D24K
Abstract: d28j D14D D24H D08C D16C D18A D20A D20B D24C
Text: Ceramic Sidebrazed Dual-in-Line Packages SB 8 Lead Ceramic Sidebrazed Dual-in-Line Package NS Package Number D08C 14 Lead Ceramic Sidebrazed Dual-in-Line Package NS Package Number D14D 2000 National Semiconductor Corporation MS101104 www.national.com
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MS101104
D24K
d28j
D14D
D24H
D08C
D16C
D18A
D20A
D20B
D24C
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CD4067 DATASHEET
Abstract: cd4067 CD4097 ALL CD4067
Text: Data sheet acquired from Harris Semiconductor SCHS052A – Revised March 2002 The CD4067 and CD4097 are supplied in 24-lead dual-in-line welded-seal ceramic packages D suffix , 24-lead dual-in-line frit-seal ceramic packages (F suffix), 24-lead dual-in-line plastic
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SCHS052A
CD4067
CD4097
24-lead
24-lead
CD4067 DATASHEET
ALL CD4067
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CD4067BE
Abstract: cd4067 cd4067 harris CD4097be
Text: Data sheet acquired from Harris Semiconductor SCHS052A – Revised March 2002 The CD4067 and CD4097 are supplied in 24-lead dual-in-line welded-seal ceramic packages D suffix , 24-lead dual-in-line frit-seal ceramic packages (F suffix), 24-lead dual-in-line plastic
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SCHS052A
CD4067
CD4097
24-lead
CD4067B,
16-Channel
CD4067BNSR
CD4067BE
cd4067 harris
CD4097be
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SIP 400B
Abstract: 24-Pin Plastic DIP Shrink Zig-Zag In-line Package 600A CERAMIC PIN GRID ARRAY 120 pins PGA data sheet pin count P20V-254A-2 P64E-70-A-1
Text: CHAPTER 2 THROUGH HOLE PACKAGES 2.1 LINEUP OF THROUGH HOLE PACKAGES 2.2 LIST OF THROUGH HOLE PACKAGES 1 Plastic DIP (Dual In-line Package) (2) Ceramic DIP (Dual In-line Package) (3) Plastic SIP (Single In-line Package) (4) Plastic V-DIP (Vertical Dual In-line Package)
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follow100A7-1
X280RF-100A-2
X280RF-100A1-1
X280RF-100A2-1
X280RF-100A3-1
X280RF-100A4
X280RF-100A5
X364RF-100A-1
X179RP-100A
X447RP-50A
SIP 400B
24-Pin Plastic DIP
Shrink Zig-Zag In-line Package
600A
CERAMIC PIN GRID ARRAY 120 pins
PGA data sheet pin count
P20V-254A-2
P64E-70-A-1
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CD40106B
Abstract: No abstract text available
Text: Data sheet acquired from Harris Semiconductor SCHS097B – Revised August 2002 The CD40106B types are supplied in 14-lead hermetic dual-in-line ceramic packages F suffix , 14-lead dual-in-line plastic package (E suffix), 14-lead dual-in-line surface-mount plastic packages (M and M96
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SCHS097B
CD40106B
14-lead
14-lead
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cd40106b
Abstract: CD40106BE CD-40106BE
Text: Data sheet acquired from Harris Semiconductor SCHS097B – Revised August 2002 The CD40106B types are supplied in 14-lead hermetic dual-in-line ceramic packages F suffix , 14-lead dual-in-line plastic package (E suffix), 14-lead dual-in-line surface-mount plastic packages (M and M96
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SCHS097B
CD40106B
14-lead
CD40106BNSR
CD40106BPW
CD40106BPWR
CD40106BE
CD-40106BE
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CD4041UB
Abstract: No abstract text available
Text: Data sheet acquired from Harris Semiconductor SCHS039A – Revised March 2002 The CD4041UB types are supplied in 14-lead hermetic dual-in-line ceramic packages D and F suffixes , 14-lead dual-in-line plastic packages (E suffix), 14-lead ceramic flat packages (K suffix), 14-lead small-outline
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SCHS039A
CD4041UB
14-lead
14-lead
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173KB
Abstract: No abstract text available
Text: Data sheet acquired from Harris Semiconductor SCHS108A – Revised March 2002 The CD40257B types are supplied in 16-lead hermetic dual-in-line ceramic packages D and F suffixes , 16-lead dual-in-line plastic packages (E suffix), 16-lead ceramic flat packages (K suffix), 16-lead small-outline
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SCHS108A
CD40257B
16-lead
SCAU001A,
SDYZ001A,
CD40257BE
CD40257BF3A
173KB
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CD40257B
Abstract: No abstract text available
Text: Data sheet acquired from Harris Semiconductor SCHS108A – Revised March 2002 The CD40257B types are supplied in 16-lead hermetic dual-in-line ceramic packages D and F suffixes , 16-lead dual-in-line plastic packages (E suffix), 16-lead ceramic flat packages (K suffix), 16-lead small-outline
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SCHS108A
CD40257B
16-lead
16-lead
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Untitled
Abstract: No abstract text available
Text: Data sheet acquired from Harris Semiconductor SCHS039A – Revised March 2002 The CD4041UB types are supplied in 14-lead hermetic dual-in-line ceramic packages D and F suffixes , 14-lead dual-in-line plastic packages (E suffix), 14-lead ceramic flat packages (K suffix), 14-lead small-outline
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SCHS039A
CD4041UB
14-lead
SDYZ001A,
CD4041UBE
CD4041UBF
CD4041UBF3A
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173KB
Abstract: No abstract text available
Text: Data sheet acquired from Harris Semiconductor SCHS108A – Revised March 2002 The CD40257B types are supplied in 16-lead hermetic dual-in-line ceramic packages D and F suffixes , 16-lead dual-in-line plastic packages (E suffix), 16-lead ceramic flat packages (K suffix), 16-lead small-outline
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SCHS108A
CD40257B
16-lead
CD40257BNSR
CD40257BPW
CD40257BPWR
173KB
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226 10k
Abstract: No abstract text available
Text: Data sheet acquired from Harris Semiconductor SCHS039A – Revised March 2002 The CD4041UB types are supplied in 14-lead hermetic dual-in-line ceramic packages D and F suffixes , 14-lead dual-in-line plastic packages (E suffix), 14-lead ceramic flat packages (K suffix), 14-lead small-outline
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SCHS039A
CD4041UB
14-lead
CD4041UBNSR
CD4041UBPW
CD4041UB,
CD4041UBPWR
226 10k
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CDIP4-T24
Abstract: MARK S2 CDIP4-T24 DIMENSIONS
Text: Ceramic Packages Ceramic Dual-In-Line Metal Seal Packages SBDIP c1 -A- D24.3 MIL-STD-1835 CDIP4-T24 (D-9, CONFIGURATION C) LEAD FINISH 24 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE -DBASE METAL E b1 M (b) M -Bbbb S C A - B S INCHES (c) SECTION A-A D S
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MIL-STD-1835
CDIP4-T24
CDIP4-T24
MARK S2
CDIP4-T24 DIMENSIONS
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CDIP2-T28
Abstract: D-10
Text: Ceramic Package Ceramic Dual-In-Line Metal Seal Packages SBDIP c1 -A- D28.6 MIL-STD-1835 CDIP2-T28 (D-10, CONFIGURATION C) LEAD FINISH 28 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE -DBASE METAL E b1 M (b) M -Bbbb S C A - B S INCHES (c) SECTION A-A D S
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MIL-STD-1835
CDIP2-T28
CDIP2-T28
D-10
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GDIP3-T24
Abstract: No abstract text available
Text: Ceramic Package Ceramic Dual-In-Line Frit Seal Packages CERDIP c1 F24.3 MIL-STD-1835 GDIP3-T24 (D-9, CONFIGURATION A) LEAD FINISH 24 LEAD CERAMIC DUAL-IN-LINE FRIT SEAL PACKAGE -D- -A- BASE METAL INCHES (c) E b1 M M (b) -Bbbb S C A-B S SECTION A-A D S D
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MIL-STD-1835
GDIP3-T24
GDIP3-T24
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cdip2-t16
Abstract: CDIP2-T16 DIMENSIONS
Text: Ceramic Package Ceramic Dual-In-Line Metal Seal Packages SBDIP c1 -A- D16.3 MIL-STD-1835 CDIP2-T16 (D-2, CONFIGURATION C) LEAD FINISH 16 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE -DBASE METAL E b1 M (b) M -Bbbb S C A - B S INCHES (c) SECTION A-A D S D
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MIL-STD-1835
CDIP2-T16
cdip2-t16
CDIP2-T16 DIMENSIONS
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MARK S2
Abstract: CDIP2-T22
Text: Ceramic Package Ceramic Dual-In-Line Metal Seal Packages SBDIP c1 -A- D22.4 MIL-STD-1835 CDIP2-T22 (D-7, CONFIGURATION C) LEAD FINISH 22 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE -DBASE METAL E b1 M (b) M -Bbbb S C A - B S INCHES (c) SECTION A-A D S D
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MIL-STD-1835
CDIP2-T22
MARK S2
CDIP2-T22
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MARK S2
Abstract: No abstract text available
Text: Ceramic Package Ceramic Dual-In-Line Metal Seal Packages SBDIP c1 -A- D40.6 MIL-STD-1835 CDIP2-T40 (D-5, CONFIGURATION C) LEAD FINISH 40 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE -DBASE METAL E b1 M (b) M -Bbbb S C A - B S INCHES (c) SECTION A-A D S D
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MIL-STD-1835
CDIP2-T40
MARK S2
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diode t40
Abstract: No abstract text available
Text: Ceramic Package Ceramic Dual-In-Line Frit Seal Packages CERDIP c1 F40.6 MIL-STD-1835 GDIP1-T40 (D-5, CONFIGURATION A) LEAD FINISH 40 LEAD CERAMIC DUAL-IN-LINE FRIT SEAL PACKAGE -D- -A- BASE METAL INCHES (c) E b1 M M (b) -Bbbb S C A-B S SECTION A-A D S D
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MIL-STD-1835
GDIP1-T40
diode t40
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GDIP1-T14
Abstract: No abstract text available
Text: Ceramic Package Ceramic Dual-In-Line Frit Seal Packages CERDIP c1 F14.3 MIL-STD-1835 GDIP1-T14 (D-1, CONFIGURATION A) LEAD FINISH 14 LEAD CERAMIC DUAL-IN-LINE FRIT SEAL PACKAGE -D- -A- BASE METAL INCHES (c) E b1 M M (b) -Bbbb S C A-B S SECTION A-A D S D
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MIL-STD-1835
GDIP1-T14
GDIP1-T14
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Untitled
Abstract: No abstract text available
Text: Ceramic Package Ceramic Dual-In-Line Frit Seal Packages CERDIP c1 F22.4 MIL-STD-1835 GDIP1-T22 (D-7, CONFIGURATION A) LEAD FINISH 22 LEAD CERAMIC DUAL-IN-LINE FRIT SEAL PACKAGE -D- -A- BASE METAL INCHES (c) E b1 M M (b) -Bbbb S C A-B S SECTION A-A D S D
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MIL-STD-1835
GDIP1-T22
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CDIP2-T18
Abstract: MARK S2 18-LEAD D-6 PACKAGE
Text: Ceramic Package Ceramic Dual-In-Line Metal Seal Packages SBDIP c1 -A- D18.3 MIL-STD-1835 CDIP2-T18 (D-6, CONFIGURATION C) LEAD FINISH 18 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE -DBASE METAL E b1 M (b) M -Bbbb S C A - B S INCHES (c) SECTION A-A D S D
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MIL-STD-1835
CDIP2-T18
CDIP2-T18
MARK S2
18-LEAD D-6 PACKAGE
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CDIP2-T8
Abstract: 0383D MARK S2
Text: Ceramic Package Ceramic Dual-In-Line Metal Seal Packages SBDIP c1 -A- D8.3 MIL-STD-1835 CDIP2-T8 (D-4, CONFIGURATION C) LEAD FINISH 8 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE -DBASE METAL E b1 M (b) M -Bbbb S C A - B S INCHES (c) SECTION A-A D S D BASE
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MIL-STD-1835
CDIP2-T8
0383D
MARK S2
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Untitled
Abstract: No abstract text available
Text: Dimensional Outlines Dual-In-Line Welded-Seal Ceramic Packages D S U F F I X (J E D E C MO-OOI-AD) 14-Lead Dual-In-Line Welded-Seal Ceramic Package (D) S U F F I X (J E D E C MO-OOI-AE) 16-Lead Dual-ln-Line Welded-Seal Ceramic Package A INCHES MIN. MAX.
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14-Lead
16-Lead
51HES
28-Lead
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