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Text: PRELIMINARY V•I Chip Bus Converter Module BCM B048F040T20 V•I Chip – BCM Bus Converter Module TM • 48 V to 4 V V•I Chip Converter • Typical efficiency 94% • 200 Watt 300 Watt for 1 ms • 125°C operation • High density – 182 A/in3 • <1 µs transient response
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Text: B048F040T20 B048F040M20 BCMTM Bus Converter • 48 V to 4 V V•I ChipTM Converter • Typical efficiency 94% • 200 Watt 300 Watt for 1 ms • 125°C operation (TJ) • High density – 173 A/in3 • <1 µs transient response • Small footprint – 40
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Abstract: No abstract text available
Text: B048F040T20 V•I BCMTM Bus Converter Module • 48 V to 4 V V•I ChipTM Converter • Typical efficiency 94% • 200 Watt 300 Watt for 1 ms • 125°C operation • High density – 173 A/in3 • <1 µs transient response • Small footprint – 40 A/in2
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Text: PRELIMINARY V•I Chip Bus Converter Module BCM B048F040T20 V•I Chip – BCM Bus Converter Module TM • 48 V to 4 V V•I Chip Converter • Typical efficiency 94% • 200 Watt 300 Watt for 1 ms • 125°C operation • High density – 182 A/in3 • <1 µs transient response
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Abstract: D496 D505 full converter 3 phase
Text: B048F040T20 B048F040M20 V•I BCMTM Bus Converter • 48 V to 4 V V•I ChipTM Converter • Typical efficiency 94% • 200 Watt 300 Watt for 1 ms • 125°C operation (TJ) • High density – 169 A/in3 • <1 µs transient response • Small footprint – 40
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B048F040T20
Abstract: No abstract text available
Text: PRELIMINARY V•I Chip Bus Converter Module BCM B048F040T20 V•I Chip – BCM Bus Converter Module TM • 48 V to 4 V V•I Chip Converter • Typical efficiency 94% • 200 Watt 300 Watt for 1 ms • 125°C operation • High density – 173 A/in3 • <1 µs transient response
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Abstract: No abstract text available
Text: B048F040T20 B048F040M20 BCMTM Bus Converter • 48 V to 4 V V•I ChipTM Converter • Typical efficiency 94% • 200 Watt 300 Watt for 1 ms • 125°C operation (TJ) • High density – 169 A/in3 • <1 µs transient response • Small footprint – 40
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Text: B048F040T20 V•I BCMTM Bus Converter Module • 48 V to 4 V V•I ChipTM Converter • Typical efficiency 94% • 200 Watt 300 Watt for 1 ms • 125°C operation • High density – 173 A/in3 • <1 µs transient response • Small footprint – 40 A/in2
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Text: B048F040T20 V•I BCMTM Bus Converter • 48 V to 4 V V•I ChipTM Converter • Typical efficiency 94% • 200 Watt 300 Watt for 1 ms • 125°C operation • High density – 173 A/in3 • <1 µs transient response • Small footprint – 40 A/in2 • Low weight – 0.5 oz (14 g)
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Text: Not Recommended for New Designs B048F040T20 B048F040M20 BCMTM Bus Converter • 48 V to 4 V V•I Chip Bus Converter • Typical efficiency 94% • 200 Watt 300 Watt for 1 ms • 125°C operation (TJ) • High density – 169 A/in3 • <1 µs transient response
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Text: B048F040T20 B048F040M20 V•I BCMTM Bus Converter • 48 V to 4 V V•I ChipTM Converter • Typical efficiency 94% • 200 Watt 300 Watt for 1 ms • 125°C operation (TJ) • High density – 173 A/in3 • <1 µs transient response • Small footprint – 40
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Text: PRELIMINARY V•I Chip Bus Converter Module BCM B048F040T20 V•I Chip – BCM Bus Converter Module TM • 48 V to 4 V V•I Chip Converter • Typical efficiency 94% • 200 Watt 300 Watt for 1 ms • 125°C operation • High density – 173 A/in3 • <1 µs transient response
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Text: B048F040T20 B048F040M20 BCMTM Bus Converter • 48 V to 4 V V•I ChipTM Converter • Typical efficiency 94% • 200 Watt 300 Watt for 1 ms • 125°C operation (TJ) • High density – 169 A/in3 • <1 µs transient response • Small footprint – 40
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Abstract: transistor array K1 marking
Text: V•I Chip Bus Converter Module BCM B048F040T20 V•I Chip – BCM Bus Converter Module TM • 48 V to 4 V V•I Chip Converter • Typical efficiency 94% • 200 Watt 300 Watt for 1 ms • 125°C operation • High density – 173 A/in3 • <1 µs transient response
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Text: V•I Chip Bus Converter Module BCM B048F040T20 V•I Chip – BCM Bus Converter Module TM • 48 V to 4 V V•I Chip Converter • Typical efficiency 94% • 200 Watt 300 Watt for 1 ms • 125°C operation • High density – 173 A/in3 • <1 µs transient response
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Text: B048F040T20 B048F040M20 V•I BCMTM Bus Converter • 48 V to 4 V V•I ChipTM Converter • Typical efficiency 94% • 200 Watt 300 Watt for 1 ms • 125°C operation (TJ) • High density – 173 A/in3 • <1 µs transient response • Small footprint – 40
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Text: 应用笔记 AN:008 V•I晶片母线转换模块 BCM 之热处理 原著 : Joe Aguilar – 产品工程师(V·I晶片) 及 Paul Yeaman – 首席产品工程部 (V·I晶片策略用户组) 引言 内容 页 此应用笔记探讨在不同室温风速及散热片条件时，BCM之功率输出能力。
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VIZ0002
Abstract: VIZ00 vicor MA01810 BCM reflow VIZ0033 B048F120T20 VTM 48 B048F030M21 B048F030T21 B048F060M24
Text: Product Change Notice Notice: #100118 update to PCN #090804 Date: January 18, 2010 To Our Valued Customers: We appreciate your use of V•I Chip products. Our commitment to customer satisfaction is demonstrated by our notification to you of a product enhancement.
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BCM48BH120T120A00
Abstract: B048F030T21 B048F040T20 B048F060T24 B048F080T24 B048F096T24 B048F120T30 B048F160T24 B048F480T30
Text: V•I Chip BCM Bus Converter RoHS • Input: 48 V • Isolation: 2,250 Vdc • Power Density: >1000 W/in3 • Footprint: 0.56 in2 / 1.08 in2 NRTL S C MADE IN USA • Current sharing: 5% BCM • Efficiency: up to 96% US 22,0 0.87 U.S. PATS. LISTED ON PACKING MATERIALS & DATASHEETS
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high frequency welder circuit diagram
Abstract: do-41 footprint pcb diagram of mini ups system battery charger for mobile 3.7 VDC welder circuit diagram ThermMate vicor 18373 Vicor 18372 st c 1117 ld 25 regulator Powerbank
Text: Vicor Corporation Power Solutions Vicor's product line of modular power components and complete power systems includes thousands of combinations of input voltage, output voltage, and power levels, complete with accessory components that integrate other power system
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high frequency welder circuit diagram
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B048F120T30
Abstract: B048F030T21 B048F040T20 B048F060T24 B048F080T24 B048F096T24 B048F160T24 I048C030T021P2
Text: 48 V Bus Converter Validation Board V•I Chip Bus Converter Validation Boards are available for testing the performance of the 48 V Bus Converter Modules BCM for Intermediate Bus Architecture (IBA) applications. The validation boards include one or two BCMs mounted on a standard quarter-brick
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Abstract: B048F040T20 B048F060T24 B048F080T24 B048F096T24 B048F120T30 B048F160T24 VIB0101THJ
Text: V•I Chip BCM Bus Converter • Current sharing: 5% • Input: 48 V • Isolation: 2,250 Vdc • Power Density: >1000 W/in3 • Footprint: 0.56 in2 / 1.08 in2 0812 RoHS US S NRTL C AP8265VIDE213P VIB0101THJ • Efficiency: up to 96% MADE IN USA 22,0 0.87
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Heat Trace
Abstract: power led heat sink B048F120T30 B048F030T21 B048F040T20 B048F060T24 B048F096T24 B048F160T24 B048F480T30
Text: Application Note AN:008 V•I Chip Bus Converter Module BCM Thermal Management By Joe Aguilar Product Line Engineer, V•I Chip & Paul Yeaman Principal Product Line Engineer, V•I Chip Strategic Accounts Introduction Contents Page Introduction 1 Efficiency &
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Abstract: 30268 VICOR 32497 30076 M-FIAM military passive component MIL-STD-810F shock pj 899 diode USER-CONFIGURE PB1004PFC inmate socket 18378
Text: VICOR CORPORATION Power Solutions Vicor's product line of modular power components and complete power systems includes thousands of combinations of input voltage, output voltage, and power levels, complete with accessory components that integrate other power system
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