ceramic rework
Abstract: CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles
Text: Ceramic Ball Grid Array Packaging, Assembly & Reliability Freescale Semiconductor 1 Outline for Discussion • • • • • • Why BGA? CBGA Introduction and Package Description PC Board Design for CBGA CBGA Assembly Rework Board-Level Solder Joint Reliability
|
Original
|
PDF
|
25x25x1
ceramic rework
CCGA
BGA Solder Ball collapse
90Pb 10Sn solder paste
304-pin ltcc
MPC105
MPC106
MPC107
BGA PROFILING
spray nozzles
|
Die Attach epoxy stamping
Abstract: flotherm MODEL U.S.A Eurotherm Controls Eurotherm 461
Text: The Development of Component-level Thermal Compact Models of a C4/CBGA Interconnect Technology: The Motorola PowerPC 603 and PowerPC 604™ RISC Microprocessors 1 1 2 John Parry , Harvey Rosten and Gary B. Kromann 1 Flomerics Group plc 81 Bridge Road Hampton Court
|
Original
|
PDF
|
603TM
604TM
R14103
PowerPC603
PowerPC604
SPECint92/
SPECfp92
21x21
Die Attach epoxy stamping
flotherm MODEL
U.S.A Eurotherm Controls
Eurotherm 461
|
intercom phone system block diagram
Abstract: audio howling INTERCOM FULL-duplex Automatic Gain Control AGC Algorithm Users mic preamp with echo adaptive filter micro electret echo mic preamp c code for microphone noise canceller
Text: ZL38003 AEC with Noise Reduction & Codecs for Digital Hands-Free Communication Data Sheet Zarlink has introduced a new generation family of AEC ZL38002 and ZL38004 . Zarlink recommends these products for new designs. May 2007 Ordering Information ZL38003GMG 81 Ball CBGA Trays, Bake & Drypack
|
Original
|
PDF
|
ZL38003
ZL38002
ZL38004)
ZL38003GMG
ZL38003GMG2
intercom phone system block diagram
audio howling
INTERCOM FULL-duplex
Automatic Gain Control AGC Algorithm Users
mic preamp with echo
adaptive filter
micro electret
echo mic preamp
c code for microphone
noise canceller
|
P6434
Abstract: LA-BGA-MPC7445-Z-B-01 MPC7445 TLA700 ST 0366 mictor
Text: Page 1 of 3 3.100" [78.74mm] Description: Logic Analyzer Adaptor for Motorola MPC7445 and TEKTRONIX TLA700 Series Logic Analyzer 360 position CBGA surface mount lands to 360 position surface mount BGA foot with high density Mictor connectors with latch housing for connection of Tektronix P6434 probes . Pin assignment
|
Original
|
PDF
|
MPC7445
TLA700
P6434
LA-BGA-MPC7445-Z-B-01
FR4/G10
ST 0366
mictor
|
intercom phone system block diagram
Abstract: Intercom hands free audio howling mic preamp with echo ZL38004 Application of Intercom MT93L16 ZL38001 ZL38003 ZL38003GMG
Text: ZL38003 AEC with Noise Reduction & Codecs for Digital Hands-Free Communication Data Sheet Zarlink has introduced a new generation family of AEC ZL38002 and ZL38004 . Zarlink recommends these products for new designs. May 2007 Ordering Information ZL38003GMG 81 Ball CBGA Trays, Bake & Drypack
|
Original
|
PDF
|
ZL38003
ZL38002
ZL38004)
ZL38003GMG
ZL38003GMG2
intercom phone system block diagram
Intercom hands free
audio howling
mic preamp with echo
ZL38004
Application of Intercom
MT93L16
ZL38001
ZL38003
|
micro electret
Abstract: echo mic preamp Intercom hands free intercom phone system block diagram Analog ECHO microphone electret mic mic preamp with echo MT93L16 ZL38001 ZL38002
Text: ZL38003 AEC with Noise Reduction & Codecs for Digital Hands-Free Communication Data Sheet A full Design Manual is available to qualified customers. To register, please send an email to [email protected]. May 2006 Ordering Information ZL38003GMG 81 Ball CBGA Trays, Bake & Drypack
|
Original
|
PDF
|
ZL38003
ZL38003GMG
ZL38003GMG2
16-bit
micro electret
echo mic preamp
Intercom hands free
intercom phone system block diagram
Analog ECHO microphone
electret mic
mic preamp with echo
MT93L16
ZL38001
ZL38002
|
TMS 320 C 6X processor
Abstract: 2164A PC745 PC755M8 2164A dynamic ram cop interface l2-dp
Text: Features • • • • • • PC755M8 RISC Miprocessor Dedicated 1-megabyte SSRAM L2 Cache, Configured as 128K x 72 21 mm x 25 mm, 255 Ceramic Ball Grid Array CBGA Maximum Core Frequency = 300 MHz Maximum L2 Cache Frequency = 150 MHz Maximum 60x Bus Frequency = 66 MHz
|
Original
|
PDF
|
PC755M8
TMS 320 C 6X processor
2164A
PC745
2164A dynamic ram
cop interface
l2-dp
|
S1998
Abstract: Coffin-Manson Equation CBGA manson 100C 110C N100 N50M IBM supports ccga CBGA 304 motorola
Text: CBGA FATIGUE LIFE IMPROVEMENT Marie S. Cole, Gregory B. Martin, Peter J. Brofman and Lewis S. Goldmann IBM Microelectronics Hopewell Jct, New York 12533 Biography Marie Cole is a Senior Engineer in Ceramic Packaging Applications at IBM Microelectronics. She holds a B.S.
|
Original
|
PDF
|
|
TMS 320 C 6X processor
Abstract: No abstract text available
Text: PC755BM8 RISC Microprocessor Multichip Package Datasheet - Preliminary Specification Features • • • • • • PC755BM8 RISC Miprocessor Dedicated 1-megabyte SSRAM L2 Cache, Configured as 128K x 72 21 mm x 25 mm, 255 Ceramic Ball Grid Array CBGA Maximum Core Frequency = 350 MHz
|
Original
|
PDF
|
PC755BM8
PC755BM8
complianc49
0882D
TMS 320 C 6X processor
|
7448
Abstract: 7448 datasheet "hard drive" pcb Mictor 48-Z-B-01 P6434 MPC7447
Text: Page 1 of 3 3.100" [78.74mm] Top View 2.800" [71.12mm] Description: Logic Analyzer Adaptor for Motorola MPC7447/7448 and TEKTRONIX TMS546 Series Logic Analyzer 360 position CBGA surface mount lands to 360 position surface mount BGA foot with high density Mictor connectors with latch housing for connection of Tektronix P6434 probes . Pin assignment
|
Original
|
PDF
|
MPC7447/7448
TMS546
P6434
TMS546
LA-BGA-MPC7447/48-Z-B-01
FR4/G10
7448
7448 datasheet
"hard drive" pcb
Mictor
48-Z-B-01
MPC7447
|
PC755BM8
Abstract: MCP 67 MV PC745 PC755M8 PCX755B
Text: Features • • • • • • PC755BM8 RISC Miprocessor Dedicated 1-megabyte SSRAM L2 Cache, Configured as 128K x 72 21 mm x 25 mm, 255 Ceramic Ball Grid Array CBGA Maximum Core Frequency = 350 MHz Maximum L2 Cache Frequency = 175 MHz Maximum 60x Bus Frequency = 66 MHz
|
Original
|
PDF
|
PC755BM8
PC755BM8
2164C
MCP 67 MV
PC745
PC755M8
PCX755B
|
cop interface
Abstract: PC745 PC755M8 PLL VCO MIL-PRF-38535 X755M
Text: Features • • • • • • PC755M8 RISC Miprocessor Dedicated 1-megabyte SSRAM L2 Cache, Configured as 128K x 72 21 mm x 25 mm, 255 Ceramic Ball Grid Array CBGA Maximum Core Frequency = 350 MHz Maximum L2 Cache Frequency = 175 MHz Maximum 60x Bus Frequency = 66 MHz
|
Original
|
PDF
|
PC755M8
2164B
cop interface
PC745
PLL VCO MIL-PRF-38535
X755M
|
PC745
Abstract: PC755M8 PCX755B
Text: Features • • • • • • PC755M8 RISC Miprocessor Dedicated 1-megabyte SSRAM L2 Cache, Configured as 128K x 72 21 mm x 25 mm, 255 Ceramic Ball Grid Array CBGA Maximum Core Frequency = 350 MHz Maximum L2 Cache Frequency = 175 MHz Maximum 60x Bus Frequency = 66 MHz
|
Original
|
PDF
|
PC755M8
2164C
PC745
PCX755B
|
S4804
Abstract: hdlc GR-253 STM-16 STS-48 AU4A
Text: Part Number - S4804 Revision 1.2 - July 2000 RHINE ADVANCED SUMMARY DATASHEET STS-48 POS/ATM SONET MAPPER Features • Provides a SONET/SDH STS-48/STM-16, 4 STS-12/STM4, or 16 STS-3/STM-1 line interfaces. • Packaged in a 624 Pin CBGA. The S4804 is a highly-integrated VLSI device that provides
|
Original
|
PDF
|
S4804
STS-48
STS-48/STM-16,
STS-12/STM4,
S4804
STS-48/STM-16
STS-48c/
AU-4-16c,
STS-12c/AU-4-4c
hdlc
GR-253
STM-16
AU4A
|
|
|
62Sn36Pb2Ag
Abstract: 90Pb10Sn CBGA 255 motorola 480 PBGA pad recommendations Solder Balls 63Sn37Pb cte table epoxy substrate motorola pbga 302
Text: Freescale Semiconductor, Inc. Order Number: AN1850/D Rev. 0, 5/2000 Freescale Semiconductor, Inc. Freescale Semiconductor Application Note Flip-Chip PBGA Package ConstructionÑ Assembly and Board-Level Reliability Motorola introduced the ßip-chip plastic ball grid array FC PBGA packages as an alternative to, and in
|
Original
|
PDF
|
AN1850/D
62Sn36Pb2Ag
90Pb10Sn
CBGA 255 motorola
480 PBGA pad recommendations
Solder Balls
63Sn37Pb
cte table epoxy substrate
motorola pbga 302
|
CBGA 255 motorola
Abstract: 90Pb10Sn cte table epoxy BGA cte pbga package weight cte table epoxy substrate AN-1850 360-Pin
Text: Freescale Semiconductor, Inc. Order Number: AN1850/D Rev. 0, 5/2000 Freescale Semiconductor, Inc. Semiconductor Products Sector Application Note Flip-Chip PBGA Package ConstructionÑ Assembly and Board-Level Reliability Motorola introduced the ßip-chip plastic ball grid array FC PBGA packages as an alternative to, and in
|
Original
|
PDF
|
AN1850/D
CBGA 255 motorola
90Pb10Sn
cte table epoxy
BGA cte
pbga package weight
cte table epoxy substrate
AN-1850
360-Pin
|
CQFP 240
Abstract: MIPs datasheet
Text: Motorola PowerPC CPU Summary revised 05-18-98 EC603e 100-133 MHz 603e 166-200 MHz 166-300 MHz 100 MHz 133 MHz 166 MHz 200 MHz 166 MHz 200 MHz 233 MHz 266 MHz 300 MHz x1.5, x2, x2.5, x3, x3.5, x4 x2, x2.5, x3, x3.5, x4, x4.5, x5, x5.5, x6 Bus Interface 64- & 32-bit
|
Original
|
PDF
|
EC603e
32-bit
SPECfp95
CQFP 240
MIPs datasheet
|
CBGA
Abstract: No abstract text available
Text: 1.5 Pin Assignments Motorola and IBM both offer a ceramic bail grid array CBGA package. Both IBM and Motorola CBGA packages have identical pinouts. Figure 9 (in part A) shows the pinout o f the CBGA package as viewed from the top surface. Part B shows the side profile of the CBGA package to indicate the direction of the top
|
OCR Scan
|
PDF
|
PID9q-604e
CBGA
|
CBGA
Abstract: No abstract text available
Text: 1.5 Pin Assignments Motorola and IBM both offer a ceramic ball grid array CBGA package. Both IBM and Motorola CBGA packages have identical pinouts. Figure 9 (in part A) shows the pinout of the CBGA package as viewed from the top surface. Part B shows the side profile of the CBGA package to indicate the direction of the top
|
OCR Scan
|
PDF
|
PID9q-604e
CBGA
|
PowerPC-604e
Abstract: microprocessor pin
Text: 1.5 PowerPC 604e Microprocessor Pin Assignments The following sections contain the pinout diagrams for the 604e. Note that the 604e is currently offered by Motorola and IBM in a ceramic ball grid array CBGA package. The IBM and Motorola CBGA packages have identical pinouts.
|
OCR Scan
|
PDF
|
PID9v-604e
PowerPC-604e
microprocessor pin
|
b09 n03
Abstract: A09 N03 B07 P03
Text: 1.6 PowerPC 604e Microprocessor Pinout Listings Table 10 provides the pinout listing for the 604e CBGA package. Table 10. Pinout Listing for the CBGA Package Signal Name Pin Number Active I/O A[0—31 ] C16, E04, D13, F02, D14, G01, D15, E02, D16, D04, E13,
|
OCR Scan
|
PDF
|
PID9v-604e
b09 n03
A09 N03
B07 P03
|
l03 H04
Abstract: SIGNAL PATH DESIGNER AAVID THERMALLOY COMPOUND 350
Text: 1.6 Pinout Listings Table 10 provides the pinout listing for the 604e CBGA package. Table 10. Pinout Listing for the CBGA Package Signal Name Pin Number Active I/O AfO-31] C16, E04, D13, F02, D14, G01, D15, E02, D16, D04, E13, G02, E15, H01, E16, H02, F13, J01, F14, J02, F15, H03,
|
OCR Scan
|
PDF
|
AfO-31]
--604e)
PID9q-604e
l03 H04
SIGNAL PATH DESIGNER
AAVID THERMALLOY COMPOUND 350
|
FCS 1861
Abstract: wakefield compound 2333B b09 n03 SIGNAL PATH DESIGNER
Text: 1.6 Pinout Listings Table 10 provides the pinout listing for the 604e CBGA package. Table 10. Pinout Listing for the CBGA Package Pin Number Signal Name Active I/O A [0-31 C16, E04, D13, F02, D14, G01, D15, E02, D16, D04, E13, G 0 2 , E15, H01, E16, H02, F13, J01, F14, J02, F15, H03,
|
OCR Scan
|
PDF
|
T02otorola
PID9q-604e
FCS 1861
wakefield compound
2333B
b09 n03
SIGNAL PATH DESIGNER
|
Untitled
Abstract: No abstract text available
Text: 1. 6 Pow erPC 603e M icroprocessor Pinout Listings The following sections contain the pinout listings for the 603e CQFP and CBGA packages. 1.6.1 P i n o u t L is tin g for th e C Q F P P a c k a g e Table 10 provides the pinout listing for the 603e CQFP package.
|
OCR Scan
|
PDF
|
240-pin
PID6-603e
|
