Untitled
Abstract: No abstract text available
Text: YAMAICHI Q.F.P. Production Sockets Body M aterial: Polyphenylene Sulfide PPS Contact M aterial: Beryllium Copper (BeCu) Contact Plating; Tin over Nickel Mating Package: JEDEC100 pin Bumpered QFP IC157-100-001-SS4 • CHARACTERISTICS Insulation Resistance
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OCR Scan
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JEDEC100
IC157-100-001-SS4
500MO
500VDC
10mA/20mV
IC157
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PDF
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Untitled
Abstract: No abstract text available
Text: YAMAICHI ELECTRONICS INC 0QG0S7Ö SSfl • bflE D YAMAICHI IC157-100-001-SS4 Q.F.P. Production Sockets RECOMMENDED PC BOARO LAYOUT 10* V « W M U M SOCKET 1 D0- *0. ss talsrttr jjf H; =1 “ Bodv Material : Polyphenylene Sulfide PPS Contact Material: Beryllium Copper (BeCu)
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OCR Scan
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IC157-100-001-SS4
JEDEC100
500MQ
500VDC
10mA/20mV
IC157-
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PDF
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Untitled
Abstract: No abstract text available
Text: YA HA IC HI E L E C T R O N I C S Q.F.P. SMT INC bflE D TTHSSati D O D G S ? 1! MTM YAMAICHI IC198 Series + 0.05 I SPE C IF IC A T IO N S • Low profile 4.0mm. Easy for ROM upgrade. • SMT terminals • C H A R A C T E R IS T IC S Insulation Resistance
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OCR Scan
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IC198
IC157-100-001-SS4
JEDEC100
500MQ
500VDC
10mA/20mV
IC157-
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PDF
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