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    JESD22A111

    Abstract: JESD22-A111 JESD22A-111 J-STD-22A111 J-STD-020D
    Text: Application Report SCEA041 – September 2008 Wave Solder Exposure of SMT Packages James Huckabee, Steven Kummerl, Dominic Nguyen, Douglas W. Romm, and Larry Ting. ABSTRACT Attaching surface mount components to the bottomside of a printed circuit board PCB


    Original     		SCEA041 JESD22A111 JESD22-A111 JESD22A-111 J-STD-22A111 J-STD-020D PDF