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    Infineon Technologies AG SIDC06D60AC6X1SA1

    Diode Switching 20A DIE Wafer - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIDC06D60AC6X1SA1)
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    Avnet Americas SIDC06D60AC6X1SA1 Waffle Pack 778
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    SIDC06D60AC6 Datasheets (2)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SIDC06D60AC6 Infineon Technologies Used for IGBT3 Original PDF
    SIDC06D60AC6X1SA1 Infineon Technologies Discrete Semiconductor Products - Diodes - Rectifiers - Single - DIODE GEN PURP 600V 20A WAFER Original PDF

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    SIDC06D60AC6

    Abstract: No abstract text available
    Text: SIDC06D60AC6 Fast switching diode chip in EMCON 3 -Technology FEATURES: • 600V EMCON 3 technology 70 µm chip • soft, fast switching • low reverse recovery charge • small temperature coefficient Chip Type VR SIDC06D60AC6 600V IF 20A A This chip is used for:


    Original     		PDF SIDC06D60AC6 Q67050-A4357A101 L4981M, SIDC06D60AC6

    FS20R06VE3

    Abstract: SIDC06D60AC6 L4981M
    Text: SIDC06D60AC6 Fast switching diode chip in EMCON 3 -Technology FEATURES: • 600V EMCON 3 technology 70 µm chip • soft, fast switching • low reverse recovery charge • small temperature coefficient A This chip is used for: • power module • discrete components


    Original     		PDF SIDC06D60AC6 L4981M, FS20R06VE3 SIDC06D60AC6 L4981M

    Untitled

    Abstract: No abstract text available
    Text: SIDC06D60AC6 Fast switching diode chip in EMCON 3 -Technology FEATURES: • 600V EMCON 3 technology 70 µm chip • soft, fast switching • low reverse recovery charge • small temperature coefficient Chip Type VR SIDC06D60AC6 600V IF 20A A This chip is used for:


    Original     		PDF SIDC06D60AC6 Q67050-A4357A101 L4981M,