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    BGA 7X7 Search Results

    BGA 7X7 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MPC860PZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860PVR80D4 Rochester Electronics LLC 32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC855TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860ENZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy

    BGA 7X7 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    sn63pb37 solder wire

    Abstract: BGA reflow guide BGA PROFILING size 0204 100C TL-TORQUEDRIVER-09 sn63pb37 solder wire shelf life TL-TORQUEDRIVER-01
    Text: GHz BGA Socket User Manual Tel: 800 404-0204 www.ironwoodelectronics.com GHZ BGA SOCKET USER MANUAL Table of Contents Selecting a BGA socket Socket Mechanics PCB Requirements Backing Plate BGA Socket Assembly MLF (QFN) Socket Assembly: Torque Driver Vacuum Pen


    Original     		PDF

    BG329

    Abstract: BGA 27X27 pitch
    Text: EIA Standard Layout of Solder Pad for BGA Devices Figure 1: Suggested Board Layout of Soldered pads for BGA Packages Tabel 1 contains the recommended board layout soldered pad dimension for Actel CS and GA BGA packages only. Table 1: Recommended PCB Design Guidelines


    Original     		CS128 CS180 BG272 BG313 BG329 FG144 FG256 FG484 FG676 FG896 BGA 27X27 pitch PDF

    35 x 35 PBGA, 580 100 balls

    Abstract: Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP
    Text: High Performance! Contents Contents 1. What is a BGA Ball Grid Array ? _ 3 2. Varieties of NEC's BGA _ 3 3. Advantages _ 4 4. Photographs _ 6 5. Line-up_ 8


    Original     		C13550EJ1V0PF00 35 x 35 PBGA, 580 100 balls Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP PDF

    DIN 13715

    Abstract: 12197-507-XTD AMIS41683CANN1G N08L6182AB27I FS7145-02G-XTD valve positioners 11640-843-XTP vending machine fuji SEOUL 5630 LED DATASHEET 19699-002-XTP
    Text: Ultra-Low Power SRAMs Density Mb Organization Voltage Range Speed (ns) Features Package N08L6182A Part Number 8 512 Kb x 16 1.65 - 2.2 70 Dual CE 48-BGA N08L63W2A 8 512 Kb x 16 2.3 - 3.6 70 Dual CE 48-BGA N04L63W2A 4 256 Kb x 16 2.3 - 3.6 55 Dual CE 44-TSOP2, 48-BGA


    Original     		N08L6182A 48-BGA N08L63W2A N04L63W2A 44-TSOP2, N04L63W1A DIN 13715 12197-507-XTD AMIS41683CANN1G N08L6182AB27I FS7145-02G-XTD valve positioners 11640-843-XTP vending machine fuji SEOUL 5630 LED DATASHEET 19699-002-XTP PDF

    ADV0505

    Abstract: FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7
    Text: CUSTOMER ADVISORY ADV0505 Adding Daewon shipping tray for BGA and QFP Package Devices Change Description: Altera is adding shipping trays produced by Daewon Semiconductor Packaging Industrial Company as an additional shipping tray for various BGA and QFP packaged devices. The


    Original     		ADV0505 and14 12C-0707-E19 12F-1111-119 1F3-1313-D19 1F1-1717-A19 12U-1919-G19 12Y-2323-919 12Y-3333-419 12Y-3535-419 ADV0505 FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7 PDF

    132-ball

    Abstract: via antipad pitch micro pitch BGA LC4256ZE MN64 4000ZE drill market LC4256ZEMN144 UMN64 stackup
    Text: LOW COST BOARD LAYOUT TECHNIQUES FOR DESIGNING WITH PLDS IN BGA PACKAGES A Lattice Semiconductor White Paper July 2010 Lattice Semiconductor 5555 Northeast Moore Ct. Hillsboro, Oregon 97124 USA Telephone: 503 268-8000 www.latticesemi.com 1 Low Cost Board Layout Techniques for Designing with PLDs in BGA Packages


    Original     		PDF

    SG-BGA-6046

    Abstract: SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033
    Text: Ironwood Electronics GHz BGA and MLF Sockets SG.1 Our GHz BGA sockets provide excellent signal integrity in a small, cost effective ZIF socket for prototype and test applications. They support pitches from 1.27mm down to 0.5mm. We typically ship within 3 to 5 days ARO.


    Original     		025mm FR4/G10 Sn63Pb37 SG-BGA-6046 SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033 PDF

    Recommended land pattern smd-0.5

    Abstract: "x-ray machine" Lattice Semiconductor Package Diagrams 256-Ball fpBGA pcb fabrication process ultra fine pitch BGA LC4064ZE package dimension 256-FTBGA nomenclature pcb hdi of BGA Staggered Pins package BN256
    Text: PCB Layout Recommendations for BGA Packages September 2010 Technical Note TN1074 Introduction As Ball Grid Array BGA packages become increasingly popular and become more populated across the array with higher pin count and smaller pitch, it is important to understand how they are affected by various board layout


    Original     		TN1074 Recommended land pattern smd-0.5 "x-ray machine" Lattice Semiconductor Package Diagrams 256-Ball fpBGA pcb fabrication process ultra fine pitch BGA LC4064ZE package dimension 256-FTBGA nomenclature pcb hdi of BGA Staggered Pins package BN256 PDF

    NEC VR4300

    Abstract: JIS-Z0202 EDR-7315 225PBGA HG7900 nec bga BGA313 QFP28
    Text: High Performance! Contents 目次 1. BGA とは？ ―――――――――――――― 3 2. NEC の BGA は？ ―――――――――――― 3 3. 特徴 ―――――――――――――――――― 4 4. パッケージ写真 ――――――――――――― 6


    Original     		208QFP 225BGA 20down 56down 225BGA C13550JJ1V0PF00 NEC VR4300 JIS-Z0202 EDR-7315 225PBGA HG7900 nec bga BGA313 QFP28 PDF

    BGA676

    Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
    Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18


    Original     		BGA16A1ATTERNS BGA676 BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X PDF

    NP351

    Abstract: NP351-064-148 NP351-180-139 212207 NP351-21653 NP351-064-227 X3640 np351-532 AC-28179 ac14425
    Text: Series NP351 BGA / CSP 0.80mm Pitch TH - Open Top Specifications Part Number (Details) Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Operating Temperature Range: Contact Force: Mating Cycles: 1,000MΩ min. at 100V DC 100V AC for 1 minute


    Original     		NP351 10mA/20mV NP351 NP351-064-148 NP351-180-139 212207 NP351-21653 NP351-064-227 X3640 np351-532 AC-28179 ac14425 PDF

    SG-BGA-6018

    Abstract: PCB Layout
    Text: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Ball guide prevents over compression of elastomer


    Original     		225mm 5M-1994. SG-BGA-6018 PCB Layout PDF

    SF-PLCC84-J-01

    Abstract: PL-PLCC68-S-01 SO8A SF-PLCC44-J-01 SF-PLCC28-J-01 SF-QFE128SD-K-01 PL-PLCC68-T-01 sf 128 transistor SF 127 PLCC32 through hole socket
    Text: Ironwood Electronics Surface Mount Package Emulation SF.1 Ironwood has developed the industry's widest range of interconnection adapters for testing and socketing of surface mount technology. We offer SMT bases and thru-hole adapters for BGA, PLCC, QFP, and SOIC packages.


    Original     		SK-UGA12/48A-01 SK-MGA12/48A-01 SK-MGA10/48A-01 SK-MGA13/50B-01 SK-MGA12/56A-01 SK-MGA14/56A-01 SK-MGA12/56B-01 SF-PLCC84-J-01 PL-PLCC68-S-01 SO8A SF-PLCC44-J-01 SF-PLCC28-J-01 SF-QFE128SD-K-01 PL-PLCC68-T-01 sf 128 transistor SF 127 PLCC32 through hole socket PDF

    SG-BGA-6100

    Abstract: No abstract text available
    Text: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Ball guide prevents over compression of elastomer


    Original     		225mm SG-BGA-6100 PDF

    A3232

    Abstract: bga 7x7 CSP2 BGA thermal resistance 6x8 bga 6x8 Package BGA 48 PACKAGE thermal resistance
    Text: FBGA Chip Scale BGA Encapsulant Au Wire Die Mold Resin Die Au Wire Polyimide Tape Substrate Solder Laminate Substrate Solder Ball Die Attach Super CSP Si Al SON BCC™ Leadless Redistribution Line Cu Leadframe Metal post (Cu/Barrier) Polyimide Layer SiN


    Original     		PDF

    12x12 bga thermal resistance

    Abstract: PC13892VL IMX51 application notes PC13892 supercap balance
    Text: Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MC13892 in 139, 186 MAPBGA packages.


    Original     		MC13892 13892VK 13892VL 12x12 bga thermal resistance PC13892VL IMX51 application notes PC13892 supercap balance PDF

    bga48

    Abstract: SF-BGA48M-B-11 0.4mm pitch BGA
    Text: C Package Code: BGA48M D See BGA pattern code to the right for actual pattern layout Y Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) 6.00mm [0.236"] X Top View (reference only) 3.74mm [0.147"] 0.30mm [0.012"] dia. 2 0.50mm [0.020"] 1.00mm pitch typ. 0.508 mm [0.020"]


    Original     		BGA48M FR4/G10 SF-BGA48M-B-11 SF-BGA048M-B-11 bga48 0.4mm pitch BGA PDF

    MC13892VL

    Abstract: M13892 MC13892 PC13892VL i.mx51 FC135 MC13892 registers MICRO CRYSTAL CC7V-T1A 32,768Khz VLS252012 MC13892VK
    Text: Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MC13892VK and MC13892VL in 139, 186 MAPBGA packages.


    Original     		MC13892VK MC13892VL MC13892 M13892 MC13892 PC13892VL i.mx51 FC135 MC13892 registers MICRO CRYSTAL CC7V-T1A 32,768Khz VLS252012 PDF

    Untitled

    Abstract: No abstract text available
    Text: Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MC13892VK and MC13892VL in 139, 186 MAPBGA packages.


    Original     		MC13892VK MC13892VL MC13892 PDF

    circuit diagram for Coin based mobile battery charger

    Abstract: 12x12mm BGA package thermal resistance SW2800
    Text: Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MC13892VK and MC13892VL in 139, 186 MAPBGA packages.


    Original     		MC13892VK MC13892VL MC13892 circuit diagram for Coin based mobile battery charger 12x12mm BGA package thermal resistance SW2800 PDF

    circuit diagram for Coin based mobile battery charger

    Abstract: coin box mobile charger circuit diagram MC13892AJVK Coin based mobile battery charger circuit diagram MC13892J coin operated battery charger data CS 20A SW2800
    Text: Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MC13892*VK and MC13892*VL in 139, 186 MAPBGA packages.


    Original     		MC13892 circuit diagram for Coin based mobile battery charger coin box mobile charger circuit diagram MC13892AJVK Coin based mobile battery charger circuit diagram MC13892J coin operated battery charger data CS 20A SW2800 PDF

    MC13892 registers

    Abstract: SW-228
    Text: Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MC13892*VK and MC13892*VL in 139, 186 MAPBGA packages.


    Original     		MC13892 MC13892 registers SW-228 PDF

    circuit diagram for Coin based mobile battery charger

    Abstract: xtal2 32.768
    Text: Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MC13892*VK and MC13892*VL in 139, 186 MAPBGA packages.


    Original     		MC13892 26-Aug-2010 circuit diagram for Coin based mobile battery charger xtal2 32.768 PDF

    Untitled

    Abstract: No abstract text available
    Text: MX23L3212 32M-BIT MASK ROM FEATURES PIN DESCRIPTION • Bit organization - 4M x 8 byte mode - 2M x 16 (word mode) • Fast access time - Random access:90ns(max.) • Current - Operating:16mA - Standby:5uA • Supply voltage - 2.7V ~ 3.6V • Package - 48 ball mini BGA (7.0mm x 7.0mm, ball pitch


    Original     		MX23L3212 32M-BIT 70ns/2 D15/A-1 JUL/11/2001 OCT/03/2001 MAR/27/2002 JUN/20/2003 MAY/19/2004 JUL/07/2004 PDF