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    48 PIN IC QFJ Search Results

    48 PIN IC QFJ Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    74HC4053FT Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, SPDT(1:2)/Analog Multiplexer, TSSOP16B, -40 to 125 degC Visit Toshiba Electronic Devices & Storage Corporation
    7UL2T125FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation
    7UL2T126FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation
    74HC4051FT Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, SP8T(1:8)/Analog Multiplexer, TSSOP16B, -40 to 125 degC Visit Toshiba Electronic Devices & Storage Corporation
    7UL1G07FU Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Non-Inverter Buffer (Open Drain), USV, -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation

    48 PIN IC QFJ Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: E2D0018-27-41 ¡ Semiconductor MSM9802/03/05-xxx ¡ Semiconductor This version: Jan. 1998 MSM9802/03/05-xxx Previous version: May. 1997 Built-in Mask ROM Voice Synthesis IC GENERAL DESCRIPTION The MSM9802/03/05 is a PCM voice synthesis IC with built-in mask ROM.


    Original     		PDF E2D0018-27-41 MSM9802/03/05-xxx MSM9802/03/05-xxx MSM9802/03/05 10-bit MSM9802/03/ SSOP30-P-56-0

    tsop 48 PIN type2

    Abstract: 50 mil pitch ceramic package BGA and QFP Package mounting 64 pin IC FOUR SIDE 48 pin ic qfj 84-Pin QFN
    Text: Packages for IC Through-hole mount type DIP Surface mount type1 SIP Dual In-line Package (Single In-line Package) Terminals are on one side of the package and are arranged in a row. Terminals are on two opposite sides of the package and are arranged two rows.


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    QFN "100 pin" PACKAGE

    Abstract: PIN32 BGA 176 ball package IC-288 280-Pin BGA
    Text: IC パッケージ 端子挿入タイプ DIP 表面実装タイプ 1 SIP Dual In-line Package (Single In-line Package) 端子がパッケージの２側面から取り 出された端子列２のパッケージ。 端子ピッチは2.54 mm (100 mil) 端子がパッケージの１側面から取り


    Original     		PDF

    cx20185

    Abstract: UHF FM Transceiver motorola 5118 motorola 5118 uhf CXA1446S Sony Semiconductor ILX511 CXA1691 CXA1733M CXA1619S SONY ICX
    Text: Sony Semiconductor 96.10 Sony Semiconductor Product List ’96 – 10 TABLE OF CONTENTS MEMORY CMOS/Bi-CMOS SRAM . 1 • LINEUP . 1


    Original     		PDF LCX009AK/AKB LCX011AM LCX012BL LCX016AL LCX016AM LCX019AM PHD003 PHD010 PHD011 PHD016 cx20185 UHF FM Transceiver motorola 5118 motorola 5118 uhf CXA1446S Sony Semiconductor ILX511 CXA1691 CXA1733M CXA1619S SONY ICX

    nec 44 pin LQFP

    Abstract: BGA and QFP Package 256-pin BGA drawing 14 pin ic 28-pin QFP nec 44-pin qfp 44-Pin QFN 65A1 nec 44-pin LQFP ic packages
    Text: CHAPTER 3 SURFACE MOUNT PACKAGES 3.1 LINEUP OF SURFACE MOUNT IC PACKAGES 3.2 LIST OF SURFACE MOUNT IC PACKAGES 1 Plastic SOP (Small Outline Package) (2) Ceramic WSOP (Small Outline Package with Window) (3) Plastic shrink SOP (Shrink Small Outline Package)


    Original     		PDF S64F1-CA1 S108S1-YHC P116S1-YJC S144S1-YKC S176S1-2C S224S1-3C-1 S304S1-6C S256N7-B6 S352N7-F6-1 S420N7-F6 nec 44 pin LQFP BGA and QFP Package 256-pin BGA drawing 14 pin ic 28-pin QFP nec 44-pin qfp 44-Pin QFN 65A1 nec 44-pin LQFP ic packages

    land pattern for TSOP 2 86 PIN

    Abstract: land pattern for TSOP 2 54 pin land pattern for TSOP 56 pin oki naming qfp 64 0.4 mm pitch land pattern TSOP 54 land pattern ic packages TSOP 66 pin Package thermal resistance SOJ 44 PCB land ED730
    Text: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS This document is Chapter 1 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS 1. PACKAGE CLASSIFICATIONS


    Original     		PDF

    R50-E2Y2-24

    Abstract: sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001
    Text: Ironwood Electronics PC.1 IC Package and Device Converters We offer over 500 adapters for converting IC packaging and device pinouts, solving many IC availability and performance issues. We also offer "fix" adapters to solve layout problems and some known chip deficiences. Custom, quick turn solutions are our speciality.


    Original     		PDF PC-ZIP/DIP20-01 PC-ZIP/DIP28-01 PC-ZIP/DIP28-02 PC-ZIP20/DIP18-01 R50-E2Y2-24 sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001

    QFP160-P-2828-0

    Abstract: QFP304 TSOP 66 pin Package thermal resistance TSOP 48 thermal resistance bga 208 PACKAGE QFJ32-P-R450-1 SDIP64-P-750-1 SOJ28-P-400-1 QFP208-P-2828-0 TSOP 48 thermal resistance junction to case
    Text: This version: Apr. 2001 Previous version:Jun. 1997 PACKAGE INFORMATION 5. THERMAL-RESISTANCE OF IC PACKAGE This document is Chapter 5 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 5. THERMAL-RESISTANCE OF IC PACKAGE


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    MD300-10A

    Abstract: QFN tray tray datasheet bga SIP 400B TSOP TRAY 40 PIN BGA package tray 64 NEC A39A 240 TSOP package tray 6-tsop TRAY DIMENSIONS 132 PGA
    Text: CHAPTER 4 CHAPTER 4 4.1 PACKING STYLES AND NOTES 4.1.1 Packing Styles 4.1.2 Notes on Handling 4.2 PACKING OF IC PACKAGES 4.2.1 List of Packing 1 DIP (2) SIP, V-DIP, ZIP (3) QUIP, Piggyback (4) PGA (5) SOP, SSOP (6) TSOP (I) (II) (7) QFP, QFP (FP) (8) SVP


    Original     		PDF S64F1-CA1 S108S1-YHC P116S1-YJC S144S1-YKC S176S1-2C S224S1-3C-1 S304S1-6C S256N7-B6 S352N7-F6-1 S420N7-F6 MD300-10A QFN tray tray datasheet bga SIP 400B TSOP TRAY 40 PIN BGA package tray 64 NEC A39A 240 TSOP package tray 6-tsop TRAY DIMENSIONS 132 PGA

    EP-78230

    Abstract: EP-78230GC-R EP-78230GJ-R EP-78230LQ-R EV-9200GC-80 EV-9200G-94-P0 94-PIN
    Text: EP-78230 EMULATION PROBE EP-78230GC-R EP-78230GJ-R EP-78230LQ-R 1994 1992 Document No. EEU-1515 O.D. No. EEU-985 Date Published December 1994 P Printed in Japan The information in this document is subject to change without notice. No part of this document may be copied or reproduced in any form or by any means without


    Original     		PDF EP-78230 EP-78230GC-R EP-78230GJ-R EP-78230LQ-R EEU-1515 EEU-985) EV-9200G-94 EV-9200G-94-P0 EV-9200 IEI-1207) EP-78230 EP-78230GC-R EP-78230GJ-R EP-78230LQ-R EV-9200GC-80 EV-9200G-94-P0 94-PIN

    SEG23

    Abstract: 3525 PWM analog dimming circuit 7 segment display duplex led type
    Text: E2C0016-27-Y4 ¡ Semiconductor MSC1200-xx/1200V-xx ¡ Semiconductor This version: Nov. 1997 MSC1200-xx/1200V-xx Previous version: Jul. 1996 30-Bit Duplex Controller/Driver with Digital/Analog Dimming and Keyscan Functions GENERAL DESCRIPTION The MSC1200-xx/1200V-xx is a Bi-CMOS display driver for 1/2-duty vacuum fluorescent


    Original     		PDF E2C0016-27-Y4 MSC1200-xx/1200V-xx 30-Bit MSC1200-xx/1200V-xx 64-bit QFP56-P-910-0 65-2K SEG23 3525 PWM analog dimming circuit 7 segment display duplex led type

    IC51-128

    Abstract: transistor fpq 630 PC-68 TTP-48DF OF IC 7421 Enplas fpq Enplas PT740 AB am fm radio Hitachi DSAUTAZ005
    Text: Hitachi Semiconductor Package Data Book Introduction Contents Section 1 Introduction of Packages 1.1 Types of Packages and Advantages 1.2 IC Package Name and Code Indication 1.3 Method of Indicating IC Package Dimensions 1.4 Lineups in Terms of Shapes and Materials


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    LGA 1156 PIN OUT diagram

    Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
    Text: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)


    Original     		PDF DIP8-P-300-2 DIP14-P-300-2 DIP16-P-300-2 DIP18-P-300-2 MIL-M-38510 MIL-STD-883 LGA 1156 PIN OUT diagram QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram

    HT 1200-4

    Abstract: YAMAICHI ic234 PT740 AB TSSOP YAMAICHI SOCKET FP-20-0.65-01 IC51-1444-1354-7 PT817 Enplas drawings IC51-2084-1052-11 IC 7418 IC51-0242-1341
    Text: Hitachi Semiconductor Package Data Book ADE–410–001B 3rd Edition March/97 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher functional


    Original     		PDF March/97 HT 1200-4 YAMAICHI ic234 PT740 AB TSSOP YAMAICHI SOCKET FP-20-0.65-01 IC51-1444-1354-7 PT817 Enplas drawings IC51-2084-1052-11 IC 7418 IC51-0242-1341

    HT 1200-4

    Abstract: IC51-2084-1052-11 IC51-0242-1341 YAMAICHI ic234 transistor fpq 630 IC51-0404-1511 fpq-144-0.5-03 648-0482211-A01 IC189 Series Open Top SOP, SSOP, TSOP Type I a HLQFP 176 Package drawing
    Text: Hitachi Semiconductor Package Data Book ADE–410–001C 4th Edition March/98 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher


    Original     		PDF March/98 intern844-347360 HT 1200-4 IC51-2084-1052-11 IC51-0242-1341 YAMAICHI ic234 transistor fpq 630 IC51-0404-1511 fpq-144-0.5-03 648-0482211-A01 IC189 Series Open Top SOP, SSOP, TSOP Type I a HLQFP 176 Package drawing

    MSC1200V

    Abstract: MSC1200v-01gs-2k 3525 PWM CIRCUIT DIAGRAM FOR msc1200 MSC1200-01 MSC1200V-01 keyscan
    Text: FEDL1200V-03 FEDL1200V-03 This version: Sep. 2000 MSC1200-01/1200V-01 Previous version: Nov. 1997 ¡ Semiconductor MSC1200-01/1200V-01 ¡ Semiconductor 30-Bit Duplex Controller/Driver with Digital/Analog Dimming and Keyscan Functions GENERAL DESCRIPTION The MSC1200-01/1200V-01 is a Bi-CMOS display driver for 1/2-duty vacuum fluorescent


    Original     		PDF FEDL1200V-03 MSC1200-01/1200V-01 30-Bit MSC1200-01/1200V-01 64-bit MSC1200V MSC1200v-01gs-2k 3525 PWM CIRCUIT DIAGRAM FOR msc1200 MSC1200-01 MSC1200V-01 keyscan

    PNP 8550

    Abstract: MSC1200-01 MSC1200V-01
    Text: Dear customers, About the change in the name such as "Oki Electric Industry Co. Ltd." and "OKI" in documents to OKI Semiconductor Co., Ltd. The semiconductor business of Oki Electric Industry Co., Ltd. was succeeded to OKI Semiconductor Co., Ltd. on October 1, 2008.


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    PT740 AB

    Abstract: 095G Unitechno rfpak fuji semiconductors manual 652B0082211-002 ADE-410-001J BP-108 EDR7315 QP4-064050-002-A
    Text: Hitachi Semiconductor Package Data Book ADE-410-001J 11th Edition March/2002 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher


    Original     		PDF ADE-410-001J March/2002 PT740 AB 095G Unitechno rfpak fuji semiconductors manual 652B0082211-002 BP-108 EDR7315 QP4-064050-002-A

    EP-78230

    Abstract: EP-78230GC-R EP-78230GJ-R EP-78230LQ-R EV-9200GC-80 EV-9200G-94-P0
    Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid


    Original     		PDF EV-9200G-94 EV-9200G-94-P0 EV-9200 IEI-1207) EP-78230 EP-78230GC-R EP-78230GJ-R EP-78230LQ-R EV-9200GC-80 EV-9200G-94-P0

    PD72107

    Abstract: SSL110 uPD7210 PD98201 uPD98201 PD7210 UPD70116 uPD71059 PD72107L
    Text: DATA SHEET MOS INTEGRATED CIRCUIT µPD72107 LAP-B CONTROLLER Link Access Procedure Balanced mode The µPD72107 is an LSI that supports LAP-B protocol specified by the ITU-T recommended X.25 on a single chip. FEATURES • Complied with ITU-T recommended X.25 LAP-B84


    Original     		PDF PD72107 PD72107 LAP-B84 JT-T90 SSL110 uPD7210 PD98201 uPD98201 PD7210 UPD70116 uPD71059 PD72107L

    Untitled

    Abstract: No abstract text available
    Text: !C PACKAGES ip * yjjj TCP Tape Carrier Package /COB (Chip on Board)/CDF ( • TCP Keeping with the trend toward smaller and lighter equipment incorporating even more advanced functions, surface-mount 1C packages have recently come to the forefront with the aim of achieving higher pin counts, finer pin pitches, and reduced dimensions. TCP (Tape


    OCR Scan     		PDF

    fbga 12 x 12 thermal resistance

    Abstract: FBGA160-P-1212
    Text: 1C PACKAGES Pin-inserting Type i Surface-mount Type 1C Pack. TCP Tape Carrier Package CSP (Chip Size Package) Stacked Package COB (Chip On Board) Nowadays, the prominence of higher performance, smaller and lighter electronic equipment is increasing. Accordingly, the role played by the


    OCR Scan     		PDF developme5x24 fbga 12 x 12 thermal resistance FBGA160-P-1212

    SK-DIP28

    Abstract: 48 pin ic qfj
    Text: IC PACKAGES IC Packages «Under development Surface-M ounted Type . • ‘. . I : c « I f * Pin pitch Ì7|M a.d»plH _ . .-n 'a;: ;!*•». sissjm *•.*. *•! I. A M 1*! 14 16 24 24 24 28 32 40 44 SOP 5.7 225 7.62(300) 1.27(50) 13.3(525) 12 MFP 0.65


    OCR Scan     		PDF 10x20 12x18 14x20 SK-DIP28 48 pin ic qfj

    Untitled

    Abstract: No abstract text available
    Text: E2E0027-38-95 O K I Semiconductor P r e v io u s v e r s io n : M a r . 1 9 9 6 M SM 63238 4-Bit Microcontroller with Built-in POCSAG Decoder and Melody Circuit, Operating at 0.9 V Min. GENERAL DESCRIPTION The MSM63238 is a CMOS 4-bit microcontroller with a built-in POCSAG (Post Office Code


    OCR Scan     		PDF E2E0027-38-95 MSM63238 nX-4/250 MSM63P238 80-pin MSM63P238) MSM63238