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    Adam Technologies Inc CDR-05-TS

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    DigiKey CDR-05-TS Bag 1,770 1
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    Adam Technologies Inc CDR-05-TR

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    Adam Technologies Inc CDR-05-GR

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    Mouser Electronics CDR-05-GR 950
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    Adam Technologies Inc CDR-05-GS

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    KEMET Corporation CDR05BX104BKUS

    CAP CER 0.1UF 100V BX 1825
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    DigiKey CDR05BX104BKUS Digi-Reel 657 1
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    CDR05BX104BKUS Cut Tape 657 1
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    CDR05BX104BKUS Reel 631 100
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    CDR05 Datasheets (140)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    CDR05BP101ABSM KEMET CERAMIC CHIP/MIL-PRF-55681 Original PDF
    CDR05BP392BJMM AVX MIL-PRF-55681/Chip Capacitor Original PDF
    CDR05BP392BJSR KEMET Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 3900pF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-5%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 1825; Termination: Solder Coated SnPb; Body Dimensions: 0.180" x 0.250" x 0.080" Container: Bag; Features: MIL-PRF-55681: R Failure Rate Original PDF
    CDR05BP392BJSS KEMET Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 3900pF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-5%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 1825; Termination: Solder Coated SnPb; Body Dimensions: 0.180" x 0.250" x 0.080" Container: Bag; Features: MIL-PRF-55681: S Failure Rate Original PDF
    CDR05BP392BJUR KEMET Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 3900pF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-5%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 1825; Termination: Base Metalization - Barrier Metal - Solder Coated; Body Dimensions: 0.180" x 0.250" x 0.080" Container: Bag; Features: MIL-PRF-55681: R Failure Rate Original PDF
    CDR05BP392BJUS KEMET Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 3900pF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-5%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 1825; Termination: Base Metalization - Barrier Metal - Solder Coated; Body Dimensions: 0.180" x 0.250" x 0.080" Container: Bag; Features: MIL-PRF-55681: S Failure Rate Original PDF
    CDR05BP392BKSM KEMET Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 3900pF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 1825; Termination: Solder Coated SnPb; Body Dimensions: 0.180" x 0.250" x 0.080" Container: Bag; Features: MIL-PRF-55681: M Failure Rate Original PDF
    CDR05BP392BKSR KEMET Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 3900pF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 1825; Termination: Solder Coated SnPb; Body Dimensions: 0.180" x 0.250" x 0.080" Container: Bag; Features: MIL-PRF-55681: R Failure Rate Original PDF
    CDR05BP392BKSS KEMET Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 3900pF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 1825; Termination: Solder Coated SnPb; Body Dimensions: 0.180" x 0.250" x 0.080" Container: Bag; Features: MIL-PRF-55681: S Failure Rate Original PDF
    CDR05BP392BKUM KEMET Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 3900pF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 1825; Termination: Base Metalization - Barrier Metal - Solder Coated; Body Dimensions: 0.180" x 0.250" x 0.080" Container: Bag; Features: MIL-PRF-55681: M Failure Rate Original PDF
    CDR05BP392BKUP KEMET Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 3900pF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 1825; Termination: Base Metalization - Barrier Metal - Solder Coated; Body Dimensions: 0.180" x 0.250" x 0.080" Container: Bag; Features: MIL-PRF-55681: P Failure Rate Original PDF
    CDR05BP392BKUR KEMET Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 3900pF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 1825; Termination: Base Metalization - Barrier Metal - Solder Coated; Body Dimensions: 0.180" x 0.250" x 0.080" Container: Bag; Features: MIL-PRF-55681: R Failure Rate Original PDF
    CDR05BP392BKUS KEMET Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 3900pF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 1825; Termination: Base Metalization - Barrier Metal - Solder Coated; Body Dimensions: 0.180" x 0.250" x 0.080" Container: Bag; Features: MIL-PRF-55681: S Failure Rate Original PDF
    CDR05BP392BKYM KEMET Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 3900pF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 1825; Termination: Base Metalization - Barrier Metal - 100% Tin; Body Dimensions: 0.180" x 0.250" x 0.080" Container: Bag; Features: MIL-PRF-55681: M Failure Rate Original PDF
    CDR05BP392BKYP KEMET Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 3900pF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 1825; Termination: Base Metalization - Barrier Metal - 100% Tin; Body Dimensions: 0.180" x 0.250" x 0.080" Container: Bag; Features: MIL-PRF-55681: P Failure Rate Original PDF
    CDR05BP392BKYR KEMET Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 3900pF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 1825; Termination: Base Metalization - Barrier Metal - 100% Tin; Body Dimensions: 0.180" x 0.250" x 0.080" Container: Bag; Features: MIL-PRF-55681: R Failure Rate Original PDF
    CDR05BP392BKYS KEMET Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 3900pF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 1825; Termination: Base Metalization - Barrier Metal - 100% Tin; Body Dimensions: 0.180" x 0.250" x 0.080" Container: Bag; Features: MIL-PRF-55681: S Failure Rate Original PDF
    CDR05BP472BJSP KEMET Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 4700pF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-5%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 1825; Termination: Solder Coated SnPb; Body Dimensions: 0.180" x 0.250" x 0.080" Container: Bag; Features: MIL-PRF-55681: P Failure Rate Original PDF
    CDR05BP472BJSR KEMET Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 4700pF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-5%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 1825; Termination: Solder Coated SnPb; Body Dimensions: 0.180" x 0.250" x 0.080" Container: Bag; Features: MIL-PRF-55681: R Failure Rate Original PDF
    CDR05BP472BJSS KEMET Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 4700pF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-5%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 1825; Termination: Solder Coated SnPb; Body Dimensions: 0.180" x 0.250" x 0.080" Container: Bag; Features: MIL-PRF-55681: S Failure Rate Original PDF
    ...

    CDR05 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    SMD W2f

    Abstract: w2f smd SMD V3F W2F 07 6z smd AVX smd film capacitors CF v3f smd SM05 6LS AVX CKR08
    Text: SnPb & Non-Sn Termination Availability By Product Series MLCC Ceramic Chip Family MIL, QPL MLC Family Surface Mount Series 55681 - S* 55681 - M* 55681 - N* 55681 - U* 55681 - W* MLCC MLC Family Surface Mount LD Description CDR01, CDR02, CDR03, CDR04, CDR05, CDR06,


    Original     		PDF CDR01, CDR02, CDR03, CDR04, CDR05, CDR06, CDR31, CDR32, CDR33, CDR34, SMD W2f w2f smd SMD V3F W2F 07 6z smd AVX smd film capacitors CF v3f smd SM05 6LS AVX CKR08

    025bg

    Abstract: HR1808
    Text: MIL-PRF-55681 CDR Chip Capacitors Size CDR01 CDR02 CDR03 CDR04 CDR05 L inch mm W inch (mm) T min. inch (mm) T max. inch (mm) M.B. inch (mm) 0.080 ± .015 (2.03 ± 0.38) 0.180 ± .015 (4.57 ± 0.38) 0.180 ± .015 (4.57 ± 0.38) 0.180 ± .015 (4.57 ± 0.38)


    Original     		PDF MIL-PRF-55681 CDR01 CDR02 CDR03 HR1808 025bg

    CDR01 CAPACITOR

    Abstract: CDR02 cdr03 CDR04 CDR11 CDR01 CDR05
    Text: MIL-PRF-55681/MLC Chips Military Part Number Identification CDR01/02/03/04/05/06 Military Designation Per MIL-PRF-55681 Part Number Example L W D example t CDR01 BP 101 B K S M 1 2 3 4 5 6 7 1 MIL Style: CDR01, CDR02, CDR03, CDR04, CDR05, CDR06 2 Voltage Temperature Limits:


    Original     		PDF MIL-PRF-55681/MLC CDR01/02/03/04/05/06 MIL-PRF-55681 CDR01 CDR01, CDR02, CDR03, CDR04, CDR05, CDR06 CDR01 CAPACITOR CDR02 cdr03 CDR04 CDR11 CDR05

    CDR31-CDR35

    Abstract: CDR02 CDR03 CDR31 CDR32 CDR33 1g4l 1g marking CERAMIC CHIP/MIL-PRF-55681
    Text: CERAMIC CHIP/MIL-PRF-55681 CAPACITOR OUTLINE DRAWINGS BW DIMENSIONS—MILLIMETERS AND INCHES STYLE KEMET SIZE CODE CDR01 CDR02 CDR03 CDR04 C0805 C1805 C1808 C1812 CDR05 C1825 CDR06 CDR31 CDR32 CDR33 CDR34 CDR35 C2225 C0805 C1206 C1210 C1812 C1825 T L W MIN.


    Original     		PDF CHIP/MIL-PRF-55681 CDR01 CDR02 CDR03 CDR04 C0805 C1805 C1808 C1812 CDR05 CDR31-CDR35 CDR02 CDR03 CDR31 CDR32 CDR33 1g4l 1g marking CERAMIC CHIP/MIL-PRF-55681

    CDR05

    Abstract: No abstract text available
    Text: Continental Device India Limited An ISO/TS 16949, ISO 9001 and ISO 14001 Certified Company TO-126 TO-202-3 TO-220 CDR05 Thyristor Series Absolute maximum ratings Parameter peak repetitive off-stage voltage on-state RMS current average on-state current NON repetitive surge peak on-state current


    Original     		PDF O-126 O-202-3 O-220 CDR05 C-120 CDR05 021209E

    Untitled

    Abstract: No abstract text available
    Text: CDR MIL-PRF-55681 CDR CHIP CAPACITORS SIZE CDR01 CDR02 CDR03 CDR04 CDR05 CDR06 L inch mm 0.080 (2.03) 0.180 (4.57) 0.180 (4.57) 0.180 (4.57) 0.180 (4.57) 0.225 (5.72) W inch (mm) 0.050 (1.27) 0.050 (1.27) 0.080 (2.03) 0.125 (3.18) 0.250 (6.35) 0.250 (6.35)


    Original     		PDF MIL-PRF-55681 CDR01 CDR02 CDR03 CDR04 CDR05 CDR06

    Untitled

    Abstract: No abstract text available
    Text: CDR MIL-PRF-55681 CDR CHIP CAPACITORS SIZE CDR01 CDR02 CDR03 CDR04 CDR05 CDR06 L inch mm 0.080 (2.03) 0.180 (4.57) 0.180 (4.57) 0.180 (4.57) 0.180 (4.57) 0.225 (5.72) W inch (mm) 0.050 (1.27) 0.050 (1.27) 0.080 (2.03) 0.125 (3.18) 0.250 (6.35) 0.250 (6.35)


    Original     		PDF MIL-PRF-55681 CDR01 CDR02 CDR03 CDR04 CDR05 CDR06

    CDR04

    Abstract: No abstract text available
    Text: MIL-PRF-55681 Chips CDR01-CDR06 HOW TO ORDER CDR01 BP 101 B K S M MIL Style CDR01 CDR02 CDR03 CDR04 CDR05 CDR06 Voltage Temperature Limits BP = 0 ± 30 ppm/ºC without voltage; 0 ± 30 ppm/ºC with rated voltage from -55ºC to +125ºC BX = ±15% without voltage;


    Original     		PDF MIL-PRF-55681 CDR01-CDR06 CDR01 CDR01 CDR02 CDR03 CDR04 CDR05 CDR06 100pF

    CDR32

    Abstract: No abstract text available
    Text: MIL-PRF-55681 CDR Chip Capacitors DIMENSIONS Size CDR01 CDR02 CDR03 CDR04 CDR05 CDR06 L inch mm 0.080 (2.03) 0.180 (4.57) 0.180 (4.57) 0.180 (4.57) 0.180 (4.57) 0.225 (5.72) W inch (mm) 0.050 (1.27) 0.050 (1.27) 0.080 (2.03) 0.125 (3.18) 0.250 (6.35) 0.250 (6.35)


    Original     		PDF MIL-PRF-55681 CDR01 CDR02 CDR03 CDR04 CDR05 CDR06 CDR31 CDR32 CDR33

    Untitled

    Abstract: No abstract text available
    Text: CDR MIL-PRF-55681 CDR CHIP CAPACITORS SIZE CDR01 CDR02 CDR03 CDR04 CDR05 CDR06 L inch mm 0.080 (2.03) 0.180 (4.57) 0.180 (4.57) 0.180 (4.57) 0.180 (4.57) 0.225 (5.72) W inch (mm) 0.050 (1.27) 0.050 (1.27) 0.080 (2.03) 0.125 (3.18) 0.250 (6.35) 0.250 (6.35)


    Original     		PDF MIL-PRF-55681 CDR01 CDR02 CDR03 CDR04 CDR05 CDR06

    LT3973-3.3

    Abstract: CDR01-CDR06 C1206 KEMET packaging PEF55801VV1.3 CDR05BX823BKW CDR31-CDR35 MIL-PRF-55681 kemet 31G-4 CDR02 LT1432-3.3
    Text: CERAMIC CHIP/MIL-PRF-55681 KEMET CAPACITOR OUTLINE DRAWINGS CHIP DIMENSIONS “SOLDERGUARD I” * SOLDER L W “SOLDERGUARD II” T TINNED BW NICKEL ELECTRODES SILVER METALLIZATION NICKEL ELECTRODES Military Designation - “S” or “U” KEMET Designation - “H”


    Original     		PDF CHIP/MIL-PRF-55681 CDR01 CDR02 CDR03 CDR04 C0805 C1805 C1808 C1812 CDR05 LT3973-3.3 CDR01-CDR06 C1206 KEMET packaging PEF55801VV1.3 CDR05BX823BKW CDR31-CDR35 MIL-PRF-55681 kemet 31G-4 CDR02 LT1432-3.3

    MIL-PRF-55681

    Abstract: C180 cdr01 capacitors kemet capacitor c1206 CDR02 CDR03 CDR31 CDR32 CDR33 CDR01-CDR06
    Text: CERAMIC CHIP/MIL-PRF-55681 CAPACITOR OUTLINE DRAWINGS CHIP DIMENSIONS “SOLDERGUARD I” * SOLDER L W “SOLDERGUARD II” T TINNED BW NICKEL ELECTRODES SILVER METALLIZATION NICKEL ELECTRODES Military Designation - “S” or “U” KEMET Designation - “H”


    Original     		PDF CHIP/MIL-PRF-55681 CDR01 CDR02 CDR03 CDR04 C0805 C1805 C1808 C1812 CDR05 MIL-PRF-55681 C180 cdr01 capacitors kemet capacitor c1206 CDR02 CDR03 CDR31 CDR32 CDR33 CDR01-CDR06

    nec V850e2m manual

    Abstract: v850E2M architecture v850e2 architecture
    Text: Cover User’s Manual 32 V850E2/PG4-L User’s Manual: Hardware Renesas microcomputers V850 Series All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by


    Original     		PDF V850E2/PG4-L R01UH0336EJ0102 nec V850e2m manual v850E2M architecture v850e2 architecture

    cn/A/U 237 BG

    Abstract: No abstract text available
    Text: AVX Periodic Tables Version 10.1 The Latest CV Tables from the Leader in Capacitor Technology Table of Contents COMMERCIAL PRODUCTS Product Line Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4 CERAMIC CAPACITORS


    Original     		PDF S-MAXCAP0M710-C cn/A/U 237 BG

    CDR01 CAPACITOR

    Abstract: MIL-PRF-55681 CDR02BX103B CDR02 CDR03 CDR11
    Text: MIL-PRF-55681/Chips Part Number Example CDR01 thru CDR06 MILITARY DESIGNATION PER MIL-PRF-55681 Part Number Example CDR01 L W D t BP 101 B K S M MIL Style Voltage-temperature Limits Capacitance T Rated Voltage Capacitance Tolerance Termination Finish Failure Rate


    Original     		PDF MIL-PRF-55681/Chips CDR01 CDR06 MIL-PRF-55681 CDR01 CDR01, CDR02, CDR03, CDR04, CDR05, CDR01 CAPACITOR MIL-PRF-55681 CDR02BX103B CDR02 CDR03 CDR11

    Untitled

    Abstract: No abstract text available
    Text: CERAMIC CHIP CAPACITORS INTRODUCTION Ceramic chips consist of formulated ceramic dielectric materials which have been fabricated into thin layers, interspersed with metal electrodes alternately exposed on opposite edges of the laminated structure. The entire structure is then fired at high temperature to


    Original     		PDF EIA-198

    Untitled

    Abstract: No abstract text available
    Text: Z8051 Series 8-Bit Microcontrollers Z51F6412 Product Specification PS030302-0212 PRELIMINARY Copyright 2012 Zilog , Inc. All rights reserved. www.zilog.com Z51F6412 Product Specification ii Warning: DO NOT USE THIS PRODUCT IN LIFE SUPPORT SYSTEMS. LIFE SUPPORT POLICY


    Original     		PDF Z8051 Z51F6412 PS030302-0212

    Untitled

    Abstract: No abstract text available
    Text: Z8051 Series 8-Bit Microcontrollers Z51F0410 Product Specification PS029502-0212 PRELIMINARY Copyright 2012 Zilog , Inc. All rights reserved. www.zilog.com Z51F0410 Product Specification ii Warning: DO NOT USE THIS PRODUCT IN LIFE SUPPORT SYSTEMS. LIFE SUPPORT POLICY


    Original     		PDF Z8051 Z51F0410 PS029502-0212

    6HEH

    Abstract: CONTROLLER PT 2323 VIA I2C BUS 270b5 CDR03 receiver p06pc
    Text: Z8051 Series 8-Bit Microcontrollers Z51F0410 Product Specification PS029502-0212 PRELIMINARY Copyright 2012 Zilog , Inc. All rights reserved. www.zilog.com Z51F0410 Product Specification ii Warning: DO NOT USE THIS PRODUCT IN LIFE SUPPORT SYSTEMS. LIFE SUPPORT POLICY


    Original     		PDF Z8051 Z51F0410 PS029502-0212 Z51F0410 PS029502-0212 6HEH CONTROLLER PT 2323 VIA I2C BUS 270b5 CDR03 receiver p06pc

    08055A101JAT2A

    Abstract: CDR02 CDR03 CDR11 cdr01 capacitors EIA-556A
    Text: MIL-PRF-55681/Chips Part Number Example MILITARY DESIGNATION PER MIL-PRF-55681 Part Number Example example L W D t CDR01 BP 101 B K S M MIL Style Voltage-temperature Limits Capacitance T Rated Voltage Capacitance Tolerance Termination Finish Failure Rate


    Original     		PDF MIL-PRF-55681/Chips MIL-PRF-55681 CDR01 CDR01, CDR02, CDR03, CDR04, CDR05, CDR06 EIA-556-A. 08055A101JAT2A CDR02 CDR03 CDR11 cdr01 capacitors EIA-556A

    S1C8E108

    Abstract: No abstract text available
    Text: CMOS 8-BIT SINGLE CHIP MICROCOMPUTER S1C8E108 Technical Manual S1C8E108 Technical Hardware NOTICE No part of this material may be reproduced or duplicated in any form or by any means without the written permission of Seiko Epson. Seiko Epson reserves the right to make changes to this material without notice. Seiko Epson does not assume any


    Original     		PDF S1C8E108 S1C8E108 E-08190

    uPD70F3548

    Abstract: uPD70F3554 uPD70F3558 uPD70F3550 uPD70F4002 v850e2 Fx4 uPD70F3551 uPD70F35 uPD70f4010 V850E2 FK4
    Text: User Manual 32 Preliminary Document V850E2/Fx4 32-bit Microcontroller V850E2/FG4 V850E2/FJ4 V850E2/FK4 V850E2/FL4 µPD70F3548 µPD70F3549 µPD70F3550 µPD70F3551 µPD70F3552 µPD70F3553 µPD70F3554 µPD70F3555 µPD70F3556 µPD70F3557 µPD70F3558 µPD70F3559


    Original     		PDF V850E2/Fx4 32-bit V850E2/FG4 PD70F3548 PD70F3549 PD70F3550 V850E2/FJ4 PD70F3551 PD70F3552 PD70F3553 uPD70F3548 uPD70F3554 uPD70F3558 uPD70F3550 uPD70F4002 v850e2 Fx4 uPD70F3551 uPD70F35 uPD70f4010 V850E2 FK4

    MX 0541

    Abstract: TB 2929 Ho BT 3758 equivalent MIL-PRF-28861 k 3638 Alternatives klystron weapon STC 07256 Klystron tube Bt 2313 K 4005
    Text: AVX Military Products Military Products AVX Military Qualified Products Listing Table of Contents Multilayer Ceramic Leaded Capacitors – Military Cross Reference . . . . . . . . . . . . . . . . 3-31 MIL-PRF-39014 M, P, R and S Failure Rate Level /01, /02, /05, /20, /21, /23 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4


    Original     		PDF MIL-PRF-39014 MIL-PRF-11015 S-MPC12 5M1198-N MX 0541 TB 2929 Ho BT 3758 equivalent MIL-PRF-28861 k 3638 Alternatives klystron weapon STC 07256 Klystron tube Bt 2313 K 4005

    PSB80170EV1.1-G

    Abstract: PEF22624EV2.1G PEF21624EV2.1-G CERAMIC CHIP/MIL-PRF-55681 PEF88208ELV3.1-G
    Text: CERAMIC CHIP/MIL-PRF-55681 CAPACITOR OUTLINE DRAWINGS CHIP DIMENSIONS “SOLDERGUARD I” * SOLDER L W “SOLDERGUARD II” T TINNED BW NICKEL ELECTRODES SILVER METALLIZATION NICKEL ELECTRODES Military Designation - “S” or “U” KEMET Designation - “H”


    Original     		PDF CHIP/MIL-PRF-55681 CDR01 CDR02 CDR03 CDR04 C0805 C1805 C1808 C1812 CDR05 PSB80170EV1.1-G PEF22624EV2.1G PEF21624EV2.1-G CERAMIC CHIP/MIL-PRF-55681 PEF88208ELV3.1-G