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    37SN Search Results

    37SN Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    DCM37SN Amphenol Communications Solutions High Performance D-Sub Power Board Mount Connectors, Input Output Connectors, Cable Connector, machined contacts 37 Way Socket, Solder bucket Visit Amphenol Communications Solutions
    FCE17C37SN280 Amphenol Communications Solutions Filter D-Sub Connectors, Input Output Connectors, FCE17 series, 37pin, Socket, 47000pF Visit Amphenol Communications Solutions
    FCE17C37SN4D0 Amphenol Communications Solutions Filter D-Sub Connectors, Input Output Connectors, FCE17 series, 37pin, Socket, 50pF Visit Amphenol Communications Solutions
    FCE17C37SN210 Amphenol Communications Solutions Filter D-Sub Connectors, Input Output Connectors, FCE17 series, 37pin, Socket, 470pF Visit Amphenol Communications Solutions
    FCE17C37SN450 Amphenol Communications Solutions Filter D-Sub Connectors, Input Output Connectors, FCE17 series, 37pin, Socket, 1000pF Visit Amphenol Communications Solutions
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    37SN Price and Stock

    Kycon Inc K22X-C37S-N

    CONN D-SUB RCPT 37POS R/A SLDR
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey K22X-C37S-N Tray 1,214 1
    • 1 $5.71
    • 10 $5.71
    • 100 $3.47663
    • 1000 $3.09875
    • 10000 $3.09875
    		Buy Now
    Bristol Electronics K22X-C37S-N 40
    • 1 -
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    • 100 -
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    • 10000 -
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    Kycon Inc K22X-C37S-NJ

    CONN D-SUB RCPT 37POS R/A SLDR
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey K22X-C37S-NJ Tray 1,133 1
    • 1 $6.43
    • 10 $6.43
    • 100 $3.91875
    • 1000 $3.5375
    • 10000 $3.5375
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    Mouser Electronics K22X-C37S-NJ 153
    • 1 $4.82
    • 10 $4.82
    • 100 $3.53
    • 1000 $3.53
    • 10000 $3.53
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    Sager K22X-C37S-NJ 1
    • 1 $5.66
    • 10 $5.38
    • 100 $4.73
    • 1000 $4.25
    • 10000 $4.25
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    Same Sky CMI-4537-SN69

    MIC COND ANLG UNI -37DB 0.382"D
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey CMI-4537-SN69 Box 816 1
    • 1 $3.03
    • 10 $2.472
    • 100 $2.0168
    • 1000 $1.6625
    • 10000 $1.6625
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    Mouser Electronics CMI-4537-SN69 791
    • 1 $3.05
    • 10 $2.53
    • 100 $1.97
    • 1000 $1.74
    • 10000 $1.73
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    TME CMI-4537-SN69 1,000
    • 1 -
    • 10 -
    • 100 -
    • 1000 $2.18
    • 10000 $2.18
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    Kycon Inc KF22X-C37S-NJ

    CONN D-SUB RCPT 37POS R/A SLDR
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey KF22X-C37S-NJ Tray 96 1
    • 1 $10.33
    • 10 $10.33
    • 100 $8.265
    • 1000 $8.265
    • 10000 $8.265
    		Buy Now

    ITT Interconnect Solutions DCMN-37S-N-A197

    CONN D-SUB RCPT 37P PNL MNT SLDR
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey DCMN-37S-N-A197 Bag 88 1
    • 1 $47.34
    • 10 $38.589
    • 100 $32.125
    • 1000 $32.125
    • 10000 $32.125
    		Buy Now
    Find more 37SN price and stock on Findchips.com

    37SN Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    37sn

    Abstract: No abstract text available
    Text: Datasheet for part number MKJ0A6F12-37SN Our Catalog Part Number: MKJ0A6F12-37SN Our Global Manufacturing Part Number: 155004-0000 Brand: Cannon Product Category: Circular Product Line: Trinity MKJ Series: MKJ0 Product Datasheet Series Class Shell Style Shell Size


    Original     		PDF MKJ0A6F12-37SN MKJ0A6F12-37SN MIL-STD-1344 37sn

    Untitled

    Abstract: No abstract text available
    Text: Datasheet for part number MKJ0A7F12-37SN Our Catalog Part Number: MKJ0A7F12-37SN Our Global Manufacturing Part Number: 155044-0001 Brand: Cannon Product Category: Circular Product Line: Trinity MKJ Series: MKJ0 Product Datasheet Series Class Shell Style Shell Size


    Original     		PDF MKJ0A7F12-37SN MKJ0A7F12-37SN MIL-STD-1344

    SMCTTA32N14A10

    Abstract: TA32N14A10
    Text: SMCT TA20N20A10 Advanced Pulse Power Device N-MOS VCS, ThinPakTM Preliminary Data Sheet Description Package This voltage controlled Solidtron VCS discharge switch utilizes an n-type MOS-Controlled Thyristor mounted on a ThinPakTM, ceramic "chip-scale" hybrid.


    Original     		PDF TA20N20A10 63pb/37sn SMCTTA32N14A10 TA32N14A10

    CCSTA14N40

    Abstract: FP4651 Solidtron gto thyristor SCR 957
    Text: CCSTA14N40 N-Type, ThinPakTM Preliminary Data Sheet Description Package This current controlled Solidtron CCS discharge switch is an ntype Thyristor in a high performance ThinPakTM package. The device gate is similar to that found on a traditional GTO Thyristor.


    Original     		PDF CCSTA14N40 302oC 63pb/37sn 63pb/37sn 260oC CCSTA14N40 FP4651 Solidtron gto thyristor SCR 957

    Untitled

    Abstract: No abstract text available
    Text: WED3C7410E16MC-XBHX 7410E RISC Microprocessor HiTCE Multichip Package OVERVIEW FEATURES The WEDC 7410E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features: doze, nap, sleep and


    Original     		PDF WED3C7410E16MC-XBHX 7410E 7410E/SSRAM WED3C7410E16M-XBX, WED3C7558M-XBX WED3C750A8M-200BX WED3C7410E16MC-XBHX 63Pb/37SN) 63Sn/37Pb)

    WED3C7410E16MC-XBHX

    Abstract: 7410E WED3C7410E16M-XBX WED3C750A8M-200BX WED3C7558M-XBX 90Pb WED3C7410E16MC
    Text: White Electronic Designs WED3C7410E16MC-XBHX 7410E RISC Microprocessor HiTCE Multichip Package The WED3C7410E16MC-XBHX is offered in Commercial 0°C to +70°C , industrial (-40°C to +85°C) and military (-55°C to +125°C) temperature ranges and is well suited


    Original     		PDF WED3C7410E16MC-XBHX 7410E WED3C7410E16MC-XBHX 7410E/SSRAM 16Mbits 200MHz 7410E WED3C7410E16M-XBX WED3C750A8M-200BX WED3C7558M-XBX 90Pb WED3C7410E16MC

    7410E

    Abstract: WED3C7410E16M-XBHX WED3C7410E16M-XBX WED3C750A8M-200BX WED3C7558M-XBX 90Pb10Sn block diagram of automatic flush system
    Text: White Electronic Designs WED3C7410E16M-XBHX PRELIMINARY* 7410E RISC Microprocessor HiTCE Multichip Package The WED3C7410E16M-XBHX is offered in Commercial 0°C to +70°C , industrial (-40°C to +85°C) and military (-55°C to +125°C) temperature ranges and is well suited


    Original     		PDF WED3C7410E16M-XBHX 7410E WED3C7410E16M-XBHX 7410E/SSRAM 400MHz 450MHz 16Mbits 200MHz WED3C7410E16M-XBX WED3C750A8M-200BX WED3C7558M-XBX 90Pb10Sn block diagram of automatic flush system

    INCOMING PACKAGING MATERIAL INSPECTION form

    Abstract: MIL-STD-105C underfill 45X45mm motherboard major problems & solutions Low viscosity underfill for flip chip
    Text: FUJITSU/SUN MICROSYSTEMS ULTRASPARC-IIi MCM: MINIATURIZATION TO THE EXTREME Michelle Hou Fujitsu San Jose, CA USA Takashi Ozawa Fujitsu Kawasaki, JAPAN Dev Malladi, Chris Furman, Mary Krebser, Steve Boyle, Mohsen Saneinejad Sun Microsystems Palo Alto, CA USA


    Original     		PDF 300MHz 45mmx45mems) 0-100C) INCOMING PACKAGING MATERIAL INSPECTION form MIL-STD-105C underfill 45X45mm motherboard major problems & solutions Low viscosity underfill for flip chip

    900E 1800

    Abstract: chotherm power IGBT MOSFET GTO SCR diode 95Sn5Sb SCR GTO die 28Cu72Ag igbt simulation dc to dc chopper by thyristor thyristor POWEREX powerex igbt
    Text: C U S T O M D E S I G N E D P O W E R M O D U L E S Solutions for High Power Applications C U S T O M D E S I G N E D ● High Power ● ● Solutions in ● Custom Module ● Design ● ● Powerex has addressed ● the need for application ● specific custom power


    Original     		PDF 135-5K-4/05 900E 1800 chotherm power IGBT MOSFET GTO SCR diode 95Sn5Sb SCR GTO die 28Cu72Ag igbt simulation dc to dc chopper by thyristor thyristor POWEREX powerex igbt

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs WED3C755E8M-XBHX 755E RISC MICROPROCESSOR HiTCE MULTI-CHIP PACKAGE OVERVIEW FEATURES The WEDC 755E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features:


    Original     		PDF WED3C755E8M-XBHX 755E/SSRAM WED3C755E8M-XBHX 128Kx72 21mmx25mm, 300MHz/ 150MHz, 350MHz/175MHz) 66MHz

    TA65N14A10

    Abstract: 1E21 MCT thyristor SMCTTA65N14A10 RG-47
    Text: SMCT TA65N14A10 Advanced Pulse Power Device N-MOS VCS, ThinPakTM Description Package This voltage controlled Solidtron VCS discharge switch utilizes an n-type MOS-Controlled Thyristor mounted on a ThinPakTM, ceramic "chip-scale" hybrid. Gate Return Bond Area


    Original     		PDF TA65N14A10 63pb/37sn 260oC TA65N14A10 1E21 MCT thyristor SMCTTA65N14A10 RG-47

    SMCTTA32N14A10

    Abstract: MOS-Controlled Thyristor MCT thyristor MOS Controlled Thyristor
    Text: SMCTTA32N14A10 SolidtronTM 275 Great Valley Parkway Malvern, PA 19355 Ph: 610-407-4700 www.siliconpower.com N-MOS VCS, ThinPakTM Data Sheet Rev 2 - 07/10/2008 Description Package This voltage controlled SolidtronTM (VCS) discharge switch utilizes an n-type MOS-Controlled Thyristor mounted on a


    Original     		PDF SMCTTA32N14A10 260oC SMCTTA32N14A 04242009-NB-0007 SMCTTA32N14A10 MOS-Controlled Thyristor MCT thyristor MOS Controlled Thyristor

    TA32N14A10

    Abstract: SCR 3KA 37sn TA32N14 MOS Controlled Thyristor RG-47
    Text: SMCT TA32N14A10 Advanced Pulse Power Device N-MOS VCS, ThinPakTM Description Package This voltage controlled Solidtron VCS discharge switch utilizes an n-type MOS-Controlled Thyristor mounted on a ThinPakTM, ceramic "chip-scale" hybrid. Gate Return Bond Area


    Original     		PDF TA32N14A10 63pb/37sn 260oC TA32N14A10 SCR 3KA 37sn TA32N14 MOS Controlled Thyristor RG-47

    TA32N14A10

    Abstract: MOS-Controlled Thyristor MCT thyristor 63SN 37PB SOLDER TA32N14 ta32n14a KA NMOS 1400V MCT 302oC Solidtron
    Text: SMCT TA32N14A10 Advanced Pulse Power Device N-MOS VCS, ThinPakTM Description Package This voltage controlled Solidtron VCS discharge switch utilizes an n-type MOS-Controlled Thyristor mounted on a ThinPakTM, ceramic "chip-scale" hybrid. Gate Return Bond Area


    Original     		PDF TA32N14A10 63pb/37sn 260oC TA32N14A10 MOS-Controlled Thyristor MCT thyristor 63SN 37PB SOLDER TA32N14 ta32n14a KA NMOS 1400V MCT 302oC Solidtron

    PBGA 256 reflow profile

    Abstract: bga 196 land pattern Intel reflow soldering profile BGA BGA PACKAGE TOP MARK intel BGA PACKAGE thermal profile A5825-01 BGA and QFP Package BGA OUTLINE DRAWING bga Shipping Trays land pattern BGA 0.75
    Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)


    Original     		PDF

    WED3C755E8MF

    Abstract: 90Pb WED3C750A8M-200BX WED3C7558M-XBX WED3C755E8MF-XBX WED3C755E8M-XBX
    Text: White Electronic Designs WED3C755E8M-XBHX 755E RISC MICROPROCESSOR HiTCE MULTI-CHIP PACKAGE OVERVIEW FEATURES The WEDC 755E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features:


    Original     		PDF WED3C755E8M-XBHX 755E/SSRAM WED3C755E8M-XBHX WED3C755E8MF 90Pb WED3C750A8M-200BX WED3C7558M-XBX WED3C755E8MF-XBX WED3C755E8M-XBX

    pcb warpage in ipc standard

    Abstract: Intel reflow soldering profile BGA a5764 "BGA Rework Practices", corner relief carrier tape Intel reflow soldering profile BGA LEAD FREE bga 196 land pattern fine line bga thermal cycling reliability JEDEC bga 63 tray fine BGA thermal profile
    Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)


    Original     		PDF

    CM16C550P

    Abstract: 4.7 uf/50v smd capacitor sad1 diode smd NPN CD100 transistor SPER 1A1 C4 0.1 uf/50v smd capacitor DIALCO C01100 cm16c550pe TRAY DAEWON TSOP
    Text: Rev. 2.1 i960 Rx I/O Processor Design Guide November, 1997 Order Number: 273004-002 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of


    Original     		PDF 74ALS245A 74ALS245AD-T 74AS244 SN74AS244DWR 74F07 N74F07AD 74F04 74F04D 74F32 SN74F32DR CM16C550P 4.7 uf/50v smd capacitor sad1 diode smd NPN CD100 transistor SPER 1A1 C4 0.1 uf/50v smd capacitor DIALCO C01100 cm16c550pe TRAY DAEWON TSOP

    Intel reflow soldering profile BGA

    Abstract: A5832 JEDEC bga 63 tray Intel BGA cte table epoxy substrate BGA PROFILING A4470-01 Lead Free reflow soldering profile BGA land pattern BGA 196 a5764
    Text: Ball Grid Array BGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems


    Original     		PDF

    MOS-Controlled Thyristor

    Abstract: SMCTTA65N14A10 MCT thyristor SMCTAA65N14A10 63SN 37PB SOLDER SMCTTA65N
    Text: SMCTTA65N14A10 SolidtronTM 275 Great Valley Parkway Malvern, PA 19355 Ph: 610-407-4700 N-MOS VCS, ThinPak Data Sheet Rev 0 - 02/15/08 Description Package Size - 6 SolidtronTM This voltage controlled (VCS) discharge switch utilizes an n-type MOS-Controlled Thyristor mounted on a


    Original     		PDF SMCTTA65N14A10 63pb/37sn 260oC SMCTAA65N14A10 04242009-NB-0011 MOS-Controlled Thyristor SMCTTA65N14A10 MCT thyristor SMCTAA65N14A10 63SN 37PB SOLDER SMCTTA65N

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs WED3C7410E16M-400BHXX RISC Microprocessor HiTCE™ Multichip Package OVERVIEW *ADVANCED The WED3C7410E16M-400BHXX is offered in Commercial 0°C to +70°C , industrial (-40°C to +85°C) and military (-55°C to +125°C) temperature ranges and is


    Original     		PDF WED3C7410E16M-400BHXX 7410E/SSRAM WED3C7410E16M-400BHXX 7410E 256Kx72 21mmx25mm, 400MHz 200MHz 100MHz

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs WED3C755E8M-XBHX ADVANCED* 755E RISC MICROPROCESSOR HiTCE MULTI-CHIP PACKAGE OVERVIEW FEATURES The WEDC 755E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features:


    Original     		PDF WED3C755E8M-XBHX 755E/SSRAM WED3C755E8M-XBHX 128Kx72 21mmx25mm, 300MHz/ 150MHz, 350MHz/175MHz) 66MHz

    glass diode marking 2U

    Abstract: 37sn 1N6640US 6643U 2U 73 diode marking 2U diode 1N6641
    Text: H M mm Sania Ana, CA ic n o m s e m 1N6639 1N6640 1N6641 i FEATURES Available in axial leaded and surface mount configurations 300mAmp 75-100 Volts 4nsec Computer Switching Diode Ultra Fast Reverse Recovery Time Very low Capacitance Metallurgical^ Bonded Non-cavity glass package


    OCR Scan     		PDF MIL-S-19500/509 1N4150 1N6639 1N6640 1N6641 300mAmp 1N6639US 1N6640US glass diode marking 2U 37sn 6643U 2U 73 diode marking 2U diode 1N6641

    AM6012

    Abstract: C312G CMP05
    Text: 12-Bt Hcji SfDeedIVUtiplying DAGönverter D°C312 ANALOG DEVICES FEATURES Differential Nonlinearity: ± 1 /2 LSB Nonlinearity: 0.05% Fast S ettling Time: 250 ns High Compliance: - 5 V to +10 V Differential Outputs: 0 to 4 mA Guaranteed M onotonicity: 12 Bits


    OCR Scan     		PDF 12-Bt CMP-05_ 37SnS_ 880nS BUF-03) 12-Bit AM6012 C312G CMP05