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    D2240 Search Results

    D2240 Result Highlights (2)

    Part ECAD Model Manufacturer Description Download Buy
    D2-24044-MR Renesas Electronics Corporation Digital Audio Amplifier Power Stage Visit Renesas Electronics Corporation
    D2-24044-MR-T Renesas Electronics Corporation Digital Audio Amplifier Power Stage Visit Renesas Electronics Corporation
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    D2240 Price and Stock

    Taiwan Chinsan Electronics Industrial Co Ltd GM2S181MND2240

    CAP ALUM 180UF 20% 420V SNAP TH
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey GM2S181MND2240 Bulk 220 1
    • 1 $6.5
    • 10 $4.447
    • 100 $3.3561
    • 1000 $2.77356
    • 10000 $2.62587
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    Taiwan Chinsan Electronics Industrial Co Ltd GM2G181VND2240

    CAP ALUM 180UF 400V SNAP TH
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    DigiKey GM2G181VND2240 Bulk 214 1
    • 1 $6.9
    • 10 $4.738
    • 100 $3.5887
    • 1000 $2.97473
    • 10000 $2.81906
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    Taiwan Chinsan Electronics Industrial Co Ltd PL2W181VND2240R

    CAP ALUM 180UF 450V SNAP TH
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey PL2W181VND2240R Bulk 203 1
    • 1 $7.83
    • 10 $5.42
    • 100 $4.1355
    • 1000 $3.44946
    • 10000 $3.27552
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    Renco Electronics Inc RLD-2240-2-12

    50/60 HZ 1.1VA 115/230V 115:12.6
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey RLD-2240-2-12 Bulk 200 1
    • 1 $9.36
    • 10 $7.484
    • 100 $6.6718
    • 1000 $5.79116
    • 10000 $5.79116
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    Renco Electronics Inc RLD-2240-4-24

    50/60 HZ 6 VA 115/230V 115:24V C
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey RLD-2240-4-24 Bulk 200 1
    • 1 $11.69
    • 10 $9.503
    • 100 $8.5574
    • 1000 $7.53476
    • 10000 $7.53476
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    Find more D2240 price and stock on Findchips.com

    D2240 Datasheets (3)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    D2-24044-MR Intersil D2-24044 - IC 30 W, 4 CHANNEL, AUDIO AMPLIFIER, PDSO38, ROHS COMPLIANT, PLASTIC, MO-153BDT-1, TSSOP-38, Audio/Video Amplifier Original PDF
    D2-24044-MR-T Intersil D2-24044 - IC 30 W, 4 CHANNEL, AUDIO AMPLIFIER, PDSO38, ROHS COMPLIANT, PLASTIC, MO-153BDT-1, TSSOP-38, Audio/Video Amplifier Original PDF
    D2240A Unknown Shortform IC and Component Datasheets (Plus Cross Reference Data) Short Form PDF

    D2240 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    ISS82

    Abstract: ESI 252 impedance meter D2240NL TO252and
    Text: S T U/D2240NL S amHop Microelectronics C orp. Nov 22,2004 N-C hannel E nhancement Mode Field E ffect Transistor F E AT UR E S P R ODUC T S UMMAR Y V DS S ID R DS ON S uper high dense cell design for low R DS (ON ). ( m W ) Max R ugged and reliable. 35@ V G S = 10V


    Original     		PDF U/D2240NL O-252 O-251 O-252AA Tube/TO-252 O-252 ISS82 ESI 252 impedance meter D2240NL TO252and

    Untitled

    Abstract: No abstract text available
    Text: Liqui-Bond SA 2000 Thermally Conductive, One-Part, Liquid Silicone Adhesive Features and Benefits TEST METHOD Visual 200,000 200,000 ASTM D2196 2.4 2.4 ASTM D792 6 6 — ASTM D2240 Shelf Life @ 10°C months PROPERTY AS CURED - PHYSICAL Hardness (Shore A)


    Original     		PDF D2196 D2240 D100ersâ LBSA2000

    Untitled

    Abstract: No abstract text available
    Text: Liqui-Bond SA 1800 One-Part Thermally Conductive, One-Part, Liquid Silicone Adhesive Features and Benefits 125,000 125,000 ASTM D2196 2.8 2.8 ASTM D792 6 6 — PROPERTY AS CURED - PHYSICAL Hardness (Shore A) 80 80 ASTM D2240 -76 to 392 -60 to 200 —


    Original     		PDF D2196 D1002 LBSA1800

    Untitled

    Abstract: No abstract text available
    Text: S T U/D2240NL S amHop Microelectronics C orp. Nov 22,2004 N-C hannel E nhancement Mode Field E ffect Transistor F E AT UR E S P R ODUC T S UMMAR Y V DS S ID R DS ON S uper high dense cell design for low R DS (ON ). ( m Ω ) Max R ugged and reliable. 35@ V G S = 10V


    Original     		PDF U/D2240NL O-252 O-251 O-252AA Tube/TO-252 O-252

    Untitled

    Abstract: No abstract text available
    Text: S T U/D2240NL S amHop Microelectronics C orp. Nov 22,2004 N-C hannel E nhancement Mode Field E ffect Transistor F E AT UR E S P R ODUC T S UMMAR Y V DS S ID R DS ON S uper high dense cell design for low R DS (ON ). ( m W ) Max R ugged and reliable. 35@ V G S = 10V


    Original     		PDF U/D2240NL O-252 O-251 O-252AA O-252

    ASTM D374

    Abstract: ASTM D2240, D412 ASTM D412 ASTM d412 ASTM D2240 D2240 ASTM d792 ASTM-D-257 ASTM-D-374
    Text: TG2030 Ultra Soft Thermal Conductive Pad Features Superior thermal conductivity Highly compressible Naturally tacky Low Shore OO hardness Low oil bleed Electrically insulating Applications Electronic components: IC - CPU - MOS LED - M/B - P/S - Heat Sink LCD-TV - Notebook PC - PC Telecom Device - Wireless Hub.etc.


    Original     		PDF TG2030 D5470 D2240 ASTM D374 ASTM D2240, D412 ASTM D412 ASTM d412 ASTM D2240 D2240 ASTM d792 ASTM-D-257 ASTM-D-374

    SJ-6506

    Abstract: D1894 astm D2632 ASTM D412 for rubber synthetic rubber adhesive
    Text: 3 Bumpon Protective Products TM Quiet Clear SJ-6500 Series Technical Data Product Description 3M Bumpon™ Quiet Clear SJ-6500 Series are molded cushioning products that utilize a special, soft polyurethane formulation and synthetic rubber adhesive system.


    Original     		PDF SJ-6500 SJ-6553 SJ-6506 SJ-6512 1-1W-10, SJ-6506 D1894 astm D2632 ASTM D412 for rubber synthetic rubber adhesive

    bergquist

    Abstract: SIL-PAD 1000 TO 247 ASTM D2240, D412 ASTM D374 SIL-PAD 900S D149 D150 D2240 D257 D374
    Text: Sil-Pad 900S High Performance Insulator for Low-Pressure Applications Features and Benefits TYPICAL PROPERTIES OF SIL-PAD 900S PROPERTY Color • Thermal impedance: 0.61°C-in2/W @50 psi • Electrically isolating • Low mounting pressures • Smooth and highly compliant surface


    Original     		PDF D2240 bergquist SIL-PAD 1000 TO 247 ASTM D2240, D412 ASTM D374 SIL-PAD 900S D149 D150 D2240 D257 D374

    Untitled

    Abstract: No abstract text available
    Text: Technical Data June 2011 3M Thermally Conductive Silicone Interface Pad 5515-20 and 5515-25 Product Description 3M™ Thermally Conductive Silicone Interface Pads 5515-20 and 5515-25 are designed to provide a preferential heat transfer path between heat generating components and heat sinks, heat spreaders or other cooling devices. The 3M Pad


    Original     		PDF 225-3S-06

    astm D150

    Abstract: D412 ASTM D412 ASTM D5470 ASTM D2240, D412 ASTM D2240 T-Flex 200 Outgassing CVCM ASTM
    Text: Laird Technologies Web site: www.LairdTech.com Item # Tflex 2130 V0, Tflex 200 V0 Series Gap Filler Material Tflex™ 200 V0 Series Gap Filler Material The Tflex™ 200 V0 Series is a very soft, free standing gap filler that is more compressible than most gap fillers. Tflex™


    Original     		PDF D5470 IPC-TM-650 astm D150 D412 ASTM D412 ASTM D5470 ASTM D2240, D412 ASTM D2240 T-Flex 200 Outgassing CVCM ASTM

    D149

    Abstract: D2240 D257 D412 A15561-00
    Text: TgardTM 3000 Thermally Conductive Insulators Innovative Technology for a Connected World Electrically Insulating, Thermally Conductive Material The TgardTM 3000 is specifically designed to solve over heating issues such as lower component efficiency, premature component failures, size limitations and other performance problems for today’s power


    Original     		PDF A15561-00 A15099-00 D149 D2240 D257 D412

    HELLERMANN

    Abstract: Wiring Duct PVC DUROMETER 5x4G HellermannTyton TC1.5W 106H SLHD4X4G4 SLHD2X4W
    Text: HellermannTyton’s Pro-Duct wiring duct efficiently routes and protects wire and cable. Manufactured from high impact, rigid PVC, Pro-Duct includes solid, slotted and high density slotted styles. Available in over 26 sizes. Pro-Duct comes in standard colors of gray and white in 6


    Original     		PDF QS9000 ISO14001 LITPD119 HELLERMANN Wiring Duct PVC DUROMETER 5x4G HellermannTyton TC1.5W 106H SLHD4X4G4 SLHD2X4W

    MIL-I-81765

    Abstract: d412 astm 412 ASTM D 2240 ASTM D2240, D412 ASTM B 412 ELONGATION D2240 grommet URHR-2 D635
    Text: shrinkHOoP Cable Clamp Heat Shrink Grommet Sizes 2, 3 and 4 c b a L Table of Dimensions, inch mm : Part Description URHR-2 URHR-3 URHR-4 Inside Diameter Min. Exp. (a) Max. Rec’d (b) 1.23 (31) 1.44 (37) 1.85 (47) 0.10 (2.5) 0.14 (3.5) 0.18 (4.6) Outside Diameter


    Original     		PDF MIL-I-81765/1 MIL-I-81765 D-149 D-257 MIL-I-81765 d412 astm 412 ASTM D 2240 ASTM D2240, D412 ASTM B 412 ELONGATION D2240 grommet URHR-2 D635

    MILL MAX HYDRAULIC OIL 32 msds

    Abstract: vg95343 skydrol raychem s1125 adhesive v9500 770-001A
    Text: Series 77 “Full Nelson” Environmental Shrink Boots Plus Transitions, Convoluted Boots, and nd Adapters For Harsh-Environment Cable Assemblies United States  United Kingdom  Germany  France  Nordic  Italy  Spain  Japan SERIES 77 FULL NELSON


    Original     		PDF in6-8-50550000 D-61449 MILL MAX HYDRAULIC OIL 32 msds vg95343 skydrol raychem s1125 adhesive v9500 770-001A

    Thermal Gap Filler

    Abstract: D149 D2240 D257 D412 E595
    Text: TflexTM 200 V0 Series Thermal Gap Filler Innovative Technology for a Connected World SOFT, FREESTANDING GAP FILLER Tflex 200 V0 is a very soft, freestanding gap filler that is more compliant than most other gap fillers. Combining good thermal conductivity of 1.1 W/mK with high conformability, this


    Original     		PDF A14175-00 Thermal Gap Filler D149 D2240 D257 D412 E595

    Untitled

    Abstract: No abstract text available
    Text: Gap Pad 1500S30 Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 1500S30 • Thermal conductivity: 1.3 W/m-K PROPERTY Color • Highly conformable / low hardness Reinforcement Carrier


    Original     		PDF 1500S30 E1269 D2240 1500S30

    a3000

    Abstract: No abstract text available
    Text: Gap Pad A3000 Thermally Conductive, Reinforced Gap Filling Material Features and Benefits • Thermal conductivity: 2.6 W/m-K • Fiberglass reinforced for puncture, shear and tear resistance • Reduced tack on one side to aid in application assembly • Electrically isolating


    Original     		PDF A3000 E1269 a3000

    Untitled

    Abstract: No abstract text available
    Text: Sil-Pad 800 High Performance Insulator for Low-Pressure Applications Features and Benefits T YPICAL PROPERT IES OF SIL-PAD 800 PROPERTY Color • Thermal impedance: 0.45°C-in 2/W @50 psi • High value material • Smooth and highly compliant surface


    Original     		PDF D2240

    Untitled

    Abstract: No abstract text available
    Text: Gap Pad 2500S20 Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 2500S20 • Thermal conductivity: 2.4 W/m-K PROPERTY Color • Low “S-Class” thermal resistance at


    Original     		PDF 2500S20 E1269 D2240 2500S20

    Untitled

    Abstract: No abstract text available
    Text: Gap Pad VO Ultimate Ultra Conformability, Robust, Improved Thermal Conductivity, Gap Filling Material Features and Benefits • Thermal conductivity: 1.3 W/m-K • Ultra conformability • Gel-like modulus TYPICAL PROPERTIES OF GAP PAD VO ULTIMATE PROPERTY


    Original     		PDF E1269

    C351

    Abstract: D149 D150 D2240 D257 D374 D575 D792 ASTM d792 ASTM D2240
    Text: Gap Pad 2000S40 Highly Conformable,Thermally Conductive “S-Class” Gap Filling Material Features & Benefits TYPICAL PROPERTIES OF GAP PAD 2000S40 PROPERTY Color • Thermal conductivity = 2.0 W/mK • Low S-Class thermal resistance at very low pressures


    Original     		PDF 2000S40 C351 D149 D150 D2240 D257 D374 D575 D792 ASTM d792 ASTM D2240

    Untitled

    Abstract: No abstract text available
    Text: TflexTM 300 Series Thermal Gap Filler Innovative Technology for a Connected World UNIQUE SILICONE GEL OFFERS COMPLIANCY, THERMAL RESISTANCE Tflex 300, at pressures of 50psi, will deflect to over 50% the original thickness. This high rate of compliancy allows the material to “totally blanket” the component, enhancing


    Original     		PDF 50psi, 300-H A15293-00

    Untitled

    Abstract: No abstract text available
    Text: TflexTM HR200 Series Thermal Gap Filler Innovative Technology for a Connected World PRELIMINARY MID-PERFORMANCE GAP FILLER WITH 1.6 W/MK Tflex HR200 is a cost-effective and compliant gap filler thermal interface material with excellent thermal performance and great handling for mass-production applications.


    Original     		PDF HR200 A16503-00

    Untitled

    Abstract: No abstract text available
    Text: f f l H A R R D22402 I S S E M I C O N D U C T O R Sync Generator for TV Applications and Video Processing Systems November 1996 Features Description • Interlaced Composite Sync Output The Harris C D22402 Note is a CM OS LSI sync generator that produces all the tim ing signals required to drive a fully 2-to-1


    OCR Scan     		PDF CD22402 525-line 30-fram 625-line 25-fram D22402