Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    CAPACITANCE IN BGA PACKAGE Search Results

    CAPACITANCE IN BGA PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    CAPACITANCE IN BGA PACKAGE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    AN1001

    Abstract: application notes capacitor cross reference active and passive electronic components capacitance in BGA package capacitor package resistor resistor 220 ohm resistor 220 resistor cross reference
    Text: Application Note AN1001 ClearONE RC BGA Configuration Options Introduction The double-sided construction of the CTS ceramic Ball Grid Array BGA package allows the PC board designer to closely locate passive resistor and capacitor elements near the active signal sources and


    Original     		PDF AN1001 AN1001 application notes capacitor cross reference active and passive electronic components capacitance in BGA package capacitor package resistor resistor 220 ohm resistor 220 resistor cross reference

    IPC-D-317A

    Abstract: SN74V293 capacitance in BGA package SDMA002 IPC-D-317
    Text: Application Report SDMA002 - June 2001 Design Considerations of SN74V293 FIFO in a MicroSTAR BGA Package Gary Khazan and Andy Pauley Standard Linear & Logic ABSTRACT Texas Instruments’ near-chip-scale MicroSTAR BGA package is gaining in popularity for


    Original     		PDF SDMA002 SN74V293 IPC-D-317A capacitance in BGA package IPC-D-317

    C4 to BGA

    Abstract: MX23L1612 MX23L1612XI-70 MX23L1612XI-70G MX23L1612XI-90 MX23L1612XI-90G PM0815
    Text: MX23L1612 16M-BIT MASK ROM PIN DESCRIPTION FEATURES • Bit organization - 2M x 8 byte mode - 1M x 16 (word mode) • Fast access time - Random access:70ns(max.) • Current - Operating:25mA - Standby:5uA • Supply voltage - 2.7V ~ 3.6V • Package - 48 ball mini BGA (6mm x 8mm, ball pitch 0.8mm, ball


    Original     		PDF MX23L1612 16M-BIT D15/A-1 JUN/23/2003 C4 to BGA MX23L1612 MX23L1612XI-70 MX23L1612XI-70G MX23L1612XI-90 MX23L1612XI-90G PM0815

    SN74V293

    Abstract: No abstract text available
    Text: Application Report SDMA002A - April 2002 Design Considerations of SN74V293 FIFO in a MicroSTAR BGA Package Gary Khazan and Andy Pauley Standard Linear & Logic ABSTRACT Texas Instruments’ near-chip-scale MicroSTAR BGA package is gaining in popularity for


    Original     		PDF SDMA002A SN74V293

    Untitled

    Abstract: No abstract text available
    Text: MX23L1612 16M-BIT MASK ROM PIN DESCRIPTION FEATURES • Bit organization - 2M x 8 byte mode - 1M x 16 (word mode) • Fast access time - Random access:70ns(max.) • Current - Operating:25mA - Standby:5uA • Supply voltage - 2.7V ~ 3.6V • Package - 48 ball mini BGA (6mm x 8mm, ball pitch 0.8mm, ball


    Original     		PDF MX23L1612 16M-BIT D15/A-1 JUL/10/2001 JUL/16/2001 OCT/03/2001 MAR/12/2002 MAY/20/2002 JUN/23/2003

    coreless substrate

    Abstract: SDD11 coreless Coreless pcb transformer
    Text: DesignCon 2008 Study of Fundamental Limit and Packaging Technology Solutions for 40-Gbps Transceiver Package Design Hong Shi, Altera Corporation [[email protected]] Xiaohong Jiang, Altera Corporation John Xie, Altera Corporation CP-01038-1.0 February 2008 Abstract


    Original     		PDF 40-Gbps CP-01038-1 10-Gbps coreless substrate SDD11 coreless Coreless pcb transformer

    MX23L1

    Abstract: MX23L1613 MX23L1613TC-70 MX23L1613TC-90 MX23L1613TI-70 MX23L1613TI-90 TSOP 48 PIN C4 to BGA
    Text: MX23L1613 16M-BIT MASK ROM FEATURES PIN DESCRIPTION • Bit organization - 2M x 8 byte mode - 1M x 16 (word mode) • Fast access time - Random access:70ns(max.) • Current - Operating:25mA - Standby:5uA • Supply voltage - 2.7V ~ 3.6V • Package - 48 pin TSOP(12mm x 20mm)


    Original     		PDF MX23L1613 16M-BIT D15/A-1 APR/27/2000 JAN/18/2001 JUN/28/2001 JUL/16/2001 OCT/02/2001 MX23L1 MX23L1613 MX23L1613TC-70 MX23L1613TC-90 MX23L1613TI-70 MX23L1613TI-90 TSOP 48 PIN C4 to BGA

    Untitled

    Abstract: No abstract text available
    Text: MX23L1613 16M-BIT MASK ROM FEATURES PIN DESCRIPTION • Bit organization - 2M x 8 byte mode - 1M x 16 (word mode) • Fast access time - Random access:70ns(max.) • Current - Operating:25mA - Standby:5uA • Supply voltage - 2.7V ~ 3.6V • Package - 48 pin TSOP(12mm x 20mm)


    Original     		PDF MX23L1613 16M-BIT D15/A-1 APR/27/2000 JAN/18/2001 JUN/28/2001 JUL/16/2001 OCT/02/2001 NOV/22/2002 PM0620

    LV 1084 73

    Abstract: LV 373A BGA PACKAGE thermal profile LV 1084 land pattern for tvSOP 90 ball VFBGA micro pitch BGA VA244 VFBGA LVTH2245
    Text: Application Report SZZA028A - November 2001 8-Bit Linear and Logic Families in 20-Ball, 0.65-mm Pitch, Very-Thin, Fine-Pitch BGA VFBGA Packages Frank Mortan and Mark Frimann Standard Linear & Logic ABSTRACT Texas Instruments 20-ball MicroStar Jr. package is a standardized JEDEC VFBGA


    Original     		PDF SZZA028A 20-Ball, 65-mm 20-ball LV 1084 73 LV 373A BGA PACKAGE thermal profile LV 1084 land pattern for tvSOP 90 ball VFBGA micro pitch BGA VA244 VFBGA LVTH2245

    Turn-Key

    Abstract: Adapters Sockets Product Presentations Giga-snaP™ BGA SMT Adapters Receptacles Prototyping Adapters Surface Mount Package Emulation Probing and Analysis Adapters BGA Sockets
    Text:  RoHS ISO w i t h 900 d 08 20 i g n : 1 es Certified Table of Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . 2 Catalog 26 Receptacles . . . . . . . . . . . . . . . . . . . . . 22 Package Conversion For Production Applications . . . . 24-25


    Original     		PDF 75GHz 50-80grams Turn-Key Adapters Sockets Product Presentations Giga-snaP™ BGA SMT Adapters Receptacles Prototyping Adapters Surface Mount Package Emulation Probing and Analysis Adapters BGA Sockets

    MX23L8103

    Abstract: MX23L8103TI-12 MX23L8103TI-70 MX23L8103TI-90 MX23L8103XI-12 MX23L8103XI-70 MX23L8103XI-90
    Text: MX23L8103 8M-BIT MASK ROM FEATURES PIN DESCRIPTION • Bit organization - 1M x 8 byte mode - 512K x 16 (word mode) • Fast access time - Random access:70ns(max.) • Current - Operating:15mA - Standby:5uA • Supply voltage - 2.7V ~ 3.6V • Package - 48 pin TSOP(12mm x 20mm)


    Original     		PDF MX23L8103 D15/A-1 MAY/31/2000 JUL/06/2001 JUL/16/2001 SEP/28/2001 MX23L8103 MX23L8103TI-12 MX23L8103TI-70 MX23L8103TI-90 MX23L8103XI-12 MX23L8103XI-70 MX23L8103XI-90

    Untitled

    Abstract: No abstract text available
    Text: MX23L8103 8M-BIT MASK ROM FEATURES PIN DESCRIPTION • Bit organization - 1M x 8 byte mode - 512K x 16 (word mode) • Fast access time - Random access:70ns(max.) • Current - Operating:15mA - Standby:5uA • Supply voltage - 2.7V ~ 3.6V • Package - 48 pin TSOP(12mm x 20mm)


    Original     		PDF MX23L8103 D15/A-1 MAY/31/2000 JUL/06/2001 JUL/16/2001 SEP/28/2001 SEP/10/2002 PM0622

    GS8662QT19BGD-250I

    Abstract: GS8662QT07BD-200 Features GS8662QT07BD-333I GS8662QT07BGD-200I AN1021 variable speed drive block diagram
    Text: GS8662QT07/10/19/37BD-357/333/300/250/200 72Mb SigmaQuad-II+TM Burst of 2 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features • 2.0 Clock Latency • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package • Dual Double Data Rate interface


    Original     		PDF GS8662QT07/10/19/37BD-357/333/300/250/200 165-Bump 165-bump, GS8662QT37BGD-250I GS8662QT37BGD-200I GS8662QTxxBD-300T. GS8662QT19BGD-250I GS8662QT07BD-200 Features GS8662QT07BD-333I GS8662QT07BGD-200I AN1021 variable speed drive block diagram

    GS8662D10BGD-400

    Abstract: GS8662D10BGD-333 AN1021
    Text: GS8662D07/10/19/37BD-450/400/350/333/300 72Mb SigmaQuad-II+TM Burst of 4 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features • 2.0 Clock Latency • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package • Dual Double Data Rate interface


    Original     		PDF GS8662D07/10/19/37BD-450/400/350/333/300 165-Bump 165-bump, GS8662DxxD-300T. AN1021 GS8662D10BGD-400 GS8662D10BGD-333

    AN1021

    Abstract: No abstract text available
    Text: Preliminary GS8342D07/10/19/37BD-450/400/350/333/300 36Mb SigmaQuad-II+TM Burst of 4 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features • 2.0 Clock Latency • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package


    Original     		PDF GS8342D07/10/19/37BD-450/400/350/333/300 165-Bump 165-bump, GS8342D37BGD-300I GS8342DxxD-300T. AN1021

    MX23L3213

    Abstract: MX23L3213TC-12 MX23L3213TC-70 MX23L3213TC-90 MX23L3213TI-12 MX23L3213TI-70 MX23L3213TI-90 PM0716 Macronix MX23L
    Text: MX23L3213 32M-BIT MASK ROM FEATURES PIN DESCRIPTION • Bit organization - 4M x 8 byte mode - 2M x 16 (word mode) • Fast access time - Random access:70ns(max.) • Current - Operating:16mA - Standby:5uA • Supply voltage - 2.7V ~ 3.6V • Package - 48 pin TSOP (12mm x 20mm)


    Original     		PDF MX23L3213 32M-BIT D15/A-1 PM0716 JAN/04/2001 JUL/05/2001 JUL/16/2001 OCT/03/2001 MX23L3213 MX23L3213TC-12 MX23L3213TC-70 MX23L3213TC-90 MX23L3213TI-12 MX23L3213TI-70 MX23L3213TI-90 PM0716 Macronix MX23L

    Untitled

    Abstract: No abstract text available
    Text: GS8662DT07/10/19/37BD-450/400/350/333/300 72Mb SigmaQuad-II+TM Burst of 4 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features • 2.0 Clock Latency • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package • Dual Double Data Rate interface


    Original     		PDF GS8662DT07/10/19/37BD-450/400/350/333/300 165-Bump GS8662DT37BGD-333I GS8662DT37BGD-300I GS8662DTxxD-300T.

    Untitled

    Abstract: No abstract text available
    Text: GS8662QT07/10/19/37BD-357/333/300/250/200 72Mb SigmaQuad-II+TM Burst of 2 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features • 2.0 Clock Latency • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package • Dual Double Data Rate interface


    Original     		PDF GS8662QT07/10/19/37BD-357/333/300/250/200 165-Bump Bo300 GS8662QT37BGD-250I GS8662QT37BGD-200I GS8662QTxxBD-300T.

    GS8342Q10BD-357

    Abstract: GS8342Q37BD-200I 8342Q07101937B
    Text: GS8342Q07/10/19/37BD-357/333/300/250/200 36Mb SigmaQuad-II+TM Burst of 2 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features • 2.0 Clock Latency • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package • Dual Double Data Rate interface


    Original     		PDF GS8342Q07/10/19/37BD-357/333/300/250/200 165-Bump 165-bump, GS8342QxxBD-300T. GS8342Q10BD-357 GS8342Q37BD-200I 8342Q07101937B

    GS8342DT10BGD-350I

    Abstract: IR receiver TK 19 205
    Text: GS8342DT07/10/19/37BD-450/400/350/333/300 36Mb SigmaQuad-II+TM Burst of 4 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features • 2.0 Clock Latency • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package • Dual Double Data Rate interface


    Original     		PDF GS8342DT07/10/19/37BD-450/400/350/333/300 165-Bump 165-bump, GS8342DTxxBD-300T. GS8342DT10BGD-350I IR receiver TK 19 205

    Untitled

    Abstract: No abstract text available
    Text: Preliminary GS8342QT07/10/19/37BD-357/333/300/250/200 36Mb SigmaQuad-II+TM Burst of 2 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features • 2.0 Clock Latency • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package


    Original     		PDF GS8342QT07/10/19/37BD-357/333/300/250/200 165-Bump 165-bump, GS8342QTxxBD-300T.

    Untitled

    Abstract: No abstract text available
    Text: GS8342QT07/10/19/37BD-357/333/300/250/200 36Mb SigmaQuad-II+TM Burst of 2 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features • 2.0 Clock Latency • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package • Dual Double Data Rate interface


    Original     		PDF GS8342QT07/10/19/37BD-357/333/300/250/200 165-Bump GS8342QT37BGD-200I GS8342QTxxBD-300T.

    GS8342D19BGD-300

    Abstract: GS8342D10BD-350I GS8342D19BD-350I 8342D07101937B
    Text: GS8342D07/10/19/37BD-450/400/350/333/300 36Mb SigmaQuad-II+TM Burst of 4 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features • 2.0 Clock Latency • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package • Dual Double Data Rate interface


    Original     		PDF GS8342D07/10/19/37BD-450/400/350/333/300 165-Bump 165-bump, GS8342DxxD-300T. GS8342D19BGD-300 GS8342D10BD-350I GS8342D19BD-350I 8342D07101937B

    Untitled

    Abstract: No abstract text available
    Text: GS8662D07/10/19/37BD-450/400/350/333/300 72Mb SigmaQuad-II+TM Burst of 4 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features • 2.0 Clock Latency • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package • Dual Double Data Rate interface


    Original     		PDF GS8662D07/10/19/37BD-450/400/350/333/300 165-Bump GS8662DxxD-300T. AN1021