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    60BOC Search Results

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    60BOC Price and Stock

    Balluff Inc BES01HP (ALTERNATE: BES 516-360-BO-C-05)

    ProXimity Sensor, BES 516-360-BO-C-05 | Balluff BES01HP
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    RS BES01HP (ALTERNATE: BES 516-360-BO-C-05) Bulk 1
    • 1 $183.11
    • 10 $183.11
    • 100 $183.11
    • 1000 $183.11
    • 10000 $183.11
    		Get Quote

    Balluff Inc BES01HN (ALTERNATE: BES 516-360-BO-C-03)

    ProXimity Sensor, Cable, (NO), PNP, Sn8.00mm, Non embeddable, M18X1 | Balluff BES01HN
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    RS BES01HN (ALTERNATE: BES 516-360-BO-C-03) Bulk 1
    • 1 $118.14
    • 10 $118.14
    • 100 $118.14
    • 1000 $118.14
    • 10000 $118.14
    		Get Quote

    Balluff Inc BES02FJ (ALTERNATE: BES 515-360-BO-C-PU-10)

    ProXimity Sensor, Cable, (NO), PNP, Sn8.00mm, Non embeddable, M18X1 | Balluff BES02FJ
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    RS BES02FJ (ALTERNATE: BES 515-360-BO-C-PU-10) Bulk 1
    • 1 $111.16
    • 10 $111.16
    • 100 $111.16
    • 1000 $111.16
    • 10000 $111.16
    		Get Quote

    Balluff Inc BES01HU (ALTERNATE: BES 516-360-BO-C-PU-05)

    ProXimity Sensor, Cable, (NO), PNP, Sn8.00mm, Non embeddable, M18X1 | Balluff BES01HU
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    RS BES01HU (ALTERNATE: BES 516-360-BO-C-PU-05) Bulk 1
    • 1 $117.12
    • 10 $117.12
    • 100 $117.12
    • 1000 $117.12
    • 10000 $117.12
    		Get Quote

    Balluff Inc BES02FH (ALTERNATE: BES 515-360-BO-C-PU-03)

    ProXimity Sensor, Cable, (NO), PNP, Sn8.00mm, Non embeddable, M18X1 | Balluff BES02FH
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    RS BES02FH (ALTERNATE: BES 515-360-BO-C-PU-03) Bulk 1
    • 1 $137.6
    • 10 $137.6
    • 100 $137.6
    • 1000 $137.6
    • 10000 $137.6
    		Get Quote
    Find more 60BOC price and stock on Findchips.com

    60BOC Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    K8D3216UBC-pi07

    Abstract: K5E5658HCM KAD070J00M KBH10PD00M K5D1257ACM-D090000 samsung ddr2 ram MTBF KBB05A500A K801716UBC k5d1g13acm k5a3281ctm
    Text: Product Selection Guide Memory and Storage April 2005 MEMORY AND STORAGE SECTION A DRAM DDR2 SDRAM DDR SDRAM SDRAM RDRAM NETWORK DRAM MOBILE SDRAM GRAPHICS DDR SDRAM DRAM ORDERING INFORMATION FLASH NAND, OneNAND, NOR FLASH NAND FLASH ORDERING INFORMATION SRAM


    Original     		BR-05-ALL-002 K8D3216UBC-pi07 K5E5658HCM KAD070J00M KBH10PD00M K5D1257ACM-D090000 samsung ddr2 ram MTBF KBB05A500A K801716UBC k5d1g13acm k5a3281ctm PDF

    RISC-Processor s3c2410

    Abstract: MR16R1624DF0-CM8 arm9 samsung s3c2440 architecture chip 3351 dvd sp0411n K9W8G08U1M sandisk micro SD Card 2GB arm9 s3c2440 K9F1G08U0A K6X8008C2B
    Text: A Section MEMORY Table of Contents SECTION A PAGE DRAM SDRAM 3a – 4a DDR SDRAM 5a – 6a DDR2 SDRAM 7a RDRAM 8a NETWORK DRAM 8a MOBILE SDRAM 9a GRAPHICS DDR SDRAM 10a DRAM ORDERING INFORMATION 11a –13a NAND FLASH COMPONENTS, SMART MEDIA, COMPACT FLASH


    Original     		BR-04-ALL-005 BR-04-ALL-004 RISC-Processor s3c2410 MR16R1624DF0-CM8 arm9 samsung s3c2440 architecture chip 3351 dvd sp0411n K9W8G08U1M sandisk micro SD Card 2GB arm9 s3c2440 K9F1G08U0A K6X8008C2B PDF

    csp defects

    Abstract: handling damage LGA socket MANUAL PCB Samsung MCP 1mm pitch BGA socket air handling unit CRACK pcb substrate HCFC141B
    Text: USER’S MANUAL Chip Scale Package • To make a win-win situation for CSP products supplier and customer, Samsung provides the information of CSP package’s characteristics and manuals to maintain high quality so that the problems of customer process can be minimized or prevented


    Original     		150um) 20mils x20mil csp defects handling damage LGA socket MANUAL PCB Samsung MCP 1mm pitch BGA socket air handling unit CRACK pcb substrate HCFC141B PDF

    1f1-1717-a19

    Abstract: 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9
    Text: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1 8*12 ,256M DDR 5G 60WMBG Package 8*12 130℃ MAX 60M/54WBGA-8.10X15.10-8X12-A TR_MARKING LA69-00635A Material Code Material Spec 48TBGA,10.0*9.0(8*16) 8*16 130℃ MAX 48-TBGA-10.0X9.0-8X16-O


    Original     		60WMBG 60M/54WBGA-8 10X15 10-8X12-A LA69-00635A 48TBGA 48-TBGA-10 0-8X16-O LA69-00267A ADS11981 1f1-1717-a19 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9 PDF