tray datasheet bga
Abstract: BGA35
Text: Mounting Pad Packing Name JEDEC Tray T-657 352 pin BGA 35 x 35 A S B C D P J H R K L φM F E I G M NOTE Each ball centerline is located within φ 0.30 mm (φ 0.012 inch) of its true position (T.P.) at maximum material condition. ITEM A MILLIMETERS 35.00±0.15
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T-657
P352S1-F6
tray datasheet bga
BGA35
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tray datasheet bga
Abstract: S 657 A S352S1-F6-1
Text: Packing Name Mounting Pad JEDEC Tray T-657 352 pin BGA 35 x 35 A B S C D P Index mark J R I H F K L φM E G M NOTE Each lead centerline is located within φ 0.3 mm (φ 0.012 inch) of its true position (T.P.) at maximum material condition. NEC CODE S352S1-F6-1
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T-657
S352S1-F6-1
tray datasheet bga
S 657 A
S352S1-F6-1
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tray datasheet bga
Abstract: F5 MARK S313S1-F5-1
Text: Packing Name Mounting Pad JEDEC Tray T-657 313 pin BGA 35 x 35 A B S C D P Index mark J R I H T K L φM M NOTE E G F Each lead centerline is located within φ 0.3 mm (φ 0.012 inch) of its true position (T.P.) at maximum material condition. NEC CODE S313S1-F5-1
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T-657
S313S1-F5-1
tray datasheet bga
F5 MARK
S313S1-F5-1
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tray datasheet bga
Abstract: F5 MARK
Text: Mounting Pad Packing Name JEDEC Tray T-657 313 pin BGA 35 x 35 A S B B A C D P Index mark J I R A H S T E G F L φM φN M S A B M S *1 *2 detail of A part ITEM MILLIMETERS INCHES A 35.00±0.20 1.378±0.008 B 30.0 1.181 C 30.0 1.181 D E 35.00±0.20 2.26
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T-657
Y313S1-F5
tray datasheet bga
F5 MARK
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tray datasheet bga
Abstract: No abstract text available
Text: Packing Name Mounting Pad JEDEC Tray TBGA 40x40 500 pin T-BGA H/Sp (40 × 40) A A B Q A1 R ST D BW A2 X C Y Index mark J A S H B G F L M P M M E S A B *1 S *2 ITEM A MILLIMETERS 40.00±0.20 INCHES 1.575±0.008 A1 23.00 MAX. 0.906 MAX. A2 23.00 MAX. 0.906 MAX.
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S500N7-H6
tray datasheet bga
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hsp35
Abstract: C0016
Text: Packing Name Mounting Pad JEDEC Tray TBGA 35x35 352 pin T-BGA H/Sp (35 × 35) A A B Q A1 R S T BW A2 D X C Index mark Y J H S A G B K φM φP L S M M F E S A B S ∗2 detail of A part ∗1 detail of B part (Z) N ITEM MILLIMETERS INCHES A 35.00±0.20 1.378±0.008
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S352N7-F6-1
hsp35
C0016
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h 033
Abstract: P119S1-R4 bga 84
Text: Packing Name Mounting Pad JEDEC Tray NX BG1422 2.0 119 pin BGA 14 x 22 A S B T C 7 6 5 4 3 2 1 D U T R P NM L K J HG F E DC B A P J I R H K F E G L ITEM MILLIMETERS INCHES A B 22.0±0.2 19.5 0.866±0.008 0.768 C 12.0 0.472 D E 14.0±0.2 0.84 0.551±0.008
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BG1422
P119S1-R4
h 033
P119S1-R4
bga 84
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hsp35
Abstract: 1362 597G
Text: Mounting Pad Packing Name JEDEC Tray TBGA 35x35 420 pin T-BGA H/Sp (35 × 35) A A B Q A1 R S T B W A2 D X C Y Index mark J A S H B G F L M P M M E S A B *1 S *2 ITEM A MILLIMETERS 35.00±0.20 INCHES 1.378±0.008 A1 20.50 MAX. 0.807 MAX. A2 20.50 MAX. 0.807 MAX.
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S420N7-F6
hsp35
1362
597G
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BGA 8 x 8 tray
Abstract: tray datasheet bga S576N7
Text: Mounting Pad Packing Name JEDEC Tray TBGA 40x40 576 pin T-BGA H/Sp (40 × 40) A A B Q A1 R S T BW A2 D X C Y Index mark J S A H B G F L M P M M E S A B *1 S *2 detail of A part (Z) detail of B part K S N NOTES *1 Each ball centerline is located within φ 0.30 mm (φ 0.012 inch) of
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S576N7-H6
BGA 8 x 8 tray
tray datasheet bga
S576N7
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256-pin
Abstract: No abstract text available
Text: Mounting Pad Packing Name JEDEC Tray TBGA 27x27 256 pin T-BGA H/Sp (45 × 45) B A A Q A1 R S T B W A2 D X C Y Index mark A S J H B G F L M P M M E S A B *1 S *2 detail of A part detail of B part (Z) K S N NOTES *1 Each ball centerline is located within φ 0.30 mm (φ 0.012 inch) of
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25MIN.
S256N7-B6
256-pin
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transistor h9
Abstract: No abstract text available
Text: Mounting Pad Packing Name JEDEC Tray TBGA 40x40 696 pin T-BGA H/Sp (40 × 40) A U B A1 A Q R S T BW V D A2 X C Index mark J H S A G B K φM φP L S M M detail of A part F S A B S ∗2 ∗1 E detail of B part Z N NOTE ∗1 Each ball centerline is located within φ 0.30 mm (φ 0.012 inch) of
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S696N7-H9
transistor h9
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WY transistor
Abstract: tray datasheet bga 256-pin BGA S256S1-B6-1
Text: Mounting Pad Packing Name JEDEC Tray T-651 256 pin BGA 27 x 27 A S B C D Y WV U T R P N M L K J H G F E D C B A P Index mark R H K L 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 φM F E I J G M NOTE Each lead centerline is located within φ 0.3 mm (φ 0.012 inch) of
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T-651
S256S1-B6-1
WY transistor
tray datasheet bga
256-pin BGA
S256S1-B6-1
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tray datasheet bga
Abstract: 0n 33 25
Text: Packing Name Mounting Pad JEDEC Tray T-657 352 pin BGA 35 x 35 A B A B S 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 C D AE AC AA W U R N L J G E C A AF AD AB Y V T P M K H F D B P Index mark J I R H S K L φM φN S F M S A B M
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T-657
Y352S1-F6-1
tray datasheet bga
0n 33 25
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tray datasheet bga
Abstract: 256-pin BGA BGA L WY transistor
Text: Packing Name Mounting Pad JEDEC Tray T-651 256 pin BGA 27 x 27 A S B B A C 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 D YWV U T R P N M L K J H G F E D C B A P Index mark J R I A H S F L φM φN M S A B M S E G *1 *2 detail of A part K S NOTES * 1 Each lead centerline is located within φ 0.30 mm (φ 0.012 inch) of
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T-651
Y256S1-B6
tray datasheet bga
256-pin BGA
BGA L
WY transistor
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676 BGA package tray
Abstract: BGA package tray NEC 2415 tray bga 676-Pin 596-PIN 27ES jedec tray BGA tray datasheet bga BGA JEDEC tray
Text: TRAY CONTAINER UNIT : mm 4x10=40 NEC 7 135°C MAX. 27.50 29.20 262.8 315.0 322.6 26.10 Section A – A' 27.50 27.00 (5.95) (6.35) 7.62 27.50 29.20 87.6 BGA27×27ESP A' 24.15 135.9 PPE A Applied Package Quantity (pcs) Tray BGA27×27ESP 225-pin Plastic BGA (27×27)
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BGA27
27ESP
225-pin
256-pin
272-pin
316-pin
320-pin
352-pin
676 BGA package tray
BGA package tray
NEC 2415
tray bga
676-Pin
596-PIN
27ES
jedec tray BGA
tray datasheet bga
BGA JEDEC tray
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676 BGA package tray
Abstract: tray bga BGA package tray jedec bga tray NEC 2415 tray bga 27
Text: TRAY CONTAINER UNIT : mm 4x10=40 NEC 27.50 7 135°C MAX. 29.20 87.6 BGA27×27ESP A' 24.15 27.50 29.20 262.8 26.10 315.0 322.6 SECTION A – A' 27.50 (5.95) (6.35) 27.00 7.62 135.9 PPE A Applied Package 225-pin Plastic BGA (27×27) 256-pin Plastic BGA (27×27)
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BGA27
27ESP
225-pin
256-pin
272-pin
316-pin
320-pin
352-pin
385-pin
400-pin
676 BGA package tray
tray bga
BGA package tray
jedec bga tray
NEC 2415
tray bga 27
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tray datasheet bga
Abstract: 4545
Text: TRAY CONTAINER 45.3 27.95 2 x 6 = 12 A' A 48.00 37.50 150°C MAX 135.9 80.0 BGA 45 × 45 PPE 7 HEAT PROOF Unit : mm 45.3 240.0 315.0 322.6 SECTION A – A' Applied Package 4.72 7.62 (6.35) 45.30 44.0 Quantity (pcs) BGA 45 × 45 Tray 480-pin • Plastic BGA (45×45)
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480-pin
580-pin
672-pin
756-pin
888-pin
SSD-A-H5933-3
tray datasheet bga
4545
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337 BGA
Abstract: tray bga 256-pin BGA Transistor 337 tray datasheet bga BGA PACKAGE 2015
Text: TRAY CONTAINER UNIT : mm 5x12=60 A' 135°C MAX. 20.15 21.35 7 BGA21×21ESP 23.90 NEC 95.6 135.9 PPE A 21.35 23.90 262.9 26.05 315.0 322.6 SECTION A – A' 21.35 (5.95) 7.62 (6.35) 21.00 Applied Package Quantity (pcs) BGA21×21 ESP Tray 256-pin • Plastic BGA (21×21)
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BGA21
21ESP
256-pin
272-pin
292-pin
320-pin
337-pin
SSD-A-H7071-3
337 BGA
tray bga
256-pin BGA
Transistor 337
tray datasheet bga
BGA PACKAGE 2015
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tray datasheet bga
Abstract: tray bga
Text: 150°C MAX 135.9 80 BGA 45 x 45 2 × 6 = 12 PPE 7 HEAT PROOF Unit : mm 45.3 A 48 37.5 45.3 240 315 322.6 SECTION A – A' 45.3 44 4.72 7.62 6.35 27.95 A' BGA 45 × 45 Tray Material Carbon PPE Heat Proof Temp. Surface resistance 135°C 12 less than 1 × 10 Ω /
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480-pin
580-pin
672-pin
tray datasheet bga
tray bga
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nec 2565
Abstract: SSD-A-H6921 tray datasheet bga BGA package tray 2565 nec tray bga 576
Text: TRAY CONTAINER HEAT PROOF PPE 150°C MAX 40.25 42.3 30.6 40.25 A' 25.65 A PBGA 40x40 42.3 7 84.6 3×7=21 253.8 315 322.6 SECTION A – A' 40.25 4.74 7.62 6.35 135.9 Unit : mm Applied Package Quantity (pcs) 416-pin Plastic BGA (40×40) 500-pin Plastic BGA (40×40)
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500-pin
576-pin
644-pin
416-pin
SSD-A-H6921
nec 2565
SSD-A-H6921
tray datasheet bga
BGA package tray
2565 nec
tray bga 576
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tray bga
Abstract: BGA22 JEDEC TRAY DIMENSIONS FBGA 60 JEDEC FBGA tray datasheet bga nec 2222 FBGA 320
Text: TRAY CONTAINER UNIT : mm NEC 7 135°C MAX. 22.35 26.30 105.2 BGA22x22ESP A' 15.35 22.35 25.80 283.8 15.60 315.0 322.6 Section A – A' 22.35 (5.52) (6.35) 22.00 7.62 135.9 5×12=60 PPE A Applied Package Quantity (pcs) Tray BGA 22×22 ESP 320-pin Plastic BGA (22×22)
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BGA22
22ESP
320-pin
345-pin
385-pin
389-pin
429-pin
SSD-A-H6973-4
tray bga
JEDEC TRAY DIMENSIONS FBGA 60
JEDEC FBGA
tray datasheet bga
nec 2222
FBGA 320
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27B1
Abstract: BGA27 BGA package tray 625-Pin
Text: TRAY CONTAINER UNIT : mm 4 x 10=40 87.6 135° C MAX. 27.25 24.15 NEC BGA27 × 27B-1 29.20 135.9 PPE A' A 27.25 29.20 26.10 262.8 315.0 322.6 SECTION A-A' 4.17 (6.35) 7.62 27.25 Applied Package Quantity (pcs) Tray BGA27×27B-1 624-pin Plastic BGA (27×27)
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BGA27
27B-1
BGA27
624-pin
625-pin
720-pin
960-pin
SSD-A-H7549-2
27B1
BGA package tray
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nec 575
Abstract: 484-pin BGA NEC C 324 C jedec tray BGA 324-PIN tray datasheet bga JEDEC tray standard tray bga TRAY DIMENSIONS TRAY CONTAINER
Text: TRAY CONTAINER UNIT : mm 5x12=60 PPE 135°C MAX. 16.95 25.50 23.25 BGA23×23ESP NEC 102.0 A' 25.50 135.9 A 23.25 17.25 280.5 315.0 322.6 Section A – A' 23.25 (6.07) (6.35) 7.62 23.00 Applied Package Quantity (pcs) 324-pin Plastic BGA (23×23) 352-pin Plastic BGA (23×23)
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BGA23
23ESP
324-pin
352-pin
484-pin
575-pin
SSD-A-H7317-4
nec 575
484-pin BGA
NEC C 324 C
jedec tray BGA
tray datasheet bga
JEDEC tray standard
tray bga
TRAY DIMENSIONS
TRAY CONTAINER
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313-PIN
Abstract: No abstract text available
Text: UNIT : mm 322.6 315 24.5 266 29.95 A 35.15 38 76 135.9 38 A' 35.15 SECTION A – A' 36.8 5.16 7.62 6.35 35.15 Applied Package 313-pin Plastic BGA 352-pin Plastic BGA 396-pin Plastic BGA Quantity pcs Tray Material MAX. 24 Heat Proof Temp. T-657 Carbon PES
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313-pin
352-pin
396-pin
T-657
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