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Catalog Datasheet	MFG & Type	Document Tags	PDF
0.3mm pitch csp package Abstract: 0.3mm pitch package bga 0.3mm pitch BGA jp smd code AN100926-26-JP AN-1112 micro pitch BGA ALIVH ic micro AN1112 Text: ご注意：日本語のアプリケーション・ノートは参考資料として提供しており内容が最新でない場合があります。製品のご使用に際しては、必ず最新の英文アプリケーション・ノートをご確認ください。	Original	AN-1112 0.3mm pitch csp package 0.3mm pitch package bga 0.3mm pitch BGA jp smd code AN100926-26-JP AN-1112 micro pitch BGA ALIVH ic micro AN1112	PDF
lm78l05 Abstract: zener SMD MARK A9 smd transistor marking A10 marking code hr 31 SMD zener diode 1.6v sot-23 Marking 40g BGA-3000 lm78l05 smd MARKING SMD IC CODE 611 Text: LM78L05IBP MICRO SMD QUALIFICATION PACKAGE Winter 1999 Table of Contents 1.0 Introduction 1.1 General Product Description. . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.2 Technical Product Description . . . . . . . . . . . . . . . . . . . . . . . . . 1-1	Original	LM78L05IBP AN-1112 LM78L05 zener SMD MARK A9 smd transistor marking A10 marking code hr 31 SMD zener diode 1.6v sot-23 Marking 40g BGA-3000 lm78l05 smd MARKING SMD IC CODE 611	PDF
ic 555 timer 10 minute Abstract: proportional control ELECTRIC CONVECTION WALL OVEN pulse position modulator Text: LMC555 MICRO SMD QUALIFICATION PACKAGE Summer 1999 Table of Contents 1.0 Introduction 1.1 General Product Description. . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.2 Technical Product Description . . . . . . . . . . . . . . . . . . . . . . . . . 1-1	Original	LMC555 AN-1112 ic 555 timer 10 minute proportional control ELECTRIC CONVECTION WALL OVEN pulse position modulator	PDF
AN-1112 Abstract: 0.3mm pitch BGA ALIVH 0.3mm pitch csp package SMD CODE AN-1112 national Text: ご注意：日本語のアプリケーション・ノートは参考資料として提供しており内容が最新でない場合があります。製品のご使用に際しては、必ず最新の英文アプリケーション・ノートをご確認ください。	Original	AN-1112 AN-1112 0.3mm pitch BGA ALIVH 0.3mm pitch csp package SMD CODE AN-1112 national	PDF
BGA-3000 Abstract: smd ic marking A9 smd a10 shaker smd diode A4 smd marking a7 smd transistor A6 transistor SMD a4 top mark smd A9 250 micro solder ball Text: National Semiconductor Application Note 1112 August 2000 CONTENTS Package Construction Key attributes for micro SMD 4, 5, and 8 bump Smallest Footprint Micro SMD Handling Surface Mount Technology SMT Assembly Considerations Printed Circuit Board Layout Stencil Printing Solder Paste	Original		PDF
AN-1112 Abstract: AN1112 Text: ெࡔࡔॆӷ‫ິࠅ༹ڞ‬ ᆌᆩጀ๥!2223 3116!౎!:!ሆ ణ୤ ᆅჾ! ////////////////////////////////////////////////////////////////////////////////// !3 ‫ހ‬ጎࠓሰ! ////////////////////////////////////////////////////////////////////////////// !3	Original	AN-1112 AN100926 AN-1112 AN1112	PDF
DIODE smd marking 22-16 Abstract: vco lm358n LM358 laser driver lm358 current limiter Zener diode smd marking code 621 adjustable zero span circuit with lm358 TRANSISTOR SMD MARKING CODE a7 j zener SMD MARK A9 TRANSISTOR SMD MARKING CODE SAW smd transistor code 621 Text: Micro SMD Qualification Package LM358, LMC6035, LM431, LM78L05, and LMC555 National’s Micro SMD – The Obvious Answer For Portable Applications Standard Surface Mount Packages vs. Micro SMD Micro SMD Package • 0.5mm Bump Pitch • 0.9mm Max Package Height	Original	LM358, LMC6035, LM431, LM78L05, LMC555 OT23-5 DIODE smd marking 22-16 vco lm358n LM358 laser driver lm358 current limiter Zener diode smd marking code 621 adjustable zero span circuit with lm358 TRANSISTOR SMD MARKING CODE a7 j zener SMD MARK A9 TRANSISTOR SMD MARKING CODE SAW smd transistor code 621	PDF
ALIVH Abstract: 0.3mm pitch csp package ALIVH PCB AN-1112 IPC-SM-785 0.3mm pitch BGA SMD Devices SMD CODE 185M wlcsp SMT Text: ご注意：日本語のアプリケーション・ノートは参考資料として提供しており内容が最新でない場合があります。製品のご使用に際しては、必ず最新の英文アプリケーション・ノートをご確認ください。	Original	AN-1112 ALIVH 0.3mm pitch csp package ALIVH PCB AN-1112 IPC-SM-785 0.3mm pitch BGA SMD Devices SMD CODE 185M wlcsp SMT	PDF
smd transistor marking A6 Abstract: ir sensing circuit using LM358 TRANSISTOR SMD MARKING CODE a6 water level control using lm358 TRANSISTOR SMD MARKING CODE LF temperature control using lm358 LM358I lm358 water level lm358 laser current driver smd transistor marking a7 Text: LM358BP MICRO SMD QUALIFICATION PACKAGE Winter 1999 Table of Contents 1.0 Introduction 1.1 General Product Description. . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.2 Technical Product Description . . . . . . . . . . . . . . . . . . . . . . . . . 1-1	Original	LM358BP AN-1112 LM358 smd transistor marking A6 ir sensing circuit using LM358 TRANSISTOR SMD MARKING CODE a6 water level control using lm358 TRANSISTOR SMD MARKING CODE LF temperature control using lm358 LM358I lm358 water level lm358 laser current driver smd transistor marking a7	PDF
TRANSISTOR SMD MARKING CODE LF Abstract: SMD SOT23 transistor MARK ck TRANSISTOR SMD MARKING CODE loc TRANSISTOR SMD MARKING CODE SAW BGA-3000 transistor smd marking KA Zener diode smd marking ck diode SMD MARKING CODE SAW smd transistor marking HR MARKING BA SMD IC CODE 8-pin Text: LM431 MICRO SMD QUALIFICATION PACKAGE Summer 1999 Table of Contents 1.0 Introduction 1.1 General Product Description. . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.2 Technical Product Description . . . . . . . . . . . . . . . . . . . . . . . . . 1-1	Original	LM431 AN-1112 TRANSISTOR SMD MARKING CODE LF SMD SOT23 transistor MARK ck TRANSISTOR SMD MARKING CODE loc TRANSISTOR SMD MARKING CODE SAW BGA-3000 transistor smd marking KA Zener diode smd marking ck diode SMD MARKING CODE SAW smd transistor marking HR MARKING BA SMD IC CODE 8-pin	PDF
BGA-3000 Abstract: BGA reflow guide AN-1112 DEK268 AN100926-6 Amistar Text: National Semiconductor Application Note 1112 May 1999 CONTENTS Package Construction lation and shipping in tape and reel. The package is assembled on PCB using standard surface mount assembly techniques SMT . Key Attributes for micro-SMD 8 I/O Smallest Footprint	Original	AN-1112 BGA-3000 BGA reflow guide AN-1112 DEK268 AN100926-6 Amistar	PDF
military relay Abstract: BGA-3000 AN-1112 LMC6035 LMC6035IBP LMC6035IBPX Lay out of 10 Bump Micro smd package CD laser pickup assembly Text: , yyyyyyyyyyyy zzzzzzzzzzzzz \| , yyyyyyyyyyyy zzzzzzzzzzzzz \| , yyyyyyyyyyyy	Original		PDF
IPC-SM-785 Abstract: stencil tension AN-1112 Text: National Semiconductor Application Note 1112 April 2003 Table of Contents Introduction . Package Construction .	Original		PDF
AN-1112 Abstract: solder joint reliability IPC-SM-785 Solder paste stencil life thick bga die size Semiconductor smd marking BY SMD 420 Text: National Semiconductor Application Note 1112 March 2002 Table of Contents Introduction to MICRO SMD . Package Construction .	Original		PDF

ALIVH Abstract: HASL 250 B 340 smd Transistor WLCSP stencil design AN-1112 MARKING CODE SMD IC Text: National Semiconductor Application Note 1112 September 2005 Table of Contents Introduction . 2 Package Construction . 2	Original	CSP-9-111S2) CSP-9-111S2. AN-1112 ALIVH HASL 250 B 340 smd Transistor WLCSP stencil design AN-1112 MARKING CODE SMD IC	PDF
8 PIN SMD IC 211 Abstract: BGA-3000 top mark smd A9 SMD MARK A9 shaker Text: National Semiconductor Application Note 1112 September 1999 CONTENTS Package Construction ing, singulation and shipping in tape and reel. The package is assembled on PCB using standard surface mount assembly techniques SMT . Key Attributes for Micro SMD 4 and 8 I/O Packages	Original	AN-1112 8 PIN SMD IC 211 BGA-3000 top mark smd A9 SMD MARK A9 shaker	PDF
stencil tension Abstract: IPC-SM-785 PT100 bridge AN-1112 GENERAL SEMICONDUCTOR MARKING UM Solder paste stencil life WLCSP stencil design Text: National Semiconductor Application Note 1112 June 2001 CONTENTS Introduction to Micro SMD Package Construction Micro SMD Package Data Surface Mount Assembly Considerations PCB Layout Stencil Printing Process Component Placement Solder Paste Reflow and Cleaning	Original	AN-1112 stencil tension IPC-SM-785 PT100 bridge AN-1112 GENERAL SEMICONDUCTOR MARKING UM Solder paste stencil life WLCSP stencil design	PDF