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    36-BUMP Search Results

    36-BUMP Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    93135-003LF Amphenol Communications Solutions PV® Wire-to-Board Connector System, Crimp to Wire Receptacle, Short Wire Barrel S/Bump Visit Amphenol Communications Solutions
    93135-005LF Amphenol Communications Solutions PV® Wire-to-Board Connector System, Crimp to Wire Receptacle, Short Wire Barrel S/Bump Visit Amphenol Communications Solutions
    93135-004LF Amphenol Communications Solutions PV® Wire-to-Board Connector System, Crimp to Wire Receptacle, Short Wire Barrel S/Bump Visit Amphenol Communications Solutions
    RF-HDT-AJLS-G1 Texas Instruments RF-HDT-AJLS Tag-it(TM) HF-I Pro Transponder Chip (Wafer, bumped, inked, grind, sawn on tape) Visit Texas Instruments
    RF-HDT-AJLE-G1 Texas Instruments RF-HDT-AJLE Tag-it(TM) HF-I Standard Transponder Chip (Wafer, bumped, inked, grind, sawn on tape) Visit Texas Instruments