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    DP7310J

    Abstract: ASTM-B16-85
    Text: 3155-111-18N REPLACES NATIONAL SEMICONDUCTOR DP7310J .3 DIP WITH TI SN74ACT564DWJ LEAD PACKAGE FEATURES: • Allows placing an SOIC narrow body on a board laid out for an SOWIC (wide body). • Solder masked top side pads allow user to hand solder devices directly to top side of adapter with fewer problems of solder bridging.


    Original     		PDF 3155-111-18N DP7310J SN74ACT564DWJ C36000 ASTM-B16-85. MIL-P-81728 QQ-N-290. DP7310J ASTM-B16-85

    Untitled

    Abstract: No abstract text available
    Text: 20-301590-10 REPLACES NATIONAL SEMICONDUCTOR DP7310J .3 DIP WITH TI SN74ACT564DWJ LEAD PACKAGE FEATURES: • Allows placing an SOIC narrow body on a board laid out for an SOWIC (wide body). • Solder masked top side pads allow user to hand solder devices directly to top side of adapter with fewer problems of solder bridging.


    Original     		PDF DP7310J SN74ACT564DWJ C36000 ASTM-B16-85. MIL-T-10727 MIL-P-81728 QQ-N-290.

    DP7310J

    Abstract: No abstract text available
    Text: 20-301590-10 REPLACES NATIONAL SEMICONDUCTOR DP7310J .3 DIP WITH TI SN74ACT564DWJ LEAD PACKAGE FEATURES: • Allows placing an SOIC narrow body on a board laid out for an SOWIC (wide body). • Solder masked top side pads allow user to hand solder devices directly to top side of adapter with fewer problems of solder bridging.


    Original     		PDF DP7310J SN74ACT564DWJ C36000 ASTM-B16-85. MIL-T-10727 MIL-P-81728 QQ-N-290. DP7310J