C8D30DS2AA3 Search Results

IC 4435

Abstract: CI 4835 b 4435 ic CI 4835 d Ci 2035 C8D15DS29D1 G-80A hp 3760 C8D20DS29C2 C8D10DS29C2
Text: ThomasiBetts _ Cardedge Cantilever Beam-Dip Solder .100" CENTER-TO-CENTER .200" ROW-TO-ROW DIP SOLDER TAILS .300" CARD SLOT DEPTH TO LR49571 E60980 P h y s ic a l P r o p e r t ie s I n su latio n R e s is t a n c e : 5000 megohms minimum. I n ser tio n /W ith d r a w a l F o r c e D a u g h t e r C a r d :