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    CHOMERICS 77 Search Results

    CHOMERICS 77 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    T443

    Abstract: Chomerics T710 D257 D374 D792 T310 T725 chomerics 77 PARKER HANNIFIN parker
    Text: TECHNICAL BULLETIN • Phase-change thermal interface materials • Thermally conductive adhesive tapes • Thermally conductive insulator pads • Thermally conductive gap fillers • Thermally conductive silicone compounds • Flexible heat spreaders • Thermal management for BGAs


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    MIL-T-47012

    Abstract: PARKER HANNIFIN CHO-TP-57 parker-hannifin 2024 ASTM-D1000 SHIELD ELECTRICAL MIL D1000 MIL-T-10727 parker
    Text: • • • • • Conductive elastomers • Knitted wire mesh Conductive coatings, sealants, adhesives Cable shielding products • EMI/ESD shielding laminates Shielded vents and windows FCC/VDE and TEMPEST testing LEADER IN EMI SHIELDING INNOVATION, DESIGN, AND TEST TECHNOLOGY


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    3M1197SG-214 MIL-T-47012 PARKER HANNIFIN CHO-TP-57 parker-hannifin 2024 ASTM-D1000 SHIELD ELECTRICAL MIL D1000 MIL-T-10727 parker PDF

    PARKER HANNIFIN

    Abstract: L-1012-12 L-1012-6 L-1012-18 TM 1628 parker
    Text: • • • • • TECHNICAL BULLETIN Conductive elastomers • Knitted wire mesh Conductive coatings, sealants, adhesives Cable shielding products • EMI/ESD shielding laminates Shielded vents and windows Commercial and military EMI testing LEADER IN EMI SHIELDING INNOVATION, DESIGN, AND TEST TECHNOLOGY


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    1M599SG-200R PARKER HANNIFIN L-1012-12 L-1012-6 L-1012-18 TM 1628 parker PDF

    74008

    Abstract: TM 1628 74017 74004 74019 74021 74011 74013 74032 74022
    Text: SOFT-SHIELD 5000 Series Conductive Jacket over Foam EMI Gaskets continued KNIFE-EDGE PROFILE W 74007 18 Compression lbs/lin.inch • • • • • H 16 Conductive elastomers • Knitted wire mesh Low closure force, foam core EMI gaskets Conductive coatings, sealants, adhesives


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    5M300AG-247 74008 TM 1628 74017 74004 74019 74021 74011 74013 74032 74022 PDF

    MPC-120

    Abstract: T725 AN-0003 gold wire
    Text: Thermal Considerations for PAs AN-0003 Thermal Considerations for Power Amplifiers Overview Proper heatsinking to control junction temperature is an extremely important consideration for use of all power amplifiers. Gallium Arsenide GaAs devices can tolerate considerably higher junction


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    AN-0003 MPC-120 T725 AN-0003 gold wire PDF

    E7221

    Abstract: 865g Motherboard 775 motherboard BGA reflow guide Chomerics T710 6700PXH 6702PXH chipset reflow profile FOXCONN 865gv foxconn MOTHERBOARD
    Text: R Intel E7221 Memory Controller Hub MCH Thermal/Mechanical Design Guide September 2004 Document Number: 303632-001 R Notice: This document contains information on products in the design phase of development. The information here is subject to change without notice.


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    E7221 865g Motherboard 775 motherboard BGA reflow guide Chomerics T710 6700PXH 6702PXH chipset reflow profile FOXCONN 865gv foxconn MOTHERBOARD PDF

    Untitled

    Abstract: No abstract text available
    Text: Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal


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    0-320P 73-7-320A 173-7-330P 173-7-340P 173-7-350P 173-7-410P 173-7-510P 173-7-520P 173-7-610P 173-7-710P PDF

    Untitled

    Abstract: No abstract text available
    Text: 7 8 6 5 3 4 1 2 REVISIONS REV. DATE ELASTOMERIC GASKET OPTION ADDED SEP 15/09 ZLJ DETAIL K ADDED JAN 14/10 ZLJ ECN S T F S1 - S 0 2 - 1 X X X DESCRIPTION APPROVED F F MOUNTING SCREW OPTION 1 = 8 mm MOUNTING SCREW SHIPPED BULK IN SAME TRAYS WITH CAGE ASSEMBLIES


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    C6305 123XX P-FS1-S02-1XXX PDF

    MIL-C-47113

    Abstract: t405 6000 e595 Chomerics* T-405 deltabond ARCLAD 8223 T-412 chomerics KS21343 thermal grease Chomerics T710 174-9-250P
    Text: Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal


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    O-220 MIL-C-47113 t405 6000 e595 Chomerics* T-405 deltabond ARCLAD 8223 T-412 chomerics KS21343 thermal grease Chomerics T710 174-9-250P PDF

    JESD51-1

    Abstract: intel 82566 Design Guide flotherm JESD-51-1 82566
    Text: Intel 82566 Gigabit Platform LAN Connect Thermal Design Considerations January 2011 Order Number: 325027-001 Revision 1.2 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS


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    82566EI 82566--Thermal JESD51-1 intel 82566 Design Guide flotherm JESD-51-1 82566 PDF

    Chomerics T710

    Abstract: PHC029C02012 845 motherboard foxconn motherboard intel 845 845 motherboard circuit a1349 INTEL 845 sdr 845 motherboard check point ICH2
    Text: R Intel 845 Chipset Thermal and Mechanical Design Guidelines Design Guide September 2001 Document Number: 298586-001 R ® Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual


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    A65066-001 A67031-001 A61203-001 A13494-005 HB96030-DW A67625-001 PHC029C02012 Chomerics T710 PHC029C02012 845 motherboard foxconn motherboard intel 845 845 motherboard circuit a1349 INTEL 845 sdr 845 motherboard check point ICH2 PDF

    SAS 251

    Abstract: No abstract text available
    Text: A B C D E G F H REVISIONS REV DESCRIPTION, ECN, EAR NO. DATE S ELASTOMERIC GASKET OPTION ADDED SEP 15/09 ZLJ JAN 14/10 JAN 30/13 MAY 17/13 ZLJ ZLJ ZLJ T AA AB DETAIL H ADDED NO GASKET OPTION ADDED CORRECTED VIEW APP'D 1 F S1 - S F 2 - 1 X X X 1 MOUNTING SCREW OPTION


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    C6305 SAS 251 PDF

    T405R

    Abstract: Bergquist BP-108 T410R Chomerics* T405 658-35AB T405 T410 T411 T412 i960CF
    Text: WTS001_p1-25 6/14/07 10:53 AM Page 2 Thermal Management Solutions for BGAs BGA THERMAL SOLUTIONS MATRIX The following table represents Wakefield’s recommendations for a variety of standard BGA sizes. However, this is by no means a complete list of components that can be used with these heat sinks. To determine suitability for your particular component, request a BGA heat sink


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    WTS001 p1-25 220486SX I860XR I960CA, I960CF AM486DX2, AM486DX4 669-32AG 669-32AG T405R Bergquist BP-108 T410R Chomerics* T405 658-35AB T405 T410 T411 T412 PDF

    845GL

    Abstract: 845gv motherboard intel 845GL motherboard 845GV 82801DB foxconn motherboard Passive Heatsink FCBGA chipset reflow profile MOTHERBOARD INTEL 845 GMCH of motherboard
    Text: R 3 Intel 845G/845GL/845GV Chipset Thermal Design Guide Intel® 82845G/82845GL/82845GV GMCH Thermal and Mechanical Design Guidelines October 2002 Document Number: 298655-002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY


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    845G/845GL/845GV 82845G/82845GL/82845GV Pkg760 845GL 845gv motherboard intel 845GL motherboard 845GV 82801DB foxconn motherboard Passive Heatsink FCBGA chipset reflow profile MOTHERBOARD INTEL 845 GMCH of motherboard PDF

    AMD-K5

    Abstract: anemometer AMD-K5 Processor Thermal grease MIL-I-49456A Chomerics* T405 296-pin K5 AMD power led heat sink Thermagon thermal grease
    Text: TM AMD-K5 PROCESSOR Thermal Considerations Application Note Publication # 20092 Issue Date: September 1996 Rev: B Amendment/0 This document contains information on a product under development at Advanced Micro Devices AMD . The information is intended to help you evaluate this product. AMD reserves the right to change or discontinue work on this proposed product without notice.


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    20092B/0--Sep1996 AMD-K5 anemometer AMD-K5 Processor Thermal grease MIL-I-49456A Chomerics* T405 296-pin K5 AMD power led heat sink Thermagon thermal grease PDF

    Wakefield Thermal Solutions

    Abstract: Chomerics* T405 Bergquist BP-108 D10650-40 658-35AB 77AB datasheet of BGAS T405 bga package weight T411
    Text: Cover.qxd 11/3/05 1:00 PM Page 1 THERMAL MANAGEMENT SOLUTIONS FOR BGAs DESIGN • ANALYSIS • FABRICATION CORPORATE HEADQUARTERS WAKEFIELD THERMAL SOLUTIONS INC. 33 Bridge Street Pelham, NH 03076 Tel: 603 635-2800 Fax: (603) 635-1900 www.wakefield.com SUBSIDIARIES:


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    82801BA

    Abstract: 82801DB ATA-33 E7205 PHC029C02012 T-710 Intel E7205 A13494-005 bga intel
    Text: R Intel E7205 Chipset Thermal Design Guide Intel® E7205 Chipset Memory Controller Hub MCH Thermal and Mechanical Design Guidelines November 2002 Document Number: 251940-001 R INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY


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    E7205 82801BA 82801DB ATA-33 PHC029C02012 T-710 Intel E7205 A13494-005 bga intel PDF

    ATX 2.03 400 WATT

    Abstract: FUJIKURA fan pentium MOTHERBOARD CIRCUIT diagram 600E 733B AD1021 PGA370 XTS454 NISSEI GUIDE CompactPCI specification
    Text: Intel Pentium® III Processor Thermal Design Guide Application Note June 2000 Order Number: 273325-003 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual


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    ShineTsu G-749

    Abstract: intel packaging handbook 240800 AD1021 600E 733B PGA370 XTS454 273325 G749 G-749
    Text: Intel Pentium® III Processor Thermal Design Guide Application Note December 2001 Order Number: 273325-004 Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual


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    Sumitomo G750

    Abstract: G750 thermal conductivity Thermagon motor speed control mc-60 shicoh Thermagon t pad XTS454 T-PLI 200 thermagon Texas Instruments epoxy Sumitomo PBGA-B495
    Text: Intel Pentium® III Processor – Low Power Thermal Design Guide Application Note May 2000 Order Number: 273285-003 Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual


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    FUJIKURA fan

    Abstract: shicoh intel packaging handbook 240800 gus manual AD1021 PGA370 XTS454 273421 sunon fan NISSEI GUIDE
    Text: Intel Celeron Processor Thermal Design Guide Application Note December 2000 Order Number: 273421-002 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual


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    i3-8637 FUJIKURA fan shicoh intel packaging handbook 240800 gus manual AD1021 PGA370 XTS454 273421 sunon fan NISSEI GUIDE PDF

    hand movement based fan speed control

    Abstract: No abstract text available
    Text: InnovationS in thermal management DESIGN SERVICES and rapid prototyping E CREATE CREAT Through its computational facilities and thermal/fluids laboratories, ATS specializes in providing thermal analysis, mechanical and design services for telecommunications,


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    CWT-125 CLWTC-1000 HP-97TM hand movement based fan speed control PDF

    Untitled

    Abstract: No abstract text available
    Text: InnovationS in thermal management DESIGN SERVICES and rapid prototyping E CREATE CREAT Through its computational facilities and thermal/fluids laboratories, ATS specializes in providing thermal analysis, mechanical and design services for telecommunications,


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    CWT-125 CLWTC-1000 HP-97TM PDF

    m83528

    Abstract: MIL-G-83528
    Text: DOC NO PART NUMBER 0C B ±.005 21-99786 SH OF 50097-93 M 1L - SPEC S E E N O T E 2 LTR r ev is io n s DESCRIPTION B M A T E R I A L WAS E C N : 84267 TYPE C DATE (TYPE D) APPVD 1 7 - F eb - 98 TOOMBS 21-99786- 22 0.070 0.98 9± .010 M83528/002-D-022 C ( C L I 1)


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    M83528/002-D-022 M83528/002-D-024 M83528/002 MIL-G-83528, m83528 MIL-G-83528 PDF