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    FTDI Chip US232B-LC-BLISTER

    CABLE USB RS232 10CM
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    DigiKey US232B-LC-BLISTER Tray
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    FTDI Chip US232R-10-BLISTER

    USB TO RS232 SERIAL PREMIUM CABL
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    FTDI Chip US232R-100-BLISTER

    USB TO RS232 SERIAL PREMIUM CABL
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    FTDI Chip US232B-100-BLISTER

    USB TO RS232 SERIAL CABLE
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    RS US232B-100-BLISTER Bulk 10
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    LEM Holdings SSA LTS-6-NP-BLISTER-3P

    CURRENT TRANSDUCER 6A
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    DigiKey LTS-6-NP-BLISTER-3P Tray
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    BLISTER Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    PX0911

    Abstract: copper alloy crimp Flex pcb spec UL94V-HB
    Text: Never Beaten by Seasons Buccaneer For Power Frozen Winters! Torrential Springs! Blistering Summers! Dusty Autumns! The Buccaneer range of IP68 waterproof connectors for power applications up to 32A, 600V. elektron components A trading name of the Elektron Components Ltd


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    PowerBuccMailer-2008 24AWG 32mm2, 22AWG 18AWG PX0911 copper alloy crimp Flex pcb spec UL94V-HB PDF

    WICKMANN FUSE 195

    Abstract: code 14 16
    Text: S URFACE MOUNT FUSES WICKMANN SMQ / No. 417/418 UL 248-14, 125V 125V, F Specifications Time-Current Characteristic Packaging Quick Acting F 000: Blister Tape (1000 pcs.) Standard Materials UL 248-14 CSA C22.2 No. 248.14 Housing: Element: Terminals: Approvals


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    days-95% Res404) WICKMANN FUSE 195 code 14 16 PDF

    Untitled

    Abstract: No abstract text available
    Text: SOT538A CDIP2; blister pack; standard product orientation 12NC ending 112 Rev. 1 — 29 November 2012 Packing information 1. Packing method Blister cover ESD Label Foam Blister bottom ESD Label Printed plano box Space for additional label Preprinted ESD warning


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    OT538A msc071 OT538A PDF

    B78304-B1144-A3

    Abstract: B1144 B1145 B78304-B1145-A3 B78304B1144A3
    Text: ISDN Transformers S2M Interface B78304-B1144-A3 B78304-B1145-A3 Construction ● E 6,3 ferrite core ● Plastic case ● 6 gullwing terminals Features ● Complies with CCITT G.703 ● Use in PBX and NT ● Matched to coaxial 75 Ω lines Packing ● 16-mm blister tape


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    B78304-B1144-A3 B78304-B1145-A3 16-mm B78304-B1144-A3: B78304-B1145-A3: B78304-B1144-A304-B1144-A3 B78304-B1144-A3 B1144 B1145 B78304-B1145-A3 B78304B1144A3 PDF

    E201431

    Abstract: SMD1210
    Text: P OL OLYFUSE YFUSE WICKMANN SMD1210 / No. 728 Surface Mount, 6V/13.2V/30V Specifications Approvals Packaging cULus Recognized: File No. E201431 TÜV: File No. R9956421 00: Blister Tape Qty.: see table below Materials Features Terminals: Plating: Low voltage overcurrent protection


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    SMD1210 V/30V E201431 R9956421 E201431 PDF

    smd capacitors marking

    Abstract: smd electrolytic capacitors marking polarized smd capacitors
    Text: ALUMINUM CAPACITORS KEY BENEFITS • Solderable under “lead Pb -free” soldering conditions • RoHS compliant • Long useful life: 2000 to 3000 hours at 105 °C • Supplied in blister tape on reel APPLICATIONS w w w. v i s h a y. c o m • Filtering


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    23-Jun-05 VMN-PT9165-0508 smd capacitors marking smd electrolytic capacitors marking polarized smd capacitors PDF

    self tapping screws

    Abstract: MATERIAL ABS UL94HB
    Text: Enclosures datasheet:Layout 1 2/9/10 16:00 Page 1 Never Beaten by Seasons BE Enclosures Frozen Winters! Torrential Springs! Blistering Summers! Dusty Autumns! A trading name of the Elektron Components Ltd Enclosures datasheet:Layout 1 2/9/10 16:02 Page 2 SIZE 1 ENCLOSURE


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    BEA01S BEP01S UL94HB UL94V-0 BEA02SGT0 self tapping screws MATERIAL ABS UL94HB PDF

    Untitled

    Abstract: No abstract text available
    Text: 23A T1 SO SOT123A CRFM4; blister pack packing method; standard product orientation 12NC ending 112 Rev. 1 — 11 October 2012 Packing information 1. Packing method Blister cover ESD Label Foam Blister bottom ESD Label Printed plano box Space for additional label


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    OT123A msc071 OT123A PDF

    Untitled

    Abstract: No abstract text available
    Text: SOT171A CDFM6; blister pack; standard product orientation 12NC ending 112 Rev. 1 — 18 October 2012 Packing information 1. Packing method Blister cover ESD Label Foam Blister bottom ESD Label Printed plano box Space for additional label Preprinted ESD warning


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    OT171A msc071 OT171A PDF

    Untitled

    Abstract: No abstract text available
    Text: SOT119A CDFM6; blister pack packing method; standard product orientation 12NC ending 112 Rev. 1 — 1 October 2012 Packing information 1. Packing method Blister cover ESD Label Foam Blister bottom ESD Label Printed plano box Space for additional label Preprinted ESD warning


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    OT119A msc071 liabili12NC OT119A PDF

    wickmann

    Abstract: wickmann 370
    Text: OBERFLÄCHENMONTIERBARE SICHERUNGEN SMQ / Nr. 420 WICKMANN UL 248-14, 125V 125V, T Spezifikationen Zeit-Strom Charakteristik Verpackung Träge T 000: Blistergurt (1000 St.) Standard Materialien UL 248-14 CSA C22.2 Nr. 248.14 Gehäuse: Keramik Schmelzleiter: Draht


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    relat52 wickmann wickmann 370 PDF

    500mA 2410 FUSE

    Abstract: fuse marking
    Text: SURF ACE MOUNT FUSES URFACE WICKMANN 6125 / No. 446 IEC 60127-4, 63V 63V, T Specifications Time-Current Characteristic Packaging Time Lag T 000: Blister Tape (3000 pcs.) Standard Materials IEC 60127-4 (UMF) Housing: Element: Terminals: Approvals VDE: License No. 107794


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    PDF

    diode marking code 7-7-7-7

    Abstract: smq 450 150
    Text: SURFACE MOUNT FUSES WICKMANN SMQ / No. 420 UL 248-14, 125V 125V, T Specifications Time-Current Characteristic Packaging Time Lag T 000: Blister Tape (1000 pcs.) 010: Blister Tape (5000 pcs.) Standard Materials UL 248-14 CSA C22.2 No. 248.14 Housing: Element:


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    PDF

    DTS1005

    Abstract: No abstract text available
    Text: D A T A S H E E T CERLED SMD Chip LED High Power Output SR 10 UR-B ultra red Description Features and Benefits The solder pads provide an excellent heat sink. Ideal for sensor applications. Small true Chip - LED to build custom configurations. Available on special order in 8 mm blister


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    SR10UR) DTS1005 DTS1005 PDF

    toshiba a10 motherboard

    Abstract: P16R8 TC59S1608AFT-10 Toshiba Motherboard GAL16LV8D GAL16LV8D-3LJ MC952 MOTOROLA LSC
    Text: Interfacing SDRAMs to Pentium Processors with 3.3V GAL Devices Introduction Design Implementation The blistering speed of today’s leading-edge microprocessors necessitates the use of new memory and logic technologies. To keep up with the operating frequencies


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    P54C-100/66 toshiba a10 motherboard P16R8 TC59S1608AFT-10 Toshiba Motherboard GAL16LV8D GAL16LV8D-3LJ MC952 MOTOROLA LSC PDF

    PerkinElmer Optoelectronics

    Abstract: diode Sr DTS1005
    Text: D A T A S H E E T CERLED SMD Chip Detector Photo Pin Diode SR 10 DE Description Features and Benefits The solder pads provide an excellent heat sink. On special request also available with daylight filter SR10DE-DLF . Ideal for sensor applications. Available on special order in 8 mm blister


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    SR10DE-DLF) SR10DE-B) DTS1005 PerkinElmer Optoelectronics diode Sr DTS1005 PDF

    Untitled

    Abstract: No abstract text available
    Text: ISDN Transformers B78504-A1437-A3 S2M Interface B78504-A1438-A3 7,8 max Application • Use in PBX and NT ■ Matched to the following ICs, e.g. PEB/PSB 22554 9,8 13,8 Feature ■ Complies with CCITT G.703 Packing 1 7 2 6 3 5 2,54 8 10,3 max ■ 24-mm blister tape


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    B78504-A1437-A3 B78504-A1438-A3 24-mm FIN0102-Q FIN0103-Y PDF

    Untitled

    Abstract: No abstract text available
    Text: ISDN Transformers B78504-A1439-A3 S2M Interface 7,8 max Application • Use in PBX and NT ■ Matched to the following ICs, e.g. PEB/PSB 2254 and 2255 9,8 13,8 Feature ■ Complies with CCITT G.703 Packing 1 7 2 6 3 5 2,54 8 10,3 max ■ 24-mm blister tape


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    B78504-A1439-A3 24-mm FIN0103-Y FIN0104-9 PDF

    s08b

    Abstract: No abstract text available
    Text: Temic S e m i c o n d u c t o r s Tape and Reel Standards Taping of SMT Devices T E M IC 's Transistors in SM D packages are available in an antistatic 8 m m blister tape in accordance w ith DIN IEC 2 6 8 -3 lo r autom atic com ponent insertion. The blister tape is a plastic strip w ith im pressed com ponent


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    13-Mar-97 s08b PDF

    B82432-A1224-K

    Abstract: 6690 AS B82432A1224K B82432-A1274-K siemens 90 98
    Text: SMO EMI Suppression Chokes HF choke» for surface mounting Chip inductors SIMID 03 With flame-retardant encapsulation Suitable for all soldering methods Tape packaging in accordance with IEC 2 8 6 -3 ,12-mm blister tape Rated inductance 1 . 1000 ¡j H Bated current


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    12-mm B82432-A1 B8243 B82432-A1224-K B82432-A1274-K B82432-A1334-K B82432-AH744Í 2432-A1824-K B62432-A11Q5-K 6690 AS B82432A1224K B82432-A1274-K siemens 90 98 PDF

    TCN32-8

    Abstract: TCN32-4 YCN164 YCN16 YCN15 TCN-32 YCN-16
    Text: Verpackung von SMD-Produkten DIN-IEC 286-3 Packaging of SMD products IEC 286-3 T1 T 2 Papiergurt I Paper Tape Blistergurt I Blister Tape w E ' ! 8.0- 1 .7 5 " 3 .5 ±005 0 .3 max 1 .7 5 t001 3 .5 l0,0s — 0 .4 5 " 1 ,7 5 ±00! ^ 3 .5 1005 — 0 .6 " 1 ,7 5 ±0C!


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    65max YCN15; YCN16-4 TCN32-8 TCN32 TCN32-4 YCN164 YCN16 YCN15 TCN-32 YCN-16 PDF

    Siemens ceramic Capacitors

    Abstract: No abstract text available
    Text: SMD Multilayer Ceramic Capacitors Chip capacitors Z5U Silver-nickel-tin terminations Tape packaging in acc. with IEC 286-3, up to size 1210 in 8-mm blister lape. sizes 1812 and 2220 in 12-mm blister tape Z5U (Y5U) 25 Vdc, 50 Vdc 30/085/56 + 227-56 % Ceramic material


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    12-mm B37942; B37954; Siemens ceramic Capacitors PDF

    Untitled

    Abstract: No abstract text available
    Text: SIZE CKTS TOOLED | 85510-0003 8 8 00 LU >- 855 10-0020 8 8 00 BLISTER ON LU >REEL 13" 85510-0028 8 8 85510-0005 6 6 85510-0019 6 6 85510-0027 6 6 85510-0013 6 4 o 85510-0018 6 4 o BLISTER ON REEL 13" 85510-0026 6 4 uo BLISTER ON LU >REEL 22" 85510-0007 4 4


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    SDA-85510 PDF

    Untitled

    Abstract: No abstract text available
    Text: .100" X . 100" Preassembled Wiremount Socket .050" Pitch Cable Optional Plastic Strain Relief 891 Series • Fiber-free PVC blister packages of 50 • Preassembled, terminates faster than two-piece sockets • “ Sword” with red stripe indicating pin one,


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    TS-0449-14 891XX-0XXXXX 3448-891XX TS-0496. PDF