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    Abstract: No abstract text available
    Text: X32V3 □PM Dense-Pac Microsystems. Inc. ^ CERAMIC 1M X 32 CMOS SRAM VERSA-STACK PRELIMINARY DESCRIPTION: The DPS1M X32V3 "VERSA -STA CK" module ¡s a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers 32 Megabits of


    OCR Scan     		PDF DPS1MX32V3 X32V3 X32V3 30A044-40