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    MIL-C-28859

    Abstract: No abstract text available
    Text: HIGH DENSITY PLUS Daughtercard Modules Socket modules are pre-assembled into precisely located holes in an extruded aluminum stiffener. End-stackability offers the same flexibility to the daughtercard assembly as the backpanel modules. Both are available in


    OCR Scan     		PDF 554423fl 000213S MIL-C-28859

    S544B

    Abstract: No abstract text available
    Text: HIGH DENSITY PLUS HP Series Backpanel Pin Module plug-up capability to standard socket connectors. Plus rows of contacts in the pin modules are located within the side walls of the insulator. They employ a preloaded cantilever spring design similar to those found in cardedge connectors.


    OCR Scan     		PDF 554423fl S544B