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Fischer Elektronik GmbH & Co KG ICK BGA 29 X 29 X 10 Heatsink: extruded; black; L: 29mm; W: 29mm; H: 10mm; aluminium
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
TME	ICK BGA 29 X 29 X 10		57		1	1 $5.1 10 $4.58 100 $3.56 1000 $3.56 10000 $3.56	Buy Now
Fischer Elektronik GmbH & Co KG ICK BGA 29 X 29 X 6 Heatsink: extruded; black; L: 29mm; W: 29mm; H: 6mm; aluminium
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
TME	ICK BGA 29 X 29 X 6		5		1	1 $4.96 10 $4.42 100 $3.44 1000 $3.44 10000 $3.44	Buy Now
TE Connectivity 85BSD-001BG-A2956 PRESS XDCR;NISO;85BSD-001BG-A2
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Interstate Connecting Components	85BSD-001BG-A2956					1 - 10 - 100 - 1000 - 10000 -	Buy Now
Fischer Elektronik GmbH & Co KG ICK BGA 29X29X10 Heat Sink Passive BGA ST SMD 18ï¿½C/W Aluminum (Alt: 10136488)
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Avnet Abacus	ICK BGA 29X29X10			13 Weeks	5	1 - 10 - 100 - 1000 - 10000 -	Buy Now

BGA29 Datasheets (1)

Part	ECAD Model	Manufacturer	Description	Curated	Datasheet Type	PDF
BGA292		NXP Semiconductors	Footprint for reflow soldering		Original	PDF

BGA29 Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
MD-001A Abstract: No abstract text available Text: MN103E010HRA, MN103E040HYB Type MN103E010HRA MN103E040HYB Command Cache 16 K-byte 4-way, set-associative Data Cashe 16 K-byte (4-way, set-associative) SRAM Used by Both Instructions and Data Package 16 K-byte BGA292-P-2727 FLGA424-C-1717 7.5 ns (at 1.8 V tolerance = ± 5%, 133 MHz)	Original	MN103E010HRA, MN103E040HYB MN103E010HRA BGA292-P-2727 FLGA424-C-1717 16/24/32-bit 16-bit MD-001A	PDF
JEDEC TRAY DIMENSIONS Abstract: tray container dimensions BGA package tray JEDEC tray standard dimensions 729-Pin tray bga TRAY CONTAINER JEDEC tray standard Text: TRAY CONTAINER UNIT : mm 4 x 9=36 135° C MAX. 31.60 29.23 31.10 252.8 315.0 322.6 Section A – A' 29.23 4.67 (6.35) 7.62 29.23 NEC 94.2 31.40 BGA29 × 29B A' 20.85 135.9 PPE A Applied Package 729-pin Plastic BGA (29×29) (Flip-chip type) Quantity (pcs)	Original	BGA29 729-pin BGA29 SSD-A-H7796 JEDEC TRAY DIMENSIONS tray container dimensions BGA package tray JEDEC tray standard dimensions tray bga TRAY CONTAINER JEDEC tray standard	PDF
0.3mm pitch BGA Abstract: micro pitch BGA SF-BGA292D-B-11 1mm pitch BGA BGA 20x20 Text: C BGA292D D Ø 0.396mm x2 See BGA pattern code to the right for actual pattern layout Y (optional alignment hole) 1mm pitch typ. 19mm X Top View (reference only) Ø 0.508mm pad 3.48mm [0.137"] 2 0.5mm 0.3mm [0.012"] dia. 5.32mm [0.210"] 0.635mm 19mm B 1	Original	BGA292D 396mm 508mm 635mm FR4/G10 20X20 488mm SF-BGA292D-B-11 0.3mm pitch BGA micro pitch BGA 1mm pitch BGA BGA 20x20	PDF
P-BGA-292 Abstract: PBGA292 Text: P-BGA292-2727-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.	Original	P-BGA292-2727-1 P-BGA-292 PBGA292	PDF
C BGA292 Abstract: BGA292 MS-034 BGA-292 sot881 Text: Package outline Philips Semiconductors BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.55 mm D SOT881-1 B A D1 ball A1 index area A A2 A1 E1 E detail X C e1 e ∅v ∅w b 1/2 e y1 C C A B C M M y Y W e V U T R P N M L e2 K J H 1/2 e G	Original	BGA292: OT881-1 OT881-1 MS-034 C BGA292 BGA292 MS-034 BGA-292 sot881	PDF
BGA-292 Abstract: BGA292 C BGA292 MS-034 Text: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm SOT489-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C Y W V U T R P N M L K	Original	BGA292: OT489-1 MS-034 BGA-292 BGA292 C BGA292 MS-034	PDF
SF-BGA292A-B-11 Abstract: No abstract text available Text: D Package Code: BGA292A C 24.13mm [0.950"] 0.64mm [0.025"] See BGA pattern code to the right for actual pattern layout Y 0.89mm [0.035"] 1.27 mm [0.050"] X Top View reference only 24.13mm [0.950"] 2 0.36mm [0.014"] dia. 0.64mm [0.025"] 5.33mm 3.74mm [0.147"]	Original	BGA292A FR4/G10 SF-BGA292A-B-11	PDF
SD2608 Abstract: IEEE754 MN103E010HRA MN103E040HYB Text: MN103E010HRA, MN103E040HYB Type MN103E010HRA MN103E040HYB Command Cache 16 K-byte 4-way, set-associative Data Cashe 16 K-byte (4-way, set-associative) SRAM Used by Both Instructions and Data Package 16 K-byte BGA292-P-2727 Lead-free FLGA424-C-1717 Lead-free	Original	MN103E010HRA, MN103E040HYB MN103E010HRA BGA292-P-2727 FLGA424-C-1717 16/24/32-bit SD2608 IEEE754 MN103E010HRA MN103E040HYB	PDF
PRBG0297FA-A Abstract: P-BGA297-23x23-1 Text: JEITA Package Code P-BGA297-23x23-1.00 RENESAS Code PRBG0297FA-A B D1 D Previous Code 297F7X-A MASS[Typ.] 1.7g A A ZD b S AB e ZE AA Y W V U T R P N M L K J H G F E D C B A E1 E e A1 Reference Symbol y S 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21	Original	P-BGA297-23x23-1 PRBG0297FA-A 297F7X-A PRBG0297FA-A	PDF
sd2608 Abstract: 9801 nec IEEE754 MN103E010HRA MN103E040HYB pc9801 nec c bus Text: MN103E010HRA, MN103E040HYB Type MN103E010HRA MN103E040HYB Instruction Cache 16 K-byte 4-way, set-associative Data Cashe 16 K-byte (4-way, set-associative) SRAM Used by Both Instructions and Data Package 16 K-byte BGA292-P-2727 Lead-free FLGA424-C-1717 Lead-free	Original	MN103E010HRA, MN103E040HYB MN103E010HRA BGA292-P-2727 FLGA424-C-1717 16/24/32-bit PC-9801 sd2608 9801 nec IEEE754 MN103E010HRA MN103E040HYB pc9801 nec c bus	PDF
jedec bga tray Abstract: 784-pin 12Surface tray bga BGA package tray Text: TRAY CONTAINER 94.2 7 29.45 31.60 31.10 135°C MAX. 29.45 A' 20.85 A BGA29 x 29ESP 31.40 135.9 PPE 4 × 9=36 UNIT : mm 252.8 315.0 322.6 SECTION A – A' 29.45 (6.08) (6.35) 7.62 29.00 Applied Package Quantity (pcs) 272-pin Plastic BGA (29×29) (CAVITY DOWN ADVANCED TYPE)	Original	BGA29 29ESP 272-pin 729-pin 784-pin BGA29 SSD-A-H6977-2 jedec bga tray 12Surface tray bga BGA package tray	PDF
SF-BGA296A-B-11 Abstract: No abstract text available Text: D Package Code: BGA296A 26.67mm [1.050"] C 0.64mm [0.025"] See BGA pattern code to the right for actual pattern layout Y 0.76mm [0.030"] X 26.67mm [1.050"] Top View reference only 1.27 mm [0.050"] 2 0.36mm [0.014"] dia. 0.64mm [0.025"] 5.33mm 3.74mm [0.147"]	Original	BGA296A FR4/G10 SF-BGA296A-B-11	PDF
MO-151 Abstract: BGA292 transistor t 04 27 C BGA292 Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm SOT489-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A Y W V U e T R P N M L e1 K	Original	BGA292: OT489-1 MO-151 MO-151 BGA292 transistor t 04 27 C BGA292	PDF
BGA292 Abstract: SF-BGA292B-B-11 Text: D Package Code: BGA292B C 22.86mm [0.900"] 0.71mm [0.028"] See BGA pattern code to the right for actual pattern layout Y 0.58mm [0.023"] X 22.86mm [0.900"] Top View reference only 1.27mm [0.050"] 2 0.36mm [0.014"] dia. 0.71mm [0.028"] 5.33mm 3.74mm [0.147"]	Original	BGA292B FR4/G10 SF-BGA292B-B-11 BGA292	PDF

BGA292 Abstract: BGA-292 Text: Philips Semiconductors Package outlines BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm 1998 May 06 1 SOT489-1	Original	BGA292: OT489-1 BGA292 BGA-292	PDF
Untitled Abstract: No abstract text available Text: Package outline BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm SOT489-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 b 1/2 e e ∅v M C A B y y1 C ∅w M C Y W V U T R P N M L K J H G F E D C B A e e2 1/2 e shape optional 4x	Original	BGA292: OT489-1 MS-034	PDF
Untitled Abstract: No abstract text available Text: Package outline BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.55 mm D SOT881-1 B A D1 ball A1 index area A A2 A1 E1 E detail X C e1 e Y V W T P M K H F D B ∅v ∅w b 1/2 e e U R N L e2 J 1/2 e G E C A shape optional 4x 1 2 3 4 5	Original	BGA292: OT881-1 MS-034	PDF
VDD18 Abstract: CLK48 Text: MN103E010HRA, MN103E040HYB Type MN103E010HRA MN103E040HYB Instruction Cache 16 K-byte 4-way, set-associative Data Cashe 16 K-byte (4-way, set-associative) SRAM Used by Both Instructions and Data Package 16 K-byte BGA292-P-2727 Lead-free FLGA424-C-1717 Lead-free	Original	MN103E010HRA, MN103E040HYB MN103E010HRA BGA292-P-2727 FLGA424-C-1717 16/24/32-bit 16-bit timerSA27 VDD33 VDD18 CLK48	PDF
SAMSUNG MCP Abstract: ECH information KBB0xB400M BA102 ba4901 UtRAM Density BA5101 samsung NAND memory BGA180 ba30 transistor Text: Preliminary MCP MEMORY KBB0xB400M Document Title Multi-Chip Package MEMORY 64M Bit 8M x8/4M x16 Dual Bank NOR Flash *2 / 256M Bit (16Mx16) NAND Flash / 64M Bit (4Mx16) UtRAM Revision History Revision No. History 0.0 Initial Draft (64M NOR Flash M-die_rev1.1)	Original	KBB0xB400M 16Mx16) 4Mx16) 80-Ball 80x12 SAMSUNG MCP ECH information KBB0xB400M BA102 ba4901 UtRAM Density BA5101 samsung NAND memory BGA180 ba30 transistor	PDF
Untitled Abstract: No abstract text available Text: K8D6x16UTM / K8D6x16UBM FLASH MEMORY Document Title 64M Bit 8M x8/4M x16 Dual Bank NOR Flash Memory Revision History Revision No. History Draft Date Remark 0.0 Initial Draft January 10, 2002 Preliminary 1.0 Final Specification May 22, 2002 Final 1.1 Revised	Original	K8D6x16UTM K8D6x16UBM 48TSOP1 16M/16M 08MAX	PDF
BGA292 Abstract: RGMII to SGMII RJ45 1000M PHY Text: DP83864 DP83864 Quad GigPHYTER 10/100/1000 Ethernet Physical Layer Literature Number: SNLS172B September 2003 DP83864 Quad GigPHYTER 10/100/1000 Ethernet Physical Layer General Description Features bs ol e te The DP83864 is an extremely efficient full featured Quad • IEEE compliant 10BASE-T,100BASE-TX, 1000BASE-T	Original	DP83864 DP83864 SNLS172B 10BASE-T 100BASE-TX, 1000BASE-T 10BASE-T, BGA292 RGMII to SGMII RJ45 1000M PHY	PDF
Nexus S JTAG pins Abstract: mPC5746m Nexus S camera Text: Freescale Semiconductor Application Note Document Number: AN4566 Rev 1, 05/2013 MPC5746M Hardware Design Guide by: Martin Vaupel and David McMenamin Contents 1 Introduction 1 The MPC5746M is a multi-core 32-bit microcontroller	Original	AN4566 MPC5746M 32-bit e200z4 200MHz. Nexus S JTAG pins Nexus S camera	PDF
Untitled Abstract: No abstract text available Text: BGA, HBGA, LFBGA & TFBGA FOOTPRINT REFLOW SOLDERING Philips Semiconductors F Prow ∅C Pball G Prow Pball MBL179 Reflow soldering(1) FOOTPRINT DIMENSIONS (mm) Prow Pball dia C F G PLACEMENT ACCURACY BGA156 SOT472-1 1.00 1.00 0.50 0.45 15.30 15.30 ±0.10	Original	MBL179 BGA156 OT472-1 BGA256 OT466-1 OT471-1 BGA292 OT489-1 BGA316	PDF
A4H1 Abstract: HD6417750RBG240 264-PIN BSC COMPUTER SCIENCE digital logic design Notes Transistor mcr 22-8 413 REJ10B0210-0400 A5H1 zo 607 HD6417750RBP240V Tag 225 600 replacement Text: REJ09B0366-0700 The revision list can be viewed directly by clicking the title page. The revision list summarizes the locations of revisions and additions. Details should always be checked by referring to the relevant text. SH7750, SH7750S, SH7750R Group 32	Original	REJ09B0366-0700 SH7750, SH7750S, SH7750R 32-Bit Family/SH7750 A4H1 HD6417750RBG240 264-PIN BSC COMPUTER SCIENCE digital logic design Notes Transistor mcr 22-8 413 REJ10B0210-0400 A5H1 zo 607 HD6417750RBP240V Tag 225 600 replacement	PDF

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BGA29 Search Results

BGA29 Price and Stock

Fischer Elektronik GmbH & Co KG ICK BGA 29 X 29 X 10

Fischer Elektronik GmbH & Co KG ICK BGA 29 X 29 X 6

TE Connectivity 85BSD-001BG-A2956

Fischer Elektronik GmbH & Co KG ICK BGA 29X29X10

BGA29 Datasheets (1)

BGA29 Datasheets Context Search

MD-001A

JEDEC TRAY DIMENSIONS

0.3mm pitch BGA

P-BGA-292

C BGA292

BGA-292

SF-BGA292A-B-11

SD2608

PRBG0297FA-A

sd2608

jedec bga tray

SF-BGA296A-B-11

MO-151

BGA292

BGA292

Untitled

Untitled

VDD18

SAMSUNG MCP

Untitled

BGA292

Nexus S JTAG pins

Untitled

A4H1