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UPD60510F1-HN4-M1-A
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Renesas Electronics Corporation
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R-IN32M3 ASSP for Multi-Protocol Support |
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UPD60510BF1-HN4-M1-A
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Renesas Electronics Corporation
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R-IN32M3 ASSP for Multi-Protocol Support |
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59112-F36-05-106LF
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Amphenol Communications Solutions
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Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 10 Positions. |
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10084605-101LF
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Amphenol Communications Solutions
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AirMax VS®, Backplane Connectors, 4-Pair, 96 -position, 2mm pitch, 8 column, Vertical Receptacle. |
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54121-406051050LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 5 Positions, 2.54mm (0.100in) Pitch. |
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