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    BGA 81 Search Results

    BGA 81 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MPC860PZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860PVR80D4 Rochester Electronics LLC 32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC855TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860ENZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
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    BGA 81 Price and Stock

    NXP Semiconductors BGA2818,115

    RF Amplifier MMIC wideband amp
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics BGA2818,115 11,151
    • 1 $0.4
    • 10 $0.282
    • 100 $0.228
    • 1000 $0.204
    • 10000 $0.165
    		Buy Now

    KEMET Corporation C1812C473JBGACTU

    Multilayer Ceramic Capacitors MLCC - SMD/SMT 630V 0.047uF C0G 1812 5%
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics C1812C473JBGACTU 6,480
    • 1 $2.41
    • 10 $1.79
    • 100 $1.4
    • 1000 $1.07
    • 10000 $0.997
    		Buy Now

    NXP Semiconductors BGA2817,115

    RF Amplifier MMIC wideband amp amplifier
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics BGA2817,115 4,104
    • 1 $0.33
    • 10 $0.282
    • 100 $0.219
    • 1000 $0.176
    • 10000 $0.145
    		Buy Now

    Cree, Inc. C503B-GAN-CD0E0781

    Standard LEDs - Through Hole Green LED 527nm 5-mmRound 32900-64600mcd
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics C503B-GAN-CD0E0781 3,804
    • 1 $0.3
    • 10 $0.29
    • 100 $0.26
    • 1000 $0.235
    • 10000 $0.235
    		Buy Now

    KEMET Corporation C1812C102FBGACTU

    Multilayer Ceramic Capacitors MLCC - SMD/SMT 630V 1000pF 0.01
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics C1812C102FBGACTU 2,129
    • 1 $2.35
    • 10 $1.81
    • 100 $1.37
    • 1000 $0.97
    • 10000 $0.901
    		Buy Now
    Find more BGA 81 price and stock on Findchips.com

    BGA 81 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    reflow temperature rohs bga

    Abstract: 0.65mm pitch BGA
    Text: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)


    Original     		PDF

    BGA 731

    Abstract: 0.65mm pitch BGA bga thermal cycling reliability ASTM-B-488 C17200
    Text: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)


    Original     		PDF

    0.65mm pitch BGA

    Abstract: ASTM-B-488 157 BGA socket
    Text: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)


    Original     		PDF

    bga PCB footprint

    Abstract: No abstract text available
    Text: BGA Adapters Ball Grid Array BGA Adapters Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A) Material: FR-4 Fiberglass Epoxy Board


    Original     		PDF

    MACH4A

    Abstract: JTAG jtag mhz jtag 14 PQFP-144 ispLSI 2128-A M4A5-64 M5A3-384
    Text: 208-Ball BGA 256-Ball BGA 100-Ball BGA 49-Ball BGA 144-Ball BGA ® Fine Pitch BGA ispLSI, MACH, ispGDX & ispGAL Packages ® 7.00 x 7.00 mm 0.8 mm pitch 10.00 x 10.00 mm 0.8 mm pitch 13.00 x 13.00 mm 1.0 mm pitch 17.00 x 17.00 mm 1.0 mm pitch All dimensions refer to package body size


    Original     		PDF 208-Ball 256-Ball 100-Ball 49-Ball 144-Ball 100-Pin 128-Pin 48-Pin 44-Pin 144-Pin MACH4A JTAG jtag mhz jtag 14 PQFP-144 ispLSI 2128-A M4A5-64 M5A3-384

    BGA 731

    Abstract: bga thermal cycling reliability material for ball grid array packaging
    Text: BGA Adapters Ball Grid Array BGA Adapters Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A) Material: FR-4 Fiberglass Epoxy Board


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: BGA Adapters Ball Grid Array BGA Adapters Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A) Material: FR-4 Fiberglass Epoxy Board


    Original     		PDF CAT16-PREVIEW06

    BGA reflow guide

    Abstract: sn63pb37 solder SPHERES 1mm pitch BGA socket TL-VACUUMPEN-01 sn63pb37 solder wire ultra fine pitch BGA sn63pb37 0.4mm 20mm light dependent resistors 23M1 fine BGA thermal profile
    Text: Tel: 800 404-0204 • (651) 452-8100 Fax: (651) 452-8400 PO Box 21151 • St. Paul, MN 55121 • USA www.ironwoodelectronics.com GHz BGA Socket User Manual Selecting BGA socket: You need to have the IC package drawing ready to select the right BGA socket. Go to


    Original     		PDF

    gk 7031

    Abstract: No abstract text available
    Text: W2637A, W2638A and W2639A LPDDR BGA Probes for Logic Analyzers and Oscilloscopes Data sheet Introduction The W2637A, W2638A and W2639A LPDDR BGA probes provide signal accessibility and probing of embedded memory designs directly at the ball grid array BGA package.


    Original     		PDF W2637A, W2638A W2639A 5990-3892EN gk 7031

    W2639A

    Abstract: lpddr W2638A-101 W3635A N5425 9104a Oscilloscope Probe to PC E2678A specification of Logic Analyzer W2638A
    Text: W2637A, W2638A and W2639A LPDDR BGA Probes for Logic Analyzers and Oscilloscopes Data sheet Introduction The W2637A, W2638A and W2639A LPDDR BGA probes provide signal accessibility and probing of embedded memory designs directly at the ball grid array BGA package.


    Original     		PDF W2637A, W2638A W2639A an120 5990-3892EN W2639A lpddr W2638A-101 W3635A N5425 9104a Oscilloscope Probe to PC E2678A specification of Logic Analyzer

    daewon tray

    Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
    Text: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA


    Original     		PDF AN-071-5 Hand-0444 daewon tray Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga

    40 pin ide to 44 pin ide adapter cable

    Abstract: ide cable pin 40 pin ide cable intel ssd LPT 25 pin ide cable lpt port 44 pin ide to 40 pin ide Intel BGA cpu intel
    Text: Ethernet µFC-BGA SBC83685 Board ID CompactFlash 2 USB CRT PCI Intel µFC-BGA Embedded SBC with 4 Ethernet Microsoft ® Windowsxp WindowsCE FDD Conn. Features IDE 2 Port Fanless IDE 1 Port Intel µFC-BGA ULP/LP CPU ® PCI Expansion DIMM CompactFlash™


    Original     		PDF SBC83685 RJ-45 ATA-100 RS-232, RS-232/422/485, 82551QM 82551ER 44-pin 40 pin ide to 44 pin ide adapter cable ide cable pin 40 pin ide cable intel ssd LPT 25 pin ide cable lpt port 44 pin ide to 40 pin ide Intel BGA cpu intel

    Untitled

    Abstract: No abstract text available
    Text: BGA Adapter Sockets Ball Grid Array BGA Adapter Sockets Table of Models Description: Standard Socket (S) Material: High Temp. Liquid Crystal Polymer (LCP)* Index: -60°C to 260°C (-76°F to 500°F) Insulator Size: Same size as BGA device body Description: Extraction Socket (SB)


    Original     		PDF CAT16-PREVIEW06

    Untitled

    Abstract: No abstract text available
    Text: W3630A Series DDR3 BGA Probes for Logic Analyzers and Oscilloscopes Data Sheet The W3630A series DDR3 BGA probes enable probing of embedded memory DIMMs directly at the ball grid array with Agilent logic analyzers and oscilloscopes. The Agilent W3630A series DDR3 BGA probes for logic analyzers


    Original     		PDF W3630A U4154A 5990-3179EN

    337 BGA

    Abstract: U212-25 AA10 AA23 EP20K200C E22/6/BC237/238/239/EPC16/TL7660IDGKRG4-datasheet
    Text: EP20K200C I/O Pin-Outs ver. 1.0 I/O & Pad Number Pin/Pad VREF Orientation Function Bank 208-Pin PQFP 1 240-Pin PQFP (1) 484-Pin 356-Pin FineLine BGA BGA 652-Pin BGA 672-Pin FineLine BGA 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 –


    Original     		PDF EP20K200C 208-Pin 240-Pin 484-Pin 356-Pin 652-Pin 672-Pin 337 BGA U212-25 AA10 AA23 E22/6/BC237/238/239/EPC16/TL7660IDGKRG4-datasheet

    N5426A

    Abstract: N5451A PC Oscilloscope Probe W3630A W3635A DDR3 pin out quaddie ddr3 B4621A E2677A W3630
    Text: W3630A Series DDR3 BGA Probes for Logic Analyzers and Oscilloscopes Data Sheet The W3630A series DDR3 BGA probes enable probing of embedded memory DIMMs directly at the ball grid array with Agilent logic analyzers and oscilloscopes. The Agilent W3630A series DDR3 BGA probes for logic analyzers and


    Original     		PDF W3630A 5990-3179EN N5426A N5451A PC Oscilloscope Probe W3635A DDR3 pin out quaddie ddr3 B4621A E2677A W3630

    pci riser

    Abstract: SBC83683VEA-650 EM60320 SBC83683VEA-400 bga intel intel microsoft AX8907 AX8502
    Text: CompactFlash Ethernet µFC-BGA SBC83683 AC'97 Audio Board ID CRT PCI Intel µFC-BGA Embedded SBC with Multiple I/O Features Microsoft ® Windowsxp WindowsCE Power Conn. FDD Conn. Features IDE 2 Port ™ Fanless IDE 1 Port Intel µFC-BGA ULP/LP CPU ®


    Original     		PDF SBC83683 10/100Base-T RJ-45 SBC83683VEMHz) 512MB 815E-B V/196 146mm, 24bpp pci riser SBC83683VEA-650 EM60320 SBC83683VEA-400 bga intel intel microsoft AX8907 AX8502

    196-pin

    Abstract: DSP56300 EB360
    Text: Freescale Semiconductor Engineering Bulletin EB360 Rev. 1, 10/2005 Mechanical Differences Between the 196-pin MAP-BGA and 196-pin PBGA Packages This document describes the differences between the 196-pin Mold Array Process-Ball Grid Array MAP-BGA and the 196pin Plastic Ball Grid Array (PBGA) packages. The MAP - BGA


    Original     		PDF EB360 196-pin 196-pin 196pin DSP56300 EB360

    DSP56300

    Abstract: EB362
    Text: Freescale Semiconductor Engineering Bulletin EB362 Rev. 1, 10/2005 Mechanical Differences Between the 252-pin MAP-BGA and 252-pin PBGA Packages This document describes the differences between the 252-pin MAP-BGA Mold Array Process-Ball Grid Array and the 252pin PBGA (Plastic Ball Grid Array) packages. The MAP-BGA


    Original     		PDF EB362 252-pin 252-pin 252pin DSP56300 EB362

    35 x 35 PBGA, 580 100 balls

    Abstract: Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP
    Text: High Performance! Contents Contents 1. What is a BGA Ball Grid Array ? _ 3 2. Varieties of NEC's BGA _ 3 3. Advantages _ 4 4. Photographs _ 6 5. Line-up_ 8


    Original     		PDF C13550EJ1V0PF00 35 x 35 PBGA, 580 100 balls Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP

    AS 108-120

    Abstract: EPM7128B 144-FI 95 g4
    Text: EPM7128B Dedicated Pin-Outs ver. 1.0 Dedicated Pin 48-Pin VTQFP 49-Pin Ultra FineLine BGA 100-Pin TQFP 100-Pin 144-Pin FineLine BGA TQFP 169-Pin Ultra FineLine BGA INPUT/GCLK1 INPUT/GCLRn INPUT/OE1 INPUT/OE2/GCLK2 TDI 1 TMS (1) TCK (1) TDO (1) VREFA (2)


    Original     		PDF EPM7128B 48-Pin 49-Pin 100-Pin 144-Pin 169-Pin AS 108-120 144-FI 95 g4

    BLVDS-25

    Abstract: LVDSEXT-25 4564 RAM XC2VP70 FF1704 pinout XC2V1000 Pin-out XC2V1500 XC2V2000 XC2V3000 XC2V6000 XC2V8000
    Text: Xilinx Virtex-II Series FPGAs and RocketPHY Physical Layer Transceivers Transceiver Blocks 992 88 120 200 264 432 528 624 720 912 1104 1108 Chip Scale Packages CS – wire-bond chip-scale BGA (0.8 mm ball spacing) 144 8 88 92 FF896 92 8 FF1152 BGA Packages (BG) – wire-bond standard BGA (1.27 mm ball spacing)


    Original     		PDF FF896 FF1152 FF11486 10Gbps BLVDS-25 LVDSEXT-25 4564 RAM XC2VP70 FF1704 pinout XC2V1000 Pin-out XC2V1500 XC2V2000 XC2V3000 XC2V6000 XC2V8000

    bobbins

    Abstract: 770-424-4888 SW80B SODER-WICK
    Text: m SODER-WICK FINE BRAID Soder-Wick BGA Desoldering Braid The most effective, economical way to safely and completely remove solder from BGA pads and chips. ► Why Soder-Wick BGA Desoldering Braid? Key Product Characteristics: • Optimized rosin flux content


    OCR Scan     		PDF 60-BGA-5 SW60BGA5 80-BGA-5 SW80BGA5 1-800-TECH-401 bobbins 770-424-4888 SW80B SODER-WICK