191 2930500 Fax. +44 (0) 191 2590997 Description The PUMA 68E4001/A is a 4Mbit CMOS EEPROM module in a JEDEC 68 pin surface
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68E4001/A-12/15/20
68E4001/A
200ns
JED-STD-020.
200pcs
183OC
225OC
219OC
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JEDEC TQFP 10*10 1.0 MM
Abstract: No abstract text available
Text: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3A73B-1 TQFP 10x10 1.0T 64 pin TQFP 10 × 10 Terminal Spacing Linear = 0.5 A B 48 33 32 49 F 64 R Q S D C detail of lead end 17 16 1 G H I M J M P K N L NOTE ITEM Each lead centerline is located within 0.10 mm (0.004 inch) of
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LA-3A73B-1
S64GB-50-9EU-1
JEDEC TQFP 10*10 1.0 MM
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S64GF
Abstract: No abstract text available
Text: Mounting Pad Packing Name LA-2244A-1 NEC Tray LA-1244A-1 LA-044A-1 JEDEC Tray MQFP 14x20 2.7mm 64 pin QFP 14 × 20 Terminal Spacing Linear = 1.0 A B 51 52 33 32 detail of lead end C D S R Q 64 1 20 19 F J G H I M P K M N L NOTE ITEM Each lead centerline is located within 0.20 mm (0.008 inch) of
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LA-2244A-1
LA-1244A-1
LA-044A-1
039ch)
S64GF-100-3B8,
S64GF
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NEC 2701
Abstract: NEC D 582 2701 NEC LA-1244A-1 transistor NEC D 582 QFP JEDEC tray 1802M
Text: Packing Name LA-2244A-1 Mounting Pad NEC Tray LA-1244A-1 LA-044A-1 JEDEC Tray MQFP 14x20 2.7mm 64 pin QFP 14 × 20 Terminal Spacing Linear = 1.0 A B 51 52 detail of lead end 33 32 C D S R Q 64 1 20 19 F G H I M P J K M N L NOTE ITEM Each lead centerline is located within 0.20 mm (0.008 inch) of
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LA-2244A-1
LA-1244A-1
LA-044A-1
SC-582-A
P64GF-100-3B8,
P64GF-100-3B8
NEC 2701
NEC D 582
2701 NEC
LA-1244A-1
transistor NEC D 582
QFP JEDEC tray
1802M
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JEDEC Matrix Tray outlines
Abstract: ATMEL EIA-481-x Packing JEDEC tray standard for PLCC ATMEL Packing Methods and Quantities EIA-481-x JEDEC TRAY PLCC ATMEL Tape and Reel tsop Shipping Trays JEDEC tray standard 13 ATMEL shipping label
Text: Packages Available Packing Methods and Quantities Atmel provides four different packing methods to provide maximum protection for our product and to best suit our customer’s needs: 1 Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three methods are our standard pack, but we also
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EIA-481-x,
JEDEC Matrix Tray outlines
ATMEL EIA-481-x Packing
JEDEC tray standard for PLCC
ATMEL Packing Methods and Quantities
EIA-481-x
JEDEC TRAY PLCC
ATMEL Tape and Reel
tsop Shipping Trays
JEDEC tray standard 13
ATMEL shipping label
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tsop tray matrix outline
Abstract: tsop Shipping Trays JEDEC Matrix Tray outlines Atmel 918 EIA-481-x ATMEL Packing Methods and Quantities JEDEC Matrix Tray outlines soic ATMEL Tape and Reel PLCC JEDEC tray Shipping Trays
Text: Packages Available Packing Methods and Quantities Atmel provides four different packing methods to provide maximum protection for our product and to best suit our customer’s needs: 1 Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three methods are our standard pack, but we also
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QFP JEDEC tray
Abstract: No abstract text available
Text: HEAT PROOF PPE 36 A' 26.57 A MQFP 32x32 3.2mm 41.38 7 82.76 135.9 UNIT : mm 36 37.82 25.13 264.74 315 322.6 SECTION A – A' 36 3.82 7.62 6.35 31.3 Applied Package Quantity pcs 240-pin plastic QFP (Fine Pitch) (3.2mm thick) MAX. 24 Tray Material Heat Proof Temp.
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240-pin
QFP JEDEC tray
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32 jedec tray
Abstract: QFP JEDEC tray
Text: TRAY CONTAINER HEAT PROOF PPE 36 A' 26.57 A MQFP 32x32 3.2mm 41.38 7 82.76 135.9 UNIT : mm 36 37.82 25.13 264.74 315 322.6 SECTION A – A' 36 3.82 7.62 6.35 31.3 Applied Package 240-pin plastic QFP Fine Pitch (3.2mm thick) Quantity (pcs) MAX. 24 MQFP 32 × 32 3.2mm
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240-pin
SSD-A-H5923-1
32 jedec tray
QFP JEDEC tray
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28 TSSOP JEDEC Thin Matrix Tray outlines
Abstract: tsop tray matrix outline Shipping Trays ATMEL Packing Methods and Quantities ATMEL EIA-481-x Packing ATMEL 234 tsop Shipping Trays atmel tape and reel JEDEC Matrix Tray outlines EIA-481-x
Text: Available Packing Methods and Quantities Atmel provides four different packing methods to provide maximum protection for our product and to best suit our customer’s needs: 1 Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three
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0637D
09/99/xM
28 TSSOP JEDEC Thin Matrix Tray outlines
tsop tray matrix outline
Shipping Trays
ATMEL Packing Methods and Quantities
ATMEL EIA-481-x Packing
ATMEL 234
tsop Shipping Trays
atmel tape and reel
JEDEC Matrix Tray outlines
EIA-481-x
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pd0008
Abstract: tray 8 x 8 TSOP TRAY 40 PIN TSOP package tray N1N213 Package and Packing Information ST
Text: PD0008 Packing information Tray for TSOP packages type 1 Introduction TSOP type-1 packages can be supplied in tray packing. Refer to Table 1 for the list of TSOP type-1 packages supplied in trays. The objective of this document is provide a detailed description of the tray. It applies to all
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PD0008
105cm.
PD0008
tray 8 x 8
TSOP TRAY 40 PIN
TSOP package tray
N1N213
Package and Packing Information ST
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JEDEC tray standard 13
Abstract: c 129 transistor JEDEC FBGA 144PIN JEDEC TRAY DIMENSIONS FBGA
Text: TRAY CONTAINER UNIT : mm 13 x 32=416 118.2 135° C MAX. NEC FBGA7 × 7ESP 7.35 8.85 9.85 A' 7.35 9.60 297.6 315.0 322.6 8.70 7.35 Section A – A' (5.62) (5.77) 7.00 7.62 135.9 PPE A Applied Package Quantity (pcs) 48-pin Plastic FBGA (7×7) 109-pin Tape FBGA (7×7)
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144-pin
109-pin
48-pin
129-pin
SSD-A-H7655-2
JEDEC tray standard 13
c 129 transistor
JEDEC FBGA
144PIN
JEDEC TRAY DIMENSIONS FBGA
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1f1-1717-a19
Abstract: 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9
Text: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1 8*12 ,256M DDR 5G 60WMBG Package 8*12 130℃ MAX 60M/54WBGA-8.10X15.10-8X12-A TR_MARKING LA69-00635A Material Code Material Spec 48TBGA,10.0*9.0(8*16) 8*16 130℃ MAX 48-TBGA-10.0X9.0-8X16-O
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60WMBG
60M/54WBGA-8
10X15
10-8X12-A
LA69-00635A
48TBGA
48-TBGA-10
0-8X16-O
LA69-00267A
ADS11981
1f1-1717-a19
153FBGA
BGA 6x6 tray
FBGA tray kostat
tray bga 6x6
169fbga-12.0x16.0-8x16-0
78BOC-11
78BOC
ePAK BGA 5x5 tray
153FBGA-9
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IC Package Names and Code Designations
Abstract: data sheet IC 7408 7404 not gate ic MSP 044 THERMISTOR enplas otq-100-0.5 IC 7404 7406 IC51-1004-809 ic 7404 datasheet HLP40R ic 7408
Text: Hitachi Semiconductor Package DATA BOOK ADE 410-001A Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher functional capacity and higher density and developing packages
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10-001A
IC Package Names and Code Designations
data sheet IC 7408
7404 not gate ic
MSP 044 THERMISTOR
enplas otq-100-0.5
IC 7404 7406
IC51-1004-809
ic 7404 datasheet
HLP40R
ic 7408
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HT 1200-4
Abstract: YAMAICHI ic234 PT740 AB TSSOP YAMAICHI SOCKET FP-20-0.65-01 IC51-1444-1354-7 PT817 Enplas drawings IC51-2084-1052-11 IC 7418 IC51-0242-1341
Text: Hitachi Semiconductor Package Data Book ADE–410–001B 3rd Edition March/97 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher functional
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March/97
HT 1200-4
YAMAICHI ic234
PT740 AB
TSSOP YAMAICHI SOCKET FP-20-0.65-01
IC51-1444-1354-7
PT817
Enplas drawings
IC51-2084-1052-11
IC 7418
IC51-0242-1341
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MIL-STD-81705
Abstract: tsop Shipping Trays JEDEC TRAY PLCC L-273 PGA JEDEC tray TQFP Shipping Trays transport media and packing JEDEC TRAY mQFP intel tray mechanical drawings LD 273
Text: CHAPTER 10 TRANSPORT MEDIA AND PACKING TRANSPORT MEDIA Tubes Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment Standard tubes for most package types are translucent and allow visual inspection of units within the tube Carbon-impregnated black conductive tubes
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LD 337
Abstract: LD128 amkor copper bond wire amkor JEDEC Matrix Tray outlines mo-112 MQFP 32 32
Text: LEADFRAME data sheet MQFP Features Metric Quad Flat Pack MQFP Packages: Amkor’s MQFP package affords the designer or systems engineer the flexibility of growing or shrinking IC package size based upon application need. Amkor employs the most up-to-date, advanced equipment, material
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Abstract: No abstract text available
Text: SIEM ENS 3.3 V DRAM Modules HYM 64Vx005GCD L -60 144 pin SO-DIMM EDO-DRAM Modules 8 MB, 16 MB, 32 MB & 64 MB density Preliminary Information • 144 Pin JEDEC Standard, 8 Byte Small Outline Dual In-line Memory Modules for PC notebook applications • Chip-on Board (COB) Assembly Technique
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64Vx005GCD
flS35bG5
01S3ML2
L-DIM-144-C1
L-DIM-144-C4
BE35L
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Untitled
Abstract: No abstract text available
Text: PLCC 1.27mm SMT Sockets IC160 Series ORDERING INFORMATION P/N: IC160-0*4-*0* * Blank: Tray I 1: Tape & Reel 2: Tube 1: With Locator Pin _ 0: Without Locator Pin 1. 2: SMT Terminals See "Contact Area" Drawing Below Pin Count CHARACTERISTICS Insulation Resistance
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IC160
IC160-0*
500MQ
UL94V-0
019ixt0
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