Untitled
Abstract: No abstract text available
Text: 5 3 1 2 4 Global Connector Technology Ltd. - SIM8050: Nano SIM Card Connector, Push-Pull Type, 6 Pin, SMT, Profile 1.45mm 6 7 8 A A B B C C D D Specification 规格: Material 物料规格: Plastic Housing 塑胶外壳: LCP 30%GF, UL94V-0, Black 黑色 Contact Terminal 接触端子 : Phosphor Bronze 磷青铜 C5191R-EH ,
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SIM8050:
UL94V-0,
C5191R-EH
SUS301-H
5000cycles
130grams)
SIM8050
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Untitled
Abstract: No abstract text available
Text: KEY Housing: Polycarbonate, UL 94V-2 rated 22.50 Contact Material: High Strength Copper Alloy JIS C5191R-H 21.43 Contact Plating: 3.34 6.06 11.66 pin 1 1000 Series: Gold Flash over 100u" Nickel Underplate 5000 Series: 50u" Gold over 100u" Nickel, Complies with FCC Requirements
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C5191R-H
MP88X-1000K
MP88X-5000K
LR78160
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Untitled
Abstract: No abstract text available
Text: Housing: Polycarbonate, UL 94V-2 rated 1.40 2.40 10 6.60±0.50 0.50 0.80 Contact Material: High Strength Copper Alloy JIS C5191R-H Contact Plating: 1000 Series: Gold Flash over 100u" Nickel 3.25±0.12 10.20 11.68±0.05 6.10±0.07 1 4.60 Insulation Resistance:
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C5191R-H
MP1010RX-1000K
MP1010RX-5000K
LR78160
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C5191R-H
Abstract: No abstract text available
Text: Housing: Polycarbonate, UL 94V-2 rated Contact Material: High Strength Copper Alloy JIS C5191R-H 5 Contact Plating: 9.72±0.05 1000 Series: Gold Flash over 100u" Nickel Underplate 5000 Series: 50u" Gold over 100u" Nickel, Complies with FCC Requirements under No. 47 C.F.R. Part 68,
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C5191R-H
MPS64RX-5000S
MPS64RX-1000S
LR78160
C5191R-H
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C5191R-H
Abstract: No abstract text available
Text: 2 EAP-018-1TT03 Holder Pair Phosphorus Bronze C5191R-H 0.20mm thickness 1 1 HDR-4700-M01T OVERMOLD SUBASSEMBLY 1
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EAP-018-1TT03
HDR-4700-M01T
C5191R-H
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Untitled
Abstract: No abstract text available
Text: Housing: Polycarbonate, UL 94V-2 rated A Contact Material: High Strength Copper Alloy JIS C5191R-H Contact Plating: 11.65±0.05 1000 Series: Gold Flash over 100u" Nickel Underplate 5000 Series: 50u" Gold over 100u" Nickel, Complies with FCC Requirements under No. 47 C.F.R. Part 68,
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C5191R-H
MP88X-1000-A
MP88X-5000-A
LR78160
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Untitled
Abstract: No abstract text available
Text: 22.50 21.43 Housing: Polycarbonate, UL 94V-2 rated Contact Material: High Strength Copper Alloy JIS C5191R-H Contact Plating: 1000 Series: Gold Flash over 100u" Nickel Underplate 5000 Series: 50u" Gold over 100u" Nickel, Complies with FCC Requirements under No. 47 C.F.R. Part 68,
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C5191R-H
MP88RX-1000K
MP88RX-5000K
LR78160
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C5191R-EH
Abstract: C5210R
Text: 1 3 2 4 5 6 7 8 Global Connector Technology Ltd. - SIM3050 : SIM Card Connector, Retainer Type, 6 Pin, SMT, Profile 0.5mm A A B B C C Specification 规格: D D Material 物料规格 : Plastic Housing 塑胶外壳 :LCP 30%GF, UL94V-0, black 黑色 Contact Terminal 接触端子: Phosphor Bronze 磷青铜 C5191R-EH ,
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SIM3050
UL94V-0,
C5191R-EH
C5210R-EH,
overall50µ
5000cycles
5PCS1000PCS,
300MM
C5191R-EH
C5210R
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Untitled
Abstract: No abstract text available
Text: 22.50 21.43 Housing: Polycarbonate, UL 94V-2 rated Contact Material: High Strength Copper Alloy JIS C5191R-H Contact Plating: 1000 Series: Gold Flash over 100u" Nickel Underplate 5000 Series: 50u" Gold over 100u" Nickel, Complies with FCC Requirements under No. 47 C.F.R. Part 68,
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C5191R-H
MP88RX-1000S-K
MP88RX-5000S-K
LR78160
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Untitled
Abstract: No abstract text available
Text: o co co o 10- Materials and Finish 3 Housing: Polycarbonate, UL 94V-2 rated M- co o m o ö +i oo co s io c\| T— IO 05 ~1 hO Ö -H O o CN Contact Material: High Strength Copper Alloy JIS C5191R-H CD Contact Plating: 1000 Series: Gold Flash over 100u" Nickel
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OCR Scan
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MP1010RX-1000
MP1010RX-5000
C5191R-H
2002/95/EC
MP1010RX-X000
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10P10C
Abstract: 8P8C Plug
Text: MODULAR PLUG 1 MATERIAL: •H ousing: Polycarbonate. CL94V-2 ♦Contact: ]. High arcng:h copper alloy CJIS C5191R-H 2. Rating specification is tascd on 100 mkro inchcs nicrel under-plated and selective Gold p!afc in contact area. Gokl ‘Juckncss is acconling :o the
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C5191R-IO
S01JI)
10P10C.
10P10CS
10P10C
8P8C Plug
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C5191R-H
Abstract: No abstract text available
Text: File No. 3 9 7 I ISHEET 1 /1 M aterials : Housing : Nylon 46 30%GF UL 94V— 0 C o ntact : Phosphor Bronze, C5191R— H T =0.6m m + Electrode 2X CATEGORY APPROVED BY MEI A ùawoo Telecom co.,l t d L h t tp : / /d a w o o te le c o m .c o .k r PART N o. DRAWING No.
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OCR Scan
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C5191R-H
BH19RK
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CR2330
Abstract: BH22DK C5191R-H PBT 30
Text: 1 5 I File No. 3 9 7 I I SHEET o 1 / 1 SPECIFICATIONS Housing : PBT,30%GF,UL 9 4 V -0 Color : Block Contact : Phorphos Bronze,C5191R-H T = -0 .6 m m ,N i8 0 u ” Min.Or Tin 100 u’ Min.Over Ni. 50u” Min. Flash : 0.25m m Max. Cam ber : 0.13m m Max. Deformation : NA
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C5191R-H
Ni80u"
CR2330
BH22DK
CR2330
BH22DK
PBT 30
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C5191R-H
Abstract: No abstract text available
Text: o co co o Materials and Finish 3 Housing: Polycarbonate, UL 94V-2 rated 3.50 M- co o Contact Material: High Strength Copper Alloy JIS C5191R-H s io c\| T— IO Contact Plating: in co ai 05 o csi in in CN co 3 1000 Series: Gold Flash over 100u" Nickel Underplate
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OCR Scan
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C5191R-H
MP64RX-1000
MP64RX-5000
2002/95/EC
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Untitled
Abstract: No abstract text available
Text: 2 1 3 4 M aterial: A ♦Contact: P h o sp h o r B ron ze C5191R—H ♦Plating: Tin p late d co B C C 1.90 D SECTION A-A SECTION C -C SECTION B - B APPROVED BY: • GENERAL TOLERANCE 0.20 A .XX DWG REL. REV. ECO. NO. CHG APPD. PART NO.: 2034TPB0000 LE0C0 CORPORATION
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C5191R--
2034TPB0000
203401S
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starconn
Abstract: CN802
Text: COPY _l L 5Ì jlL 2l REV. ECN NO DATE B CN8022 06-15-98 C CN8084 10-27-’98 PIN NO. LENGTH 1*15 3.80 2 TO 14 2.90 22.80 20.80 17.80 MATERIAL : INSULATOR CONTACT SHIELDING CLIP POST HIGH TEMPERATURE NYLON +30% GLASS REINFORCED UL94 V -0 , BLACK PHOSPHOR BRONZE , C5191R-H
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CN8022
CN8084
C5191R-H
SUS301R-1/2H
800X14)
MCI-15BXX-BX1X
starconn
CN802
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Untitled
Abstract: No abstract text available
Text: o co co o Materials and Finish 3.50 3 Housing: Polycarbonate, UL 94V-2 rated CO o Contact Material: High Strength Copper Alloy JIS C5191R-H s 10 CM T~ LD <N CO IO CD 10 oi 05 Contact Plating: CO 1000 Series: Gold Flash over 10Ou" Nickel Underplate § 5000 Series:
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OCR Scan
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C5191R-H
MP66Rielectric
MP66RX-1000
MP66RX-5000
2002/95/EC
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Untitled
Abstract: No abstract text available
Text: o co co o 2 1 .4 5 - M aterials and Finish 3 Housing: Polycarbonate, UL 94V-2 rated CO o co Contact Material: High Strength Copper Alloy JIS C5191R-H d Contact Plating: s 00 10 CM T~ 10 05 (O co co o 1000 Series: Gold Flash over 10Ou" Nickel Underplate ir
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OCR Scan
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C5191R-H
MPS88RX-1000S
MPS88RX-5000S
2002/95/EC
LR78160
MPS88RX-xxxxS
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Neltron
Abstract: C5191R-H Neltron Industrial Co
Text: , .a 3.00 / f l.M W :P Ü C5191R-H,T=0.30± 0.01mm 2.7^iË R ^ :0.15mm 3.^S:0.05m m Max. 13571000mm Max. 5.SB[ËI:5mm/100Qmm Max. 6.BJ^:5mm/1000mm Max. 7.*ffi:Jgffit*50u" M in .3:« |§100u"Min. 0.05 Ma X . 4. bo SEC B -B DETAIL G SCALE 3 CL o a: DRAWN: TED TUNG
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C5191R-H
13571000mm
5mm/1000mm
2650TS
Neltron
Neltron Industrial Co
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Untitled
Abstract: No abstract text available
Text: -62.3±0.30-50.9±0.20- LO CD CD IO CD ro -57.46- à li. -0.635±0.05TYPE -1.27±0.05TYPE 50.98- £ -8.36 MATERIAL: 1.HOUSING! PBT+30 ZG.F.CUL 9 4 V -0 2.TERMINALiPhosphor Bronze,C5191R-H T=0.300,01nn 3.TETMINAL PLATEDiGOLD FLASH DN CONTACTj 100u' MIN NICKEL OVERALL.
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05TYPE
C5191R-H
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30376
Abstract: Foxconn Precision Co 94V-Q 30AWC
Text: REV. X4 PIN 1 PIN 8 ECN. NO. ^PPD. HC99XXX> TE ]# «# ]] 999 \ If C1 C2 W IR E L I S T P A IR i J1 P A IR i J 2 11 J1 17 18 10 UL 94V-Q , 14 U A C K S C R E W _ 4 _ 060-0001- 538 FREE CUT BDTTDM S H I E L D _ 8 _ 086-0001- 308 C5191R-H,
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HC99XXX>
28AWG
30AWC
28AW0
C5191R-H,
C3680R-H,
30376
Foxconn Precision Co
94V-Q
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Untitled
Abstract: No abstract text available
Text: o co co o Materials and Finish 3 Housing: Polycarbonate, UL 94V-2 rated CO o Contact Material: High Strength Copper Alloy JIS C5191R-H s 10 oo co CM T~ CO 10 co o co Contact Plating: 05 1000 Series: Gold Flash over 10Ou" Nickel Underplate § 5000 Series: 50u" Gold over 100u" Nickel,
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OCR Scan
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MPS88RX-1000
PS88RX-5000
C5191R-H
2002/95/EC
LR78160
MPS88RX-xxxx
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Untitled
Abstract: No abstract text available
Text: o co co o Materials and Finish 3 Housing: Polycarbonate, UL 94V-2 rated M- co - 3.50 - o Contact Material: High Strength Copper Alloy JIS C5191R-H s io c\| T— IO Contact Plating: 05 3 LO CD o ai * c\j . n LO CSI o co CD 1000 Series: Gold Flash over 100u" Nickel
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PDF
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C5191R-H
MP62RX-1000
MP62RX-5000
2002/95/EC
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starconn
Abstract: No abstract text available
Text: COPY ,i 3 _tl 5Ì REV. ECN NO B DATE CN7046 10—22—’97 MATERIAL : V INSULATOR P.B.T.+30% GLASS REINFORCED , UL 94V-0 CONTACT PHOSPHOR BRONZE ,C5191R-H SHIELDING STAINLESS STEEL INSERT NYLON 6T+30% GLASS REINFORCED , UL 94V-0 PLATE NYLON 6T+30% GLASS REINFORCED , UL 94V-0
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OCR Scan
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CN7046
C5191R-H
MCI-15XNN-BNNX
E05920-2
starconn
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