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    AMKOR ELECTRONICS Search Results

    AMKOR ELECTRONICS Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    74HC4053FT Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, SPDT(1:2)/Analog Multiplexer, TSSOP16B, -40 to 125 degC Visit Toshiba Electronic Devices & Storage Corporation
    XPQR8308QB Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 80 V, 350 A, 0.00083 Ω@10V, L-TOGL Visit Toshiba Electronic Devices & Storage Corporation
    TRS8E65H Toshiba Electronic Devices & Storage Corporation SiC Schottky Barrier Diode (SBD), 650 V, 8 A, TO-220-2L Visit Toshiba Electronic Devices & Storage Corporation
    TCKE800NA Toshiba Electronic Devices & Storage Corporation eFuse IC (electronic Fuse), 4.4 to 18 V, 5.0 A, Auto-retry, WSON10B Visit Toshiba Electronic Devices & Storage Corporation
    7UL2T125FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation

    AMKOR ELECTRONICS Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    laptop ic list

    Abstract: NS6040 contactor Amkor Technology handler
    Text: data sheet TEST CONTACTOR FusionQuad Test Contactor Test Hardware List: Amkor FusionQuad® Test Contactor: Amkor Technology is now offering the FusionQuad® Test Contactor Amkor’s FusionQuad® represents a breakthrough in leadframe-based plastic packaging through the effective


    Original     		NS6040 DS815B laptop ic list contactor Amkor Technology handler PDF

    CDIP

    Abstract: glass frit electronics
    Text: data sheet CERAMIC / HERMETIC CDIP / CerDIP Ceramic Dual-Inline Package CDIP / CerDIP Amkor Technology is committed to continuing to service this long established standard industry package. The Amkor Technology CDIP capability provides a wide range of lead counts and body


    Original     		DS801 CDIP glass frit electronics PDF

    CERPAK

    Abstract: glass frit electronics DS802
    Text: data sheet CERAMIC / HERMETIC CerPak Ceramic Pack CerPak Amkor Technology continues to service this established industry package. The Amkor Technology CerPak capability provides you, the customer, with a wide range of lead counts and body sizes available from various suppliers. The


    Original     		DS802 CERPAK glass frit electronics DS802 PDF

    MS-001

    Abstract: MO-010 MS-011
    Text: LEADFRAME data sheet PDIP Features: Plastic Dual In-Line PDIP Packages: Amkor is committed to continuing to service this long established standard industry package. The Amkor PDIP comes in a wide range of lead counts: from 8 - 48 leads with a lead pitch of


    Original     		MS-011 MS-001 MO-010 MS-011 PDF

    Untitled

    Abstract: No abstract text available
    Text: data sheet CERAMIC / HERMETIC CQFP Ceramic Quad Flat Pack Package CQFP Amkor Technology is continuing to service this established industry package. The Amkor Technology CQFP capability provides you, the customer, with a wide range of lead counts and body sizes available from various suppliers. The


    Original     		DS806 PDF

    MO-010

    Abstract: MS-011 MS-001 MO-026
    Text: LEADFRAME data sheet PDIP/SPDIP Features: Plastic Dual In-Line PDIP Packages: Amkor is committed to continuing to service this long established standard industry package. The Amkor PDIP comes in a wide range of lead counts: from 8 - 48 leads with a lead pitch of


    Original     		MS-011 MO-010 MS-011 MS-001 MO-026 PDF

    MO-153

    Abstract: MO-187 MO-194 PPF leadframe MO153 MO-153 Packages JEDEC MO-187 JEDEC MO-153 38 Amkor mold compound tssop
    Text: LEADFRAME data sheet TSSOP Features: Thin Shrink Small Outline Package TSSOP : With the evolution of smaller, denser, faster and lighter end products, Amkor not only shrunk the SOP by decreasing the lead pitch, but also made it thin - 0.9 mm thin! Amkor invested time and research


    Original     		PDF

    SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY

    Abstract: amkor
    Text: service green packaging Green / Pb Free Technology Solution A combination of governmental legislation and consumer sentiment has driven the Electronics Industry in general and Semiconductor Packaging specifically to adopt more environmentally friendly materials and processes. Amkor is a leader in the


    Original     		SS18C SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY amkor PDF

    DS811

    Abstract: No abstract text available
    Text: data sheet CERAMIC / HERMETIC PPGA Plastic Pin Grid Array Package PPGA Amkor Technology incorporates the most advanced assembly processes for today and tomorrow's cost/performance applications. This IC package technology allows application and design engineers to optimize innovations while


    Original     		DS811 DS811 PDF

    HL832N

    Abstract: FCCSP HL832 Amkor CSP mold compound cu pillar amkor cabga thermal resistance CABGA 6x6 flip chip bga 0,8 mm BGA 64 PACKAGE thermal resistance amkor Cu pillar
    Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or


    Original     		PDF

    nitto GE

    Abstract: GE-100L nitto GE-100L Nitto GE 100 313 pin PBGA te2 219 Ablestik 2300 NITTO GE- 100L CO-029
    Text: LAMINATE data sheet PBGA Features: Plastic Ball Grid Array PBGA : Amkor’s PBGAs incorporate the most advanced assembly processes and designs for today’s and tomorrow’s cost/performance applications. This advanced IC package technology allows application


    Original     		PDF

    JEDEC MS-026

    Abstract: MS-026 Amkor mold compound lqfp 7x7 tray jedec MS-026-A
    Text: LEADFRAME data sheet LQFP Features: Low Profile Quad Flat Pack LQFP Packages: Amkor offers a broad line of LQFP IC packages designed to provide the same great benefits as MQFP packaging with a 1.4 mm body thickness. This allows IC packaging engineers, component specifiers and systems designers


    Original     		MS-026 JEDEC MS-026 MS-026 Amkor mold compound lqfp 7x7 tray jedec MS-026-A PDF

    BGA 64 PACKAGE thermal resistance

    Abstract: FCCSP CABGA 6x6 amkor flip fcBGA PACKAGE thermal resistance bga 9x9 Shipping Trays CABGA 8X8 BGA 256 PACKAGE power dissipation BGA 256 PACKAGE thermal resistance BGA45
    Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package — a flip chip solution in a CSP package format. This package construction utilizes eutectic tin/lead (63Sn/37Pb) flip chip interconnect


    Original     		63Sn/37Pb) BGA 64 PACKAGE thermal resistance FCCSP CABGA 6x6 amkor flip fcBGA PACKAGE thermal resistance bga 9x9 Shipping Trays CABGA 8X8 BGA 256 PACKAGE power dissipation BGA 256 PACKAGE thermal resistance BGA45 PDF

    E700G

    Abstract: No abstract text available
    Text: Data Sheet LAMINATE fcCSP fcCSP Packages Amkor Technology offers the Flip Chip CSP fcCSP package – a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or


    Original     		DS577G E700G PDF

    CPGA

    Abstract: amkor "ceramic frit" CPGA Package design
    Text: data sheet CERAMIC / HERMETIC CPGA Ceramic Pin Grid Array Package CPGA Amkor Technology is committed to continuing to service this long established standard industry package. This thru-hole package consists of a co-fired ceramic base that has a matrix of pins


    Original     		DS805 CPGA amkor "ceramic frit" CPGA Package design PDF

    cu pillar

    Abstract: Flip Chip Substrate HL832 ds7409 FCCSP amkor flip chiparray amkor HL832N CABGA 48 7x7 amkor cabga thermal resistance
    Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or


    Original     		PDF

    amkor

    Abstract: amkor exposed pad
    Text: LEADFRAME data sheet FusionQuad Features FusionQuad®: Amkor’s FusionQuad® technology represents a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad TQFP and MLF® technologies. The novel integration of bottom lands in a QFP provides a


    Original     		PDF

    lqfp 7x7 tray

    Abstract: MS-026 7X748LD amkor
    Text: LEADFRAME data sheet LQFP Features: Low Profile Quad Flat Pack LQFP Packages: Amkor offers a broad line of LQFP IC packages designed to provide the same great benefits as MQFP packaging with a 1.4 mm body thickness. This allows IC packaging engineers, component specifiers and systems designers


    Original     		MS-026 lqfp 7x7 tray MS-026 7X748LD amkor PDF

    DS812

    Abstract: Side Brazed Ceramic Dual-In-Line Packages lead side brazed hermetic
    Text: data sheet CERAMIC / HERMETIC Side Braze Side Braze SB Amkor Technology is committed to continuing to service this long established standard industry package. The SB package comes in a wide range of lead counts: from 8-48 leads with a lead pitch of 100 mil inches. This thru-hole package consists


    Original     		DS812 DS812 Side Brazed Ceramic Dual-In-Line Packages lead side brazed hermetic PDF

    amkor exposed pad

    Abstract: exposed QFP 128 amkor exposed QFP 144
    Text: LEADFRAME data sheet FusionQuad Features: FusionQuad®: Amkor’s FusionQuad® technology represents a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad TQFP and MLF® technologies. The novel integration of bottom lands in a QFP provides a cost-effective platform for increased lead count in a small


    Original     		PDF

    lqfp 64 Shipping Trays

    Abstract: DS310H
    Text: LEADFRAME data sheet Multi-Chip & Stacked-Die Leadframe Packages Features: Multi-Chip Package MCP & Stacked-Die Leadframe Package Amkor's multi-chip package and stacked-die leadframe designs enable package level integration in a low cost, leadframe-based form factor. Leveraging


    Original     		PDF

    CCL-HL832NX-A

    Abstract: Nitto GE100LFCS Sumitomo G750 GE100LFCS GE-100-LFC CCL-HL832NX GE100LFCS nitto GE-100LFCS CCL-HL-832 CCL-HL832
    Text: LAMINATE data sheet TEPBGA Features: Thermally Enhanced Plastic Ball Grid Array TEPBGA : Amkor's TEPBGA's feature a drop-in heat spreader (TEPBGA-2) and are designed for low inductance. This advanced IC package technology allows application and design engineers to optimize


    Original     		CO-029) CCL-HL832NX-A Nitto GE100LFCS Sumitomo G750 GE100LFCS GE-100-LFC CCL-HL832NX GE100LFCS nitto GE-100LFCS CCL-HL-832 CCL-HL832 PDF

    Amkor Wafer level mold compound

    Abstract: l2aa CCL-HL-832 JEDEC tray standard 13 SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY Ablestik 2300 4-Layer tepbga-2 CO-029
    Text: LAMINATE data sheet PBGA Innovative designs and expanding package offerings provide a platform from prototype-to-production. Features • Custom ball counts up to 1521 • 1.00, 1.27 & 1.50 mm standard ball pitch available other ball pitches available upon request, (e.g. 0.8mm


    Original     		PDF

    l2aa

    Abstract: tepbga-2 CO-029 Amkor mold compound Amkor Wafer level mold compound GE-100L Amkor Technology pbga moisture GE-100-L UM2219 mold compound
    Text: LAMINATE data sheet PBGA Features: • Custom ball counts up to 1521 • 1.00, 1.27 & 1.50 mm ball pitch available other ball pitches available upon request • 13 mm to 40 mm body sizes • Thin Au wire (0.5mil or Cu wire compatible • Large mold cap for quality enhancement


    Original     		CO-029) l2aa tepbga-2 CO-029 Amkor mold compound Amkor Wafer level mold compound GE-100L Amkor Technology pbga moisture GE-100-L UM2219 mold compound PDF