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3500S35 Price and Stock

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Orbel Corporation GRVC-3500S3500-0200X COVER RF SHIELD GROOVE LOC 3.5
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	GRVC-3500S3500-0200X	Box			100	1 - 10 - 100 $13.3032 1000 $13.3032 10000 $13.3032	Buy Now
The Bergquist Company GF3500S35-00-60-50CC GF3500S35 50CC DUAL CARTRIDGE
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	GF3500S35-00-60-50CC	Box			1	1 $100.12 10 $79.78 100 $63.3328 1000 $63.3328 10000 $63.3328	Buy Now
The Bergquist Company GF3500S35-07-60-50CC LIQUID GAP FILLER THERMAL CONDU
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	GF3500S35-07-60-50CC	Bulk			1	1 $95.89 10 $76.416 100 $60.6696 1000 $60.6696 10000 $60.6696	Buy Now
Mouser Electronics	GF3500S35-07-60-50CC		358			1 $76.69 10 $68.65 100 $59.39 1000 $59.39 10000 $59.39	Buy Now
The Bergquist Company GF3500S35-00-60-400CC LIQUID GAP FILLER THERMAL CONDUC
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	GF3500S35-00-60-400CC	Bulk			1	1 $379.54 10 $301.51 100 $379.54 1000 $379.54 10000 $379.54	Buy Now
Mouser Electronics	GF3500S35-00-60-400CC					1 $434.77 10 $276.62 100 $276.62 1000 $276.62 10000 $276.62	Get Quote
Vishay Intertechnologies ACASA3500S3500P500 ACAS 0612 350R S 350R P5 - Tape and Reel (Alt: ACASA3500S3500P500)
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Avnet Americas	ACASA3500S3500P500	Reel		10 Weeks	5,000	1 - 10 - 100 - 1000 - 10000 $0.20458	Buy Now

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3500S35 Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
gf3500s35 Abstract: GF-3500 D2196 3500S35 GF35 D149 D150 D2240 D257 D792 Text: Gap Filler 3500S35 Two-Part Thermally Conductive Liquid Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP FILLER 3500S35 • Thermal conductivity: 3.6 W/m-K • Thixotropic nature makes it easy to dispense • Two-part formulation for easy storage	Original	3500S35 D2196 E1269 3500S35 gf3500s35 GF-3500 D2196 GF35 D149 D150 D2240 D257 D792	PDF
Untitled Abstract: No abstract text available Text: Gap Filler 3500S35 Two-Part Thermally Conductive Liquid Gap Filling Material Features and Benefits T YPICAL PROPERT IES OF GAP FILLER 3500S35 PROPERTY Color / Part A • Thermal Conductivity: 3.6 W/m-K • Thixotropic nature makes it easy to dispense • Two-part formulation for easy storage	Original	3500S35 D2196 3500S35	PDF
bergquist Abstract: No abstract text available Text: Gap Filler 3500S35 Two-Part Thermally Conductive Liquid Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP FILLER 3500S35 PROPERTY Color / Part A • Thermal Conductivity: 3.6 W/m-K • Thixotropic nature makes it easy to dispense • Two-part formulation for easy storage	Original	3500S35 D2196 3500S35 bergquist	PDF
GDDR5 pinout Abstract: coprocessor Text: Intel Xeon Phi Coprocessor Datasheet April 2014 Document ID Number: 328209 003EN By using this document, in addition to any agreements you have with Intel, you accept the terms set forth below. You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel	Original	003EN GDDR5 pinout coprocessor	PDF
Untitled Abstract: No abstract text available Text: SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 2 Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 3 June 2011 All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE	Original		PDF
FC-BGA Abstract: T0812012 daewon tray Text: Thermal Management and Mechanical Handling for Lidless Flip Chip Ball-Grid Array AN-659-1.0 Application Note This application note provides guidance on thermal management and mechanical handling of lidless flip chip ball-grid array FCBGA for Altera devices.	Original	AN-659-1 FC-BGA T0812012 daewon tray	PDF
KS-886H Abstract: Kostat tray Text: Thermal Management and Mechanical Handling for Altera TCFCBGA Devices AN-657-1.1 Application Note This application note describes the thermal composite flip chip ball-grid array TCFCBGA package for the Arria V device family. TCFCBGA improves board real-estate use by allowing closer spacing between passive	Original	AN-657-1 KS-886H Kostat tray	PDF