ABLEBOND 8355 Search Results

ABLEBOND 8355 Result Highlights (5)

Part	ECAD Model	Manufacturer	Description	Download	Buy
58355-201LF		Amphenol Communications Solutions	4 Row Signal Header, Straight, Press-Fit, without Keywell
58355-143LF		Amphenol Communications Solutions	Metral® Board Connectors, Backplane Connectors, Signal Header, Vertical, Press Fit, 4 Row, 96 Positions.
58355-227LF		Amphenol Communications Solutions	4 Row, 48 Posn Signal Header, Straight, Press-Fit, without Keywell
5640383553		Amphenol Communications Solutions	VHDM®, Backplane connectors, Grounding Guide Pin
58355-151LF		Amphenol Communications Solutions	4 Row, 96 Posn Signal Header, Straight, Press-Fit, without Keywell

ABLEBOND 8355 Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
Tsi148-133IL Abstract: G770* sumitomo ablebond 2100A TSI148-133CL 2100a epoxy G770J A1001-01 8355F A1001 seal sumitomo Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1001-01 Product Affected: Date Effective: Contact: Title: Phone #: Fax #: E-mail: DATE: Apr 2, 2010 TSI148-133CL TSI148-133IL	Original	PDF	A1001-01 TSI148-133CL TSI148-133IL Tsi148-133IL G770* sumitomo ablebond 2100A TSI148-133CL 2100a epoxy G770J A1001-01 8355F A1001 seal sumitomo
AUS308 Abstract: PSR4000 AUS308 HL832NX TAIYO PSR 4000 AUS308 dielectric TAIYO PSR 4000 AUS308 Thermal Conductivity PSR-4000 AUS-308 PSR4000 AUS308 thermal Text: March 21, 2007 CN 032107 Customer Notification CX2751x-12 Material Set Change Dear Valued Customer: This notification is for the CX27511-11, CX27512-12, CX27513-12, CX27514-12, CX27512G-14. Mindspeed’s turnkey supplier has sent notification that all their BGA products will be manufactured using	Original	PDF	CX2751x-12 CX27511-11, CX27512-12, CX27513-12, CX27514-12, CX27512G-14. CX2751x-12, CX2751xG-12, 2751x-PCN-001-A AUS308 PSR4000 AUS308 HL832NX TAIYO PSR 4000 AUS308 dielectric TAIYO PSR 4000 AUS308 Thermal Conductivity PSR-4000 AUS-308 PSR4000 AUS308 thermal
130C Abstract: JESD22 Ablebond 8355 Text: Cypress Semiconductor Qualification Report QTP# 98193 VERSION 1.0 December, 1998 292-Pin BGA Package ASE, Taiwan Assembly CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Cypress Semiconductor Quality and Reliability Department Cypress Semiconductor Assembly: ASE, Taiwan	Original	PDF	292-Pin 30C/60 CY37256P256-BGC 7C37652AF-GBGC 130C JESD22 Ablebond 8355
Ablebond 84-1*SR4 Abstract: z9925 EIAJ ED-4701 MARK A48 857L TSMC 0.35um Volt, SPDM, CMOS 98068A 0.6 um cmos process ablebond 84-1lmisr4 Text: Reliability Summary Report PI6CV857A August 28, 2002 Reliability by Design Page 1 of 20 INDEX: Commitment to Quality: Page 3 Product Family and Wafer Fab Process: Page 4 Wafer Fab Subcontractors and Codes: Page 4 Standard Package Type Code and Dimensions:	Original	PDF	PI6CV857A Ablebond 84-1*SR4 z9925 EIAJ ED-4701 MARK A48 857L TSMC 0.35um Volt, SPDM, CMOS 98068A 0.6 um cmos process ablebond 84-1lmisr4
TSMC 0.35um Abstract: ED-4701-3-B122A tsmc 0.35 um CMOS gate area PBGA 256 reflow profile Volt, SPDM, CMOS ED-4701-1-C111A ISO-9000 PI7C7300 PI7C8150-33 PI7C8152 Text: Reliability Summary Report PCI Bridge Products March 20, 2003 Updated Total Life Test Hours Reliability by Design Page 1 of 16 INDEX: Commitment to Quality: Page 3 Product Family and Wafer Fab Process: Page 4 Wafer Fab Subcontractors and Codes: Page 4 Standard Package Type Code and Dimensions:	Original	PDF