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    COPPER BOND WIRE AMKOR Search Results

    COPPER BOND WIRE AMKOR Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    SF-NDCCGJ28GB-003M Amphenol Cables on Demand Amphenol SF-NDCCGJ28GB-003M 3m SFP28 Cable - Amphenol 25-Gigabit Ethernet SFP28 Direct Attach Copper Cable (9.8 ft) - 26 AWG (Low-Loss Version) Datasheet
    SF-NDCCGJ28GB-002M Amphenol Cables on Demand Amphenol SF-NDCCGJ28GB-002M 2m SFP28 Cable - Amphenol 25-Gigabit Ethernet SFP28 Direct Attach Copper Cable (6.6 ft) - 26 AWG (Low-Loss Version) Datasheet
    SF-NDCCGJ28GB-005M Amphenol Cables on Demand Amphenol SF-NDCCGJ28GB-005M 5m SFP28 Cable - Amphenol 25-Gigabit Ethernet SFP28 Direct Attach Copper Cable (16.4 ft) - 26 AWG Datasheet
    SF-NDAAFJ100G-002M Amphenol Cables on Demand Amphenol SF-NDAAFJ100G-002M 2m (6.6') 100GbE QSFP28 Cable - Amphenol 100-Gigabit Ethernet Passive Copper QSFP Cable (SFF-8665 802.3bj) - QSFP28 to QSFP28 (26-AWG Low-Loss) Datasheet
    CS-DSDMDB09MF-010 Amphenol Cables on Demand Amphenol CS-DSDMDB09MF-010 9-Pin (DB9) Deluxe D-Sub Cable - Copper Shielded - Male / Female 10ft Datasheet

    COPPER BOND WIRE AMKOR Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    copper wire datasheet

    Abstract: copper wire 1mm Amkor Technology ATP3 ATP1 au wire copper bond wire copper bond wire amkor
    Text: solution copper wire bonding technology Copper Cu Wire Bonding Copper (Cu) wire has long been used as a method of connecting a silicon die to the package terminals. With the recent increase in gold (Au) wire cost, Cu wire is an attractive way to manage overall package cost.


    Original     		PDF

    DS7409HGB

    Abstract: DS7409HG FCCSP DS-7409HG HL832 nx-a HL832 E700G
    Text: Data Sheet LAMINATE FlipStack CSP Features FlipStack® CSP The FlipStack CSP family utilizes Amkor's industry leading ChipArray® Ball Grid Array CABGA manufacturing capabilities, in combination with Amkor's fcCSP technology. This broad high volume infrastructure enables the rapid deployment of


    Original     		PDF DS820C DS7409HGB DS7409HG FCCSP DS-7409HG HL832 nx-a HL832 E700G

    aec-q100

    Abstract: AEC-Q100-011 G700K TSMC 1P4M MAX1782ETM tsmc cmos 0.11 um tsmc cmos model AC07X-1Z AB8200T MAX1782
    Text: Automotive Qualification Report MAX7042ATJ+ 308MHz/315MHz/ 418MHz/433.92MHz Low-Power, FSK Superheterodyne Receiver Grade 1 32-Lead TQFN 5 x 5 mm AEC-Q100 Rev. F Tests MSL 1 - Preconditioning PC Biased HAST (HAST) 9 9 9 Lot # 2 (Q43ACQ001B) MAX1499EHJ Maxim


    Original     		PDF MAX7042ATJ+ 308MHz/315MHz/ 418MHz/433 92MHz 32-Lead AEC-Q100 QYK0BQ001D) MAX7042ATJ AEC-Q100 LF12Z AEC-Q100-011 G700K TSMC 1P4M MAX1782ETM tsmc cmos 0.11 um tsmc cmos model AC07X-1Z AB8200T MAX1782

    Untitled

    Abstract: No abstract text available
    Text: solution copper wire bonding technology Copper Cu Wire Bonding Copper (Cu) wire has long been used as a method of connecting a silicon die to the package terminals. With the recent increase in gold (Au) wire cost, Cu wire is an attractive way to manage overall package cost.


    Original     		PDF 40mil 55/60nm 45/40nm 28/22nm

    Sumitomo G700K

    Abstract: sumitomo 6600h Compound c7025 JESD22-B101 Nitto MP8000 G700K SUMITOMO-G600 epoxy 8290 ablebond ablestik 8290 SUMITOMO g600 UL
    Text: 8/29/2006 RELIABILITY REPORT FOR DS1077, Rev C2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : [email protected]


    Original     		PDF DS1077, JESD78, Sumitomo G700K sumitomo 6600h Compound c7025 JESD22-B101 Nitto MP8000 G700K SUMITOMO-G600 epoxy 8290 ablebond ablestik 8290 SUMITOMO g600 UL

    ABLEBOND

    Abstract: No abstract text available
    Text: 8/29/2006 RELIABILITY REPORT FOR DS1086L, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : [email protected]


    Original     		PDF DS1086L, JESD78, ABLEBOND

    G700K

    Abstract: Nitto MP8000 Sumitomo G600 Sumitomo G700K JESD78 sumitomo 6600h Compound c7025 JESD-78 BCB4026
    Text: 8/29/2006 RELIABILITY REPORT FOR DS1077L, Rev C2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : [email protected]


    Original     		PDF DS1077L, JESD78, G700K Nitto MP8000 Sumitomo G600 Sumitomo G700K JESD78 sumitomo 6600h Compound c7025 JESD-78 BCB4026

    Nitto MP8000

    Abstract: Sumitomo G700K g700k JESD78 JESD-78 sumitomo 6600h ablebond ablestik BCB4026
    Text: 8/29/2006 RELIABILITY REPORT FOR DS1086, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : [email protected]


    Original     		PDF DS1086, JESD78, Nitto MP8000 Sumitomo G700K g700k JESD78 JESD-78 sumitomo 6600h ablebond ablestik BCB4026

    Sumitomo G700K

    Abstract: SUMITOMO g600 Ablestik 84-1 sumitomo 6600h G700K
    Text: 8/29/2006 RELIABILITY REPORT FOR DS1094L, Rev A3 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : [email protected]


    Original     		PDF DS1094L, JESD78, Sumitomo G700K SUMITOMO g600 Ablestik 84-1 sumitomo 6600h G700K

    mark a7 sot23

    Abstract: J-STD-20A atec 6710S CDA194 mp8000
    Text: 08/23/2004 RELIABILITY REPORT FOR DS1816, Rev A7 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : [email protected]


    Original     		PDF DS1816, JESD78, mark a7 sot23 J-STD-20A atec 6710S CDA194 mp8000

    CDA194

    Abstract: mark a7 sot23
    Text: 08/23/2004 RELIABILITY REPORT FOR DS1810, Rev A7 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : [email protected]


    Original     		PDF DS1810, JESD78, CDA194 mark a7 sot23

    LMISR4

    Abstract: No abstract text available
    Text: 08/23/2004 RELIABILITY REPORT FOR DS1811, Rev A7 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : [email protected]


    Original     		PDF DS1811, JESD78, LMISR4

    CDA194

    Abstract: mark a7 sot23 mold compound
    Text: 08/23/2004 RELIABILITY REPORT FOR DS1817, Rev A7 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : [email protected]


    Original     		PDF DS1817, JESD78, CDA194 mark a7 sot23 mold compound

    Untitled

    Abstract: No abstract text available
    Text: 08/23/2004 RELIABILITY REPORT FOR DS1818, Rev A6 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : [email protected]


    Original     		PDF DS1818, JESD78,

    Ablebond 84-1 LMISR4

    Abstract: No abstract text available
    Text: 08/23/2004 RELIABILITY REPORT FOR DS1812, Rev A7 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : [email protected]


    Original     		PDF DS1812, JESD78, Ablebond 84-1 LMISR4

    Untitled

    Abstract: No abstract text available
    Text: 08/23/2004 RELIABILITY REPORT FOR DS1813, Rev A6 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : [email protected]


    Original     		PDF DS1813, JESD78,

    sumitomo G700

    Abstract: sumitomo epoxy 1076 0038 tsop ablebond Sumitomo 1076 8361J Compound c7025 Die Attach epoxy stamping sumitomo g700 type g700 mold compound
    Text: 10/29/2004 PACKAGE RELIABILITY REPORT FOR 32 TSOP 8mm Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : [email protected]


    Original     		PDF

    LMISR4

    Abstract: J-STD20A J-STD-20A ablebond copper bond wire copper bond wire amkor ti 9841
    Text: 01/12/05 RELIABILITY REPORT FOR DS1685, Rev B2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Don Lipps Staff Reliability Engineer Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : [email protected]


    Original     		PDF DS1685, LMISR4 J-STD20A J-STD-20A ablebond copper bond wire copper bond wire amkor ti 9841

    JESD78

    Abstract: Sumitomo 6730B Compound c7025 RH-1750
    Text: 05/04/2004 RELIABILITY REPORT FOR DS2770, Rev A4 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : [email protected]


    Original     		PDF DS2770, reliabilit50C JESD78 Sumitomo 6730B Compound c7025 RH-1750

    cu pillar

    Abstract: pillar amkor amkor flip flip chip 106A led flip-chip 1000X f2f chip Amkor Technology
    Text: Copper pillar bump is a next generation flip chip interconnect which offers advantages in many designs while meeting current and future ROHS requirements. It is an excellent interconnect choice for applications such as Transceivers, Embedded Processors, Application Processors, Power


    Original     		PDF C/125 1000X 1000hrs cu pillar pillar amkor amkor flip flip chip 106A led flip-chip 1000X f2f chip Amkor Technology

    Untitled

    Abstract: No abstract text available
    Text: Data Sheet LEADFRAME CABGA/fBGA Features ChipArray Packages Amkor’s ChipArray® Ball Grid Array CABGA packages are laminate based packages that are compatible with SMT mounting processes worldwide. The near chip size CABGA fine-pitch BGA (fBGA) offers a


    Original     		PDF DS550R

    Untitled

    Abstract: No abstract text available
    Text: 08/23/2004 RELIABILITY REPORT FOR DS80C310, D2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : [email protected]


    Original     		PDF DS80C310, JESD78,

    cu pillar

    Abstract: Amkor Technology amkor flip PoP PACKAGE TESTING
    Text: Copper pillar bump is a next generation flip chip interconnect which offers advantages in many designs while meeting current and future ROHS requirements. It is an excellent interconnect choice for applications such as Transceivers, Embedded Processors, Application Processors, Power


    Original     		PDF 1000hrs cu pillar Amkor Technology amkor flip PoP PACKAGE TESTING

    PA168

    Abstract: A3PE3000L-1PQ208I A3P400-1FG144
    Text: January 22, 2013 PCN Number: 1201B PCN Change Level: Major Subject: Amended PCN1201 – Product Conversion to Copper Wire palladium coated copper wire Reference: PCN1201A, issued May 25, 2012 Dear Customer, This notice is to inform you that Microsemi SoC Products Group has successfully


    Original     		PDF 1201B PCN1201 PCN1201A, useNG68 AGLN010V2-QNG48I AGLN020V2-QNG68 AGLN030V2-ZQNG68I AGLN010V5-QNG48 AGLN020V2-QNG68I AGL030V5-QNG48 PA168 A3PE3000L-1PQ208I A3P400-1FG144