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    CU1100

    Abstract: MBA35002
    Text: Model : MBA35002 Series For 35x35 Chip set BGA Heat Sink MBA35002 Series Specification: 1.Material: Heat Sink : CU1100 Clip : Plastic UL94-V0 2.Heat sink dimension : Foot print : 35x35mm Part no. Height Fin shape Base MBA35002MBA35002MBA35002MBA35002- 12


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    PDF MBA35002 35x35 CU1100 UL94-V0) 35x35mm MBA35002MBA35002MBA35002MBA35002- MBA35002-12PCU/2 MBA35002-15PCU/2 MBA35002-20PCU/2 CU1100