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Untitled Abstract: No abstract text available Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS2108 Nov-97 9735 B1 ANAM, K. DN721124AAD 5.0µ NI 24 SOIC STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): 0 Hr Bake, 125°C, 24 Hr	Original	PDF	Nov-97 DN721124AAD DS2108 P-20875 P-20992 P-20993, P-21077 P-21078 P-21079 C/100%
P21096 Abstract: 208-MIL P2075 Text: RELIABILITY MONITOR DS1000M-25 NOV.'97 MONITOR-OMEDATA DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1000 E3 9727 DD711504ABA 8 PIN PDIP OMEDATA PROCESS Single Poly, Single Metal 1.2 µ Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7 β: 1	Original	PDF	DS1000M-25 DS1000 DD711504ABA P20931 P20962 P21300 P21353 P21354 P21355 P21356 P21096 208-MIL P2075
h 9740 Abstract: dallas date code ds12887 P21256 9735 h P21490 P2070 P22149 B1 9742 dallas date code DS80320 Text: RELIABILITY MONITOR STRESS: TEMP CYCLE CONDITIONS: -40 TO 85°C MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE READ POINT QTY FAIL DS2250 na DEC 97 P21100 9743 DALLAS 096841 SIP STICK 100 11 DS2250 na DEC 97 P21100 9743 DALLAS	Original	PDF	DS2250 DS2290 P21100 P20430 DS80320 P20461 h 9740 dallas date code ds12887 P21256 9735 h P21490 P2070 P22149 B1 9742 dallas date code
DS80320 Abstract: P21091 Text: RELIABILITY MONITOR PROCESS: 0.8 µm Double Poly, Single Metal STRESS: INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS2153Q A7 DEC.'97 P21120 9730 ANAM-KOREA AICL DN718550AAE 44 PIN PLCC 48 233 DS2153Q A7 MAR '98 P22292	Original	PDF	DS2153Q P21120 P22292 DN718550AAE DN720030AAB P21171 DS80320 P21091