AUSTIN SQUARE CHIP CARRIER Search Results

AUSTIN SQUARE CHIP CARRIER Result Highlights (5)

Part	Manufacturer	Description
TB67B001BFTG	Toshiba Electronic Devices & Storage Corporation	Brushless Motor Driver/3 Phases Driver/Vout(V)=25/Iout(A)=3/Square Wave
TC78B011FTG	Toshiba Electronic Devices & Storage Corporation	Brushless Motor Driver/3 Phases Driver/Vout(V)=30/Square, Sine Wave
TB67B001AFTG	Toshiba Electronic Devices & Storage Corporation	Brushless Motor Driver/3 Phases Driver/Vout(V)=25/Iout(A)=3/Square Wave
GCM188D70E226ME36D	Murata Manufacturing Co Ltd	Chip Multilayer Ceramic Capacitors for Automotive
GRM022C71A472KE19L	Murata Manufacturing Co Ltd	Chip Multilayer Ceramic Capacitors for General Purpose

AUSTIN SQUARE CHIP CARRIER Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
MO-047 Abstract: MO-052 8444-11B1-RK-TP 8420-11B1-RK-TP 8452 Text: 3M Chip Carrier Sockets Low Profile, 4-Row, Thru-hole 8400 Series • Accepts chip carriers conforming to JEDEC outline MO-047 for square and MO-052 for rectangular • High temperature insulator compatible with IR reflow and wave soldering • Compatible with automated loading equipment	Original	MO-047 MO-052 TS-2148-02 8444-11B1-RK-TP 8420-11B1-RK-TP 8452	PDF
Untitled Abstract: No abstract text available Text: 3M Chip Carrier Sockets Low Profile, 4-Row, Thru-hole 8400 Series • Accepts chip carriers conforming to JEDEC outline MO-047 for square and MO-052 for rectangular • High temperature insulator compatible with IR reflow and wave soldering • Compatible with automated loading equipment	Original	MO-047 MO-052 TS-2148-01	PDF
mo-047 texas Abstract: 84XX MO-047 MO-052 Text: 3M Chip Carrier Sockets Surfacemount 8400 Series • Accepts chip carriers conforming to JEDEC outline MO-047 for square and MO-052 for rectangular • High temperature insulator compatible with IR reflow and wave soldering • Compatible with automated loading equipment	Original	MO-047 MO-052 TS-2147-04 mo-047 texas 84XX	PDF
84XX Abstract: MO-047 MO-052 TS-2147-02 Text: 3M Chip Carrier Sockets Surface Mount 8400 Series • Accepts chip carriers conforming to JEDEC outline MO-047 for square and MO-052 for rectangular • High temperature insulator compatible with IR reflow and wave soldering • Compatible with automated loading equipment	Original	MO-047 MO-052 TS-2147-02 84XX TS-2147-02	PDF
TS-2147-B Abstract: No abstract text available Text: 3M Chip Carrier Sockets Surfacemount 8400 Series • Accepts chip carriers conforming to JEDEC outline MO-047 for square and MO-052 for rectangular • High temperature insulator compatible with IR reflow and wave soldering • Compatible with automated loading equipment	Original	MO-047 MO-052 TS-2147-B RIA-2217B-E	PDF
84XX Abstract: MO-047 MO-052 TS-2147-03 Text: 3M Chip Carrier Sockets Surface Mount 8400 Series • Accepts chip carriers conforming to JEDEC outline MO-047 for square and MO-052 for rectangular • High temperature insulator compatible with IR reflow and wave soldering • Compatible with automated loading equipment	Original	MO-047 MO-052 TS-2147-03 84XX TS-2147-03	PDF
MO-047 Abstract: MO-052 8444-11B1-RK-TP Text: 3M Chip Carrier Sockets Low Profile, Four-Row, Through-Hole 8400 Series • Accepts chip carriers conforming to JEDEC outline MO-047 for square and MO-052 for rectangular • Compatible with automated loading equipment • Open top design allows unrestricted air flow	Original	MO-047 MO-052 TS-2148-03 8444-11B1-RK-TP	PDF
TS-2148-B Abstract: plcc socket 84 PLCC 3m PLCC SOCKET 3M Text: 3M Chip Carrier Sockets Low Profile, Four-Row, Through Hole 8400 Series • Accepts chip carriers conforming to JEDEC outline MO-047 for square and MO-052 for rectangular • Compatible with automated loading equipment • Open top design allows unrestricted air flow	Original	MO-047 MO-052 TS-2148-B RIA-2217B-E plcc socket 84 PLCC 3m PLCC SOCKET 3M	PDF
AS5181 Abstract: AS5181F-MIL Text: DA C AS5181 Austin Semiconductor, Inc. PIN ASSIGNMENT Top View 10 Bit, 40MHz Current -Output DACs 24-Pin Flat Pack (F) FEATURES • +2.7V to +3.3V Single-Supply Operation • Wide Spurious-Free Dynamic Range: 70dB at fOUT = 2.2MHz • Fully Differential Output	Original	AS5181 40MHz 24-Pin -55oC 125oC) AS5181 AS5181F-MIL	PDF
AS5181 Abstract: AS5181F-MIL AUSTIN SQUARE CHIP CARRIER Text: DA C AS5181 Austin Semiconductor, Inc. PIN ASSIGNMENT Top View 10 Bit, 40MHz Current/Voltage-Output DACs 24-Pin Flat Pack (F) FEATURES • +2.7V to +3.3V Single-Supply Operation • Wide Spurious-Free Dynamic Range: 70dB at fOUT = 2.2MHz • Fully Differential Output	Original	AS5181 40MHz 24-Pin -55oC 125oC) AS5181 AS5181F-MIL AUSTIN SQUARE CHIP CARRIER	PDF
wireless energy meter circuit diagram Abstract: AMI encoding ask fsk psk circuit diagram for wireless video transmitter and receiver in transceiver psk wireless video transmitter circuit diagram motorola Base Station amplitude modulation transmitter circuit diagram HC05 MC13145 Text: WIRELESS SYMPOSIUM/PORTABLE BY DESIGN CONFERENCE SPRING 1999 Back Home Print Views Search Results Exit A 900 MHz Low Cost Wireless Connection to the Universal Serial Bus Maureen Magner Motorola Semiconductor Products Sector 1155 Business Center Drive Horsham, PA 19044	Original	HC708KL8GRS/D AN1240- MC68HC705J1A" wireless energy meter circuit diagram AMI encoding ask fsk psk circuit diagram for wireless video transmitter and receiver in transceiver psk wireless video transmitter circuit diagram motorola Base Station amplitude modulation transmitter circuit diagram HC05 MC13145	PDF
3 phase current monitor and controller using mc Abstract: 072c 47CRF 32QAM ISL83740 ISL87060 ISL87060DIK ISL87060MIK demodulator fpga 32QAM circuit Text: Intersil's Broadband Wireless Modem Solutions include the ISL87060MIK Modulator and ISL87060DIK Demodulator chips; ISL837030/ISL83740 Modem Reference Designs; and ISL83700EVAL/ISL83740EVAL Evaluation Kits. The chip set offers fiberlike performance and reliability to equipment manufacturers serving fixed wireless infrastructure and access markets.	Original	ISL87060MIK ISL87060DIK ISL837030/ISL83740 ISL83700EVAL/ISL83740EVAL ISL87060 AN9969 16QAM, 32QAM ISL83740 64QAM, 3 phase current monitor and controller using mc 072c 47CRF 32QAM demodulator fpga 32QAM circuit	PDF
TC1036CECT Abstract: marking BP 5-PIN TC1036 LMC7211 TC1034 TC1037 TC1039 Text: TC1036 Linear Building Block – Single Comparator in SOT Package FEATURES GENERAL DESCRIPTION • ■ ■ ■ ■ ■ ■ The TC1036 is a single low-power comparator designed for low-power applications. This comparator is specifically designed for operation	Original	TC1036 TC1036 TC1036. OT-23A, TC1036-2 DS21494A TC1036CECT marking BP 5-PIN LMC7211 TC1034 TC1037 TC1039	PDF
74189 Abstract: ALCATEL remq REMQ MTC-30521 Alcatel "System 12" REMQ PSA relay 4098 10E4 10E6 CECC00802 Text: MTC-30521 VAN Interface Data Sheet Application Specific Standard Products Features Product Description • Line Interface Circuit for Automotive Multiplex Systems • Fully Integrated Support for the VAN Protocol layer 1 of the OSI model • Integrates:	Original	MTC-30521 160kbits/second 12/97-DS0258 74189 ALCATEL remq REMQ MTC-30521 Alcatel "System 12" REMQ PSA relay 4098 10E4 10E6 CECC00802	PDF

orcad schematic symbol for rj45 Abstract: mini project using ARM processor lcd 94V0 94v0 decoder multi card reader circuit diagram with picture schematic diagram lcd monitor advance 17 micrel ethernet LED Activity flashing "DC Power Jack" lcd display 94V0 MEDC Text: CDB89712 User’s Manual CDB89712 HARDWARE AND SOFTWARE USER’S MANUAL Copyright 1999, 2000, 2001 – Cirrus Logic Inc. All Rights Reserved. This document describes the CS89712 Development Board provided by Cirrus Logic Inc. No warranty is given for the	Original	CDB89712 CDB89712 CS89712 CS89712. DS502UM2 orcad schematic symbol for rj45 mini project using ARM processor lcd 94V0 94v0 decoder multi card reader circuit diagram with picture schematic diagram lcd monitor advance 17 micrel ethernet LED Activity flashing "DC Power Jack" lcd display 94V0 MEDC	PDF
mdr 68 pin configuration Abstract: 94v0 c29 MDR 14 pin C0805C104K5RACTR MDR 26 pin plug MDR 68 pinout 50wv 33 EZ8B 94v0 circuit board r29 MDR connector Text: DS90CR485/486 Evaluation Kit User Manual Rev. 1.0 DS90CR485/486 48-bit, 66 – 133 MHz Channel Link SerDes Chipset Evaluation Kit User Manual Part Number: CLINK3V48BT-133 August 2003 PC and Networking Group National Semiconductor Corporation Document Revision 1.0	Original	DS90CR485/486 DS90CR485/486 48-bit, CLINK3V48BT-133 TS-0755-05 mdr 68 pin configuration 94v0 c29 MDR 14 pin C0805C104K5RACTR MDR 26 pin plug MDR 68 pinout 50wv 33 EZ8B 94v0 circuit board r29 MDR connector	PDF
AN1028 Abstract: fluke 52 k/j thermometer tesec DV240 fluke 52 k/j Thermocouple AN-1028 AN-569 DV240 an-569 national Text: National Semiconductor Application Note 1028 June 2001 PDMAX t = [TJMAX − TA] / RθJA(t) Introduction As packages become smaller, achieving efficient thermal performance for power applications requires that the designers employ new methods of meliorating the heat flow out of	Original	OT-223 AN-1028 AN1028 fluke 52 k/j thermometer tesec DV240 fluke 52 k/j Thermocouple AN-1028 AN-569 DV240 an-569 national	PDF
AN1028 Abstract: AN-1028 DV240 fluke 52 Text: National Semiconductor Application Note 1028 June 2001 INTRODUCTION As packages become smaller, achieving efficient thermal performance for power applications requires that the designers employ new methods of meliorating the heat flow out of devices. Thus the purpose of this paper is to aid the user in	Original	OT-223 AN-1028 AN1028 AN-1028 DV240 fluke 52	PDF
R-T curves RJC Abstract: MOSFET 12W tesec DV240 motorola application note AN-569 AN1029 AN-569 DV240 NDS9956 Text: N AN1029 April, 1996 Maximum Power Enhancement Techniques for SO-8 Power MOSFETs Discrete POWER & Signal Technologies 2. Theory Alan Li, Brij Mohan, Steve Sapp, Izak Bencuya, Linh Hong When a device operates in a system under the steady-state condition, the maximum power	Original	AN1029 R-T curves RJC MOSFET 12W tesec DV240 motorola application note AN-569 AN1029 AN-569 DV240 NDS9956	PDF
10H516 Abstract: 5962-8750201FA 5962-8750201 qml-38535 CDFP4-F16 GDIP1-T16 MTL10H516F Text: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Add figure 4. IIH on pages 4, 5, and 6. Change 4/ in table I. Change terminal connections. Add subgroup 8 to both final electricals and group A in Table II. Change VSPN for case outline 2 to 10H516M/B2AJC. Editorial changes	Original	10H516M/B2AJC. 5962-R027-92. 5962-R257-94. CDFP4-F16. 0EU86 10H516 5962-8750201FA 5962-8750201 qml-38535 CDFP4-F16 GDIP1-T16 MTL10H516F	PDF
FETs Field Effect Transistors Abstract: 9S12DP256 AN2434 MC9S12C32 MC9S12DP256 MC9S12E128 HCS12 M68HC08 M68HC12 9S12H Text: Freescale Semiconductor Application Note AN2434 Rev. 0, 9/2004 Input/Output I/O Pin Drivers on HCS12 Family MCUs By: Paul Atkinson 8/16 Bit Division Applications Engineering Austin, Texas Introduction Most microcontroller units (MCUs) must connect to other devices. The input/output (I/O) pins provide this	Original	AN2434 HCS12 FETs Field Effect Transistors 9S12DP256 AN2434 MC9S12C32 MC9S12DP256 MC9S12E128 M68HC08 M68HC12 9S12H	PDF
10H515 Abstract: MTL10H515EA qml-38535 CDFP4-F16 GDFP2-F16 GDIP1-T16 MTL10H5152A MTL10H515FA 5962-8750101ea Text: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Add figure 4. Change in terminal connections. Add subgroup 8 to Table II. Change vendor similar part number for case outline 2. Change IIL. Editorial changes throughout. mlp 89-03-07 Michael A. Frye B Changes to Table I and Table II and other changes per NOR 5962-R026-92.	Original	5962-R026-92. CDFP4-F16. 0EU86 10H515 MTL10H515EA qml-38535 CDFP4-F16 GDFP2-F16 GDIP1-T16 MTL10H5152A MTL10H515FA 5962-8750101ea	PDF
R-T curves RJC Abstract: AN1026 AN-569 DV240 NDS9956 Text: N 2. Theory Alan Li, Brij Mohan, Steve Sapp, Izak Bencuya, Linh Hong When a device operates in a system under the steady-state condition, the maximum power dissipation is determined by the maximum junction temperature rating, the ambient temperature, and the junction-to-ambient	Original		PDF
9S12DP256B Abstract: FETs Field Effect Transistors AN2434 pin diagram of hcs12 microcontroller 9S12DP256 HCS12 M68HC08 M68HC12 MC9S12C32 MC9S12DP256 Text: Freescale Semiconductor Application Note AN2434 Rev. 0, 9/2004 Input/Output I/O Pin Drivers on HCS12 Family MCUs By: Paul Atkinson 8/16 Bit Division Applications Engineering Austin, Texas Introduction Most microcontroller units (MCUs) must connect to other devices. The input/output (I/O) pins provide this	Original	AN2434 HCS12 9S12DP256B FETs Field Effect Transistors AN2434 pin diagram of hcs12 microcontroller 9S12DP256 M68HC08 M68HC12 MC9S12C32 MC9S12DP256	PDF

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AUSTIN SQUARE CHIP CARRIER Search Results

AUSTIN SQUARE CHIP CARRIER Result Highlights (5)

AUSTIN SQUARE CHIP CARRIER Datasheets Context Search

MO-047

Untitled

mo-047 texas

84XX

TS-2147-B

84XX

MO-047

TS-2148-B

AS5181

AS5181

wireless energy meter circuit diagram

3 phase current monitor and controller using mc

TC1036CECT

74189

orcad schematic symbol for rj45

mdr 68 pin configuration

AN1028

AN1028

R-T curves RJC

10H516

FETs Field Effect Transistors

10H515

R-T curves RJC

9S12DP256B