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    SF-BGA568A-B-11

    Abstract: No abstract text available
    Text: D Package Code: BGA568A C 0.62mm [0.025"] .0225" dia. tooling holes X2 non plated (optional) See BGA pattern code to the right for actual pattern layout Y 0.88mm [0.035"] 0.635mm [0.025"] dia. pad 31.75mm [1.250"] X Top View (reference only) 0.64mm [0.025"]


    Original     		PDF BGA568A 635mm FR4/G10 SF-BGA568A-B-11

    BGA676

    Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
    Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18


    Original     		PDF BGA16A1ATTERNS BGA676 BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X